Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XC3S50-5PQG208C: Xilinx Spartan-3 FPGA – Full Specifications & Buyer’s Guide

Product Details

The XC3S50-5PQG208C is a high-performance, cost-effective Field-Programmable Gate Array (FPGA) from Xilinx’s Spartan-3 family. Manufactured on advanced 90nm CMOS process technology, this device delivers 50,000 system gates in a compact 208-pin PQFP package — making it one of the most popular entry-level Xilinx FPGA solutions for commercial and industrial designs.

Whether you are designing embedded control systems, digital signal processing pipelines, or communication interfaces, the XC3S50-5PQG208C offers an excellent balance of logic density, I/O flexibility, and clock management capability at a competitive price point.


What Is the XC3S50-5PQG208C?

The XC3S50-5PQG208C belongs to the Spartan-3 FPGA family, an eight-member product line specifically engineered for high-volume, cost-sensitive consumer and industrial electronic applications. The “-5” speed grade designates this as the highest-performance variant within the XC3S50 series, operating at up to 725 MHz internal clock frequency.

The “PQG208” in the part number identifies the 208-pin Plastic Quad Flat Pack (PQFP) Pb-free package, and the trailing “C” confirms commercial temperature range operation (0°C to 85°C).


XC3S50-5PQG208C Key Specifications

Core Device Parameters

Parameter Value
Part Number XC3S50-5PQG208C
Family Spartan-3
Manufacturer Xilinx (AMD)
System Gates 50,000
Equivalent Logic Cells 1,728
CLB Array 16 × 12 (192 CLBs)
CLB Flip-Flops 1,536
Maximum Distributed RAM 12 Kbits

Memory Resources

Resource Value
Block RAM 72 Kbits total
Block RAM Columns 1
18 Kbit RAM Blocks 4
Dedicated Multipliers (18×18) 4

Clock Management

Parameter Value
Digital Clock Managers (DCMs) 2
Maximum Internal Clock Speed 725 MHz

I/O and Package

Parameter Value
Package Type PQFP (Plastic Quad Flat Pack), Pb-free
Package Code PQG208
Total Pins 208
Maximum User I/O Pins 124
Differential I/O Pairs 56

Electrical and Environmental

Parameter Value
Core Supply Voltage (VCCINT) 1.2V
I/O Supply Voltage (VCCO) 1.2V – 3.3V
Process Technology 90nm CMOS
Temperature Grade Commercial (C)
Operating Temperature Range 0°C to +85°C
RoHS Compliance Yes (Pb-free, “G” suffix)

XC3S50-5PQG208C Speed Grade Comparison

The Spartan-3 XC3S50 in the PQG208 package is available in three speed grades. The table below compares them to help you choose the right variant for your design:

Speed Grade Part Number Max Freq. Temp. Grade Best For
-4 (Standard) XC3S50-4PQG208C ~630 MHz Commercial Cost-sensitive designs
-5 (High Performance) XC3S50-5PQG208C 725 MHz Commercial High-speed applications
-5 (High Performance) XC3S50-5PQG208I 725 MHz Industrial Harsh environments

XC3S50-5PQG208C Architecture Overview

Configurable Logic Blocks (CLBs)

The XC3S50-5PQG208C contains 192 Configurable Logic Blocks arranged in a 16×12 array. Each CLB consists of four slices, and each slice contains two 4-input Look-Up Tables (LUTs) and two storage elements (flip-flops or latches). This architecture enables efficient implementation of combinatorial logic, arithmetic functions, and state machines.

Block RAM

The device integrates 4 × 18 Kbit dual-port Block RAM blocks, totaling 72 Kbits of on-chip memory. The dual-port structure allows simultaneous read and write access from two independent buses — ideal for FIFO buffers, lookup tables, and local data storage without consuming distributed LUT resources.

Dedicated Multipliers

Four 18×18-bit dedicated hardware multipliers are embedded alongside the Block RAM. These accelerate DSP operations such as filtering, correlation, and arithmetic without occupying general-purpose CLB resources, significantly boosting multiply-intensive designs.

Digital Clock Managers (DCMs)

Two Digital Clock Managers provide flexible, zero-skew clock distribution. DCMs support frequency synthesis, phase shifting, and duty-cycle correction, enabling reliable clocking across the entire device fabric.

I/O Blocks (IOBs)

The 208-pin PQG package exposes up to 124 user-configurable I/O pins supporting a wide variety of single-ended and differential I/O standards, including LVTTL, LVCMOS (1.2V–3.3V), SSTL, HSTL, LVDS, LVPECL, and more. Digitally Controlled Impedance (DCI) is available on supported banks for on-chip termination.


Supported I/O Standards

Standard Type Supported Standards
Single-Ended LVTTL, LVCMOS3.3, LVCMOS2.5, LVCMOS1.8, LVCMOS1.5, LVCMOS1.2, PCI, GTL
Differential LVDS, LVPECL, BLVDS, ULVDS, RSDS
Memory Interface SSTL2 (I/II), SSTL18 (I/II), HSTL (I/II/III/IV)
Termination DCI (Digitally Controlled Impedance)

Configuration Modes

The XC3S50-5PQG208C supports multiple configuration methods, giving designers flexibility in how the FPGA loads its bitstream at power-up:

Mode Description
Master Serial FPGA drives SCK; configuration from serial Flash (e.g., SPI Flash)
Slave Serial External controller drives SCK and serial data
Master Parallel (SelectMAP) FPGA drives configuration bus from parallel Flash
Slave Parallel (SelectMAP) External processor writes configuration over parallel bus
JTAG (Boundary Scan) IEEE 1149.1-compliant JTAG for programming and debug

Configuration data is stored in reprogrammable static CMOS configuration latches (CCLs), making the device infinitely re-programmable during development and in the field.


Development Tools for XC3S50-5PQG208C

The XC3S50-5PQG208C is supported by the following Xilinx/AMD design tools:

Tool Usage
Xilinx ISE Design Suite Primary synthesis, implementation, and bitstream generation tool for Spartan-3
ModelSim / XSIM HDL simulation (VHDL, Verilog)
iMPACT Programming and configuration via JTAG
ChipScope Pro In-system logic analysis
CORE Generator IP core instantiation (FIFO, DCM, multipliers, etc.)

Note: Vivado Design Suite does not support Spartan-3 devices. ISE Design Suite (version 14.7 or later) is recommended for all XC3S50 designs.


Typical Applications of XC3S50-5PQG208C

The XC3S50-5PQG208C is well-suited for a broad range of embedded and digital design applications:

Application Area Use Case
Industrial Automation PLC I/O expansion, motion control interfaces
Communications UART, SPI, I²C, Ethernet MAC controllers
Signal Processing FIR/IIR filters, FFT accelerators
Consumer Electronics Display controllers, keyboard/mouse interfaces
Automotive Electronics Body control modules, sensor interface logic
Prototyping & Education FPGA learning boards, digital design labs
Test & Measurement Logic analyzers, protocol decoders

Ordering Information & Part Number Decoder

Understanding the XC3S50-5PQG208C part number is straightforward:

Field Code Meaning
Device XC3S50 Spartan-3, 50K system gates
Speed Grade -5 Highest performance (-4, -5)
Package PQ Plastic Quad Flat Pack (PQFP)
Pb-free G RoHS-compliant, lead-free solder
Pin Count 208 208 total pins
Temp Grade C Commercial (0°C to +85°C)

XC3S50-5PQG208C vs. Related Spartan-3 Devices

Parameter XC3S50 XC3S200 XC3S400
System Gates 50K 200K 400K
Logic Cells 1,728 4,320 8,064
Block RAM 72 Kbits 216 Kbits 288 Kbits
Multipliers 4 12 16
DCMs 2 4 4
Max User I/O (PQ208) 124 141 173
Core Voltage 1.2V 1.2V 1.2V

Why Choose the XC3S50-5PQG208C?

  • Proven architecture: The Spartan-3 family is a mature, battle-tested platform with an extensive ecosystem of reference designs, application notes, and community support.
  • High-speed grade: The “-5” speed grade delivers the fastest timing performance available in the XC3S50 lineup, essential for designs with tight setup and hold time margins.
  • Lead-free packaging: The “G” suffix confirms RoHS compliance, making this part suitable for products targeting European and global markets.
  • Rich I/O flexibility: Support for over 20 single-ended and differential I/O standards in a single device reduces external component count.
  • Cost-effective prototyping: At 50K gates, the XC3S50-5PQG208C is ideal for proof-of-concept and low-gate-count production designs without overpaying for unused resources.

Frequently Asked Questions

Q: What is the difference between XC3S50-5PQG208C and XC3S50-4PQG208C? The only difference is the speed grade. The “-5” variant is the higher-performance version, rated at 725 MHz compared to approximately 630 MHz for the “-4” grade. Both use the same 208-pin Pb-free PQFP package and commercial temperature range.

Q: Is the XC3S50-5PQG208C RoHS compliant? Yes. The “G” in the package code (PQG208) confirms this is a lead-free, RoHS-compliant device.

Q: What programming software is required for XC3S50-5PQG208C? Xilinx ISE Design Suite 14.7 is the recommended tool. Vivado does not support Spartan-3 devices.

Q: What is the core supply voltage? The XC3S50-5PQG208C requires a 1.2V core supply (VCCINT). I/O banks support 1.2V to 3.3V depending on the selected I/O standard.

Q: Can the XC3S50-5PQG208C be used in industrial temperature applications? This “C” (commercial) grade part is rated from 0°C to +85°C. For industrial temperature operation (-40°C to +100°C), use the XC3S50-5PQG208I instead.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.