Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC3S50-5PQ208C: Xilinx Spartan-3 FPGA – Complete Product Guide

Product Details

The XC3S50-5PQ208C is a field-programmable gate array (FPGA) from Xilinx’s Spartan-3 family, now under AMD ownership. Designed for high-volume, cost-sensitive applications, it combines 50,000 system gates with a 208-pin Plastic Quad Flat Pack (PQFP) package and a commercial temperature rating. The “-5” speed grade makes it one of the fastest options in this family, ideal for demanding digital logic designs.

Whether you are building embedded systems, digital signal processing circuits, or custom logic controllers, the XC3S50-5PQ208C offers a compelling balance of density, speed, and affordability. As part of the broader Xilinx FPGA ecosystem, it benefits from mature toolchain support and a vast community knowledge base.


XC3S50-5PQ208C Key Specifications at a Glance

Parameter Value
Part Number XC3S50-5PQ208C
Manufacturer Xilinx (AMD)
FPGA Family Spartan-3
Logic Cells 1,728
System Gates 50,000
CLB Slices 768
Distributed RAM 12 Kb
Block RAM 72 Kb
Multipliers (18×18) 4
DCM Blocks 2
Max User I/O 124
Package PQ208 (PQFP)
Package Pins 208
Speed Grade -5 (Fastest)
Operating Voltage (VCCINT) 1.2 V
I/O Voltage 1.2 V – 3.3 V
Temperature Range 0°C to +85°C (Commercial)
RoHS Compliant Yes

What Is the XC3S50-5PQ208C? Overview and Family Background

Spartan-3 FPGA Family

The Spartan-3 series was introduced by Xilinx to address the growing demand for low-cost, programmable logic in consumer electronics, industrial controls, and communications infrastructure. It was the first FPGA family built on a 90 nm process node, which allowed Xilinx to deliver significantly more logic at a lower price point compared to its predecessors.

The XC3S50-5PQ208C sits at the entry level of the Spartan-3 family in terms of gate count, but its -5 speed grade designation places it at the top of the performance tier within this device size. The “C” suffix confirms the commercial temperature range (0°C to +85°C), which covers the vast majority of non-military and non-automotive applications.

PQ208 Package Explained

The PQ208 (208-pin Plastic Quad Flat Pack) is a through-hole-compatible surface-mount package with leads on all four sides. It offers a practical board footprint for prototyping and production alike. With 124 user-configurable I/O pins available in this package, designers have substantial flexibility to interface with external memory, sensors, communication buses, and other peripherals.


XC3S50-5PQ208C Detailed Electrical Specifications

Power Supply Requirements

Supply Rail Voltage Purpose
VCCINT 1.2 V Core logic power
VCCO 1.2 V – 3.3 V I/O bank power
VCCAUX 2.5 V Auxiliary circuits (DLL, DCM)

The VCCINT rail at 1.2 V reflects the 90 nm process and contributes to the device’s low static and dynamic power consumption, which is advantageous in battery-powered or thermally constrained designs.

I/O Standards Supported

I/O Standard Description
LVTTL Low-voltage TTL, 3.3 V
LVCMOS 3.3 / 2.5 / 1.8 / 1.5 / 1.2 Multi-voltage CMOS
SSTL2 / SSTL3 Stub Series Terminated Logic
HSTL High-Speed Transceiver Logic
GTL / GTL+ Gunning Transceiver Logic
PCI (3.3 V) Peripheral Component Interconnect
LVDS Low Voltage Differential Signaling
BLVDS Bus LVDS

The support for LVDS and differential I/O makes the XC3S50-5PQ208C well suited to noise-sensitive or high-speed serial interface applications.


Internal Architecture: Logic Resources Deep Dive

Configurable Logic Blocks (CLBs)

The XC3S50-5PQ208C contains 768 CLB slices, each consisting of two slices. Every slice includes:

  • Two 4-input look-up tables (LUTs)
  • Two storage elements (flip-flops or latches)
  • Fast carry and arithmetic logic
  • Wide function multiplexers

This architecture enables efficient implementation of counters, state machines, data paths, and arithmetic operations.

Block RAM (BRAM)

Resource Amount
Block RAM Total 72 Kb
Individual BRAM Size 18 Kb (true dual-port)
Number of BRAM Blocks 4

Each BRAM block supports true dual-port operation with independent read/write clocks, configurable data widths from 1 to 18 bits, and optional built-in error correction. These features make BRAM ideal for FIFOs, lookup tables, and small embedded memories.

Distributed RAM

In addition to block RAM, the CLB LUTs can be configured as 12 Kb of distributed RAM, useful for small, fast storage close to logic elements — minimizing routing delay.

Hardware Multipliers

The device includes four dedicated 18×18-bit hardware multipliers, each capable of computing a 36-bit product in a single clock cycle. These multipliers are essential for DSP operations such as digital filters, correlation, and signal processing pipelines.

Digital Clock Manager (DCM)

Resource Count
DCM Blocks 2
Clock Outputs per DCM Up to 8
Frequency Synthesis Yes
Phase Shifting Yes (fine/coarse)

The two DCMs enable precise clock management including frequency synthesis, phase alignment, duty-cycle correction, and clock deskewing — all without external PLL ICs.


Speed Grade -5: Performance Characteristics

The “-5” speed grade is the fastest available for the XC3S50 device. Higher negative numbers indicate faster propagation times across Xilinx Spartan-3 devices.

Parameter XC3S50-5 Typical Value
Maximum Logic Frequency ~200 MHz (internal registers)
LUT Propagation Delay ~0.7 ns
Clock-to-Output (Tco) ~3.5 ns
Setup Time (Tsu) ~0.9 ns
Input/Output Delay Varies by I/O standard

Exact timing values are defined in the official Xilinx Spartan-3 data sheet and must be verified using Xilinx ISE or Vivado timing analysis tools.


Configuration Modes

The XC3S50-5PQ208C supports multiple configuration methods to suit different production and prototyping workflows:

Mode Description Typical Use Case
Master Serial FPGA drives clock; reads bitstream from serial Flash Low pin count, simple designs
Slave Serial External device drives the configuration clock Multi-device chains
Master SPI Reads from SPI Flash memory Cost-effective production
Master BPI Parallel NOR Flash interface Faster configuration
JTAG IEEE 1149.1 boundary scan Debug, in-system programming
Slave Parallel External parallel data source Custom loaders

The JTAG interface is available on all modes simultaneously, allowing in-circuit debugging without interrupting normal operation.


Development Tools and Software Support

Xilinx ISE Design Suite

The XC3S50-5PQ208C is fully supported by Xilinx ISE Design Suite (versions up to 14.7, the final release). ISE provides:

  • VHDL and Verilog synthesis (via XST)
  • Place-and-route (PAR)
  • Static timing analysis
  • iMPACT for device programming

ISE 14.7 is available free of charge from the AMD/Xilinx website and runs on Windows and Linux.

IP Cores and Reference Designs

Xilinx provides a rich library of pre-verified IP cores compatible with the Spartan-3 family, including UART, SPI, I2C, FIFO generators, memory controllers, and soft-core processors such as the MicroBlaze and PicoBlaze.


Typical Applications for XC3S50-5PQ208C

The XC3S50-5PQ208C is widely used across industries due to its combination of speed, I/O flexibility, and price efficiency:

Application Area Example Use Cases
Industrial Automation Motor control, sensor interfacing, PLC logic
Communications Protocol bridging, UART/SPI/I2C controllers
Consumer Electronics Display controllers, LED matrix drivers
Test & Measurement Signal capture, logic analysis, pattern generation
Embedded Systems Custom processor peripherals, glue logic
Education FPGA learning kits, digital design courses
Medical Devices Low-power signal processing, timing circuits

XC3S50-5PQ208C vs. Related Part Numbers

Understanding the part number structure helps when comparing alternatives within the Spartan-3 family:

Part Number Gates Package Speed Grade Temp Range
XC3S50-4PQ208C 50K PQ208 -4 Commercial
XC3S50-5PQ208C 50K PQ208 -5 Commercial
XC3S50-5PQ208I 50K PQ208 -5 Industrial
XC3S200-5PQ208C 200K PQ208 -5 Commercial
XC3S400-5PQ208C 400K PQ208 -5 Commercial

If your design requires a wider temperature range (−40°C to +85°C), consider the XC3S50-5PQ208I industrial variant. For more logic resources in the same PQ208 footprint, the XC3S200 and XC3S400 are pin-compatible upgrade paths.


PCB Design Considerations

Decoupling Capacitors

Proper decoupling is critical for reliable FPGA operation. Recommended practice:

  • Place 100 nF ceramic capacitors (X7R or C0G) at each VCCINT and VCCO pin
  • Add a 10 µF bulk capacitor per power rail on the PCB
  • Keep decoupling traces as short as possible with ground vias adjacent to each capacitor

PCB Layer Requirements

Consideration Recommendation
Minimum PCB Layers 4 (2 signal + power + ground)
Signal Integrity Route high-speed I/O with controlled impedance
Ground Plane Continuous ground plane beneath the device
JTAG Access Expose TCK, TMS, TDI, TDO, GND for debug header

Thermal Management

The XC3S50-5PQ208C in commercial grade operates at an ambient range of 0°C to +85°C. The device has low power consumption, so passive cooling (no heatsink) is typically sufficient at moderate utilization. For high utilization or enclosed environments, verify junction temperature using the power estimator tool from AMD/Xilinx.


Ordering Information

Field Detail
Full Part Number XC3S50-5PQ208C
Manufacturer AMD (formerly Xilinx)
Package 208-PQFP
Temperature Grade Commercial (0°C to +85°C)
Lead Finish Matte Tin (RoHS compliant)
Status Mature / Production

Note: The XC3S50-5PQ208C is a mature product. Confirm availability and lead times with your distributor before placing large production orders.


Frequently Asked Questions (FAQ)

Q: What is the difference between XC3S50-4PQ208C and XC3S50-5PQ208C?
The only difference is the speed grade. The “-5” version is faster, with lower propagation delays and higher maximum operating frequencies. If timing closure is critical, the -5 grade provides more margin.

Q: Can I use Vivado to program the XC3S50-5PQ208C?
No. Vivado does not support Spartan-3 devices. You must use Xilinx ISE 14.7, which is the final and free version available from the AMD/Xilinx download center.

Q: Is the XC3S50-5PQ208C suitable for PCI bus interfaces?
Yes, the device supports 3.3 V PCI I/O standards and can be used to implement PCI logic, though you should verify timing requirements against the PCI specification using ISE timing analysis.

Q: What configuration memory should I use with this FPGA?
Xilinx recommends its XCF series Platform Flash for SPI and BPI mode configuration. Third-party SPI Flash memories compatible with the Serial Peripheral Interface standard also work in Master SPI mode.

Q: Is the XC3S50-5PQ208C pin-compatible with larger Spartan-3 devices?
Yes. The Spartan-3 family is designed with migration paths. Devices in the PQ208 package (XC3S50, XC3S200, XC3S400) are functionally pin-compatible, allowing design upgrades with minimal PCB changes.


Summary

The XC3S50-5PQ208C remains a practical choice for designers needing a fast, low-cost, and well-supported FPGA in a standard PQFP footprint. With 50,000 system gates, 124 user I/Os, dual DCMs, dedicated hardware multipliers, and the fastest “-5” speed grade in its class, it covers a broad range of digital logic and embedded applications. Its maturity in the market means extensive documentation, community support, and proven design patterns are readily available — reducing development risk for new and experienced designers alike.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.