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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XC3S50-4VQG100C: Xilinx Spartan-3 FPGA — Full Specifications & Buyer’s Guide

Product Details

The XC3S50-4VQG100C is a low-cost, high-performance field-programmable gate array (FPGA) from the Xilinx Spartan-3 family, now part of AMD’s portfolio. Designed for cost-sensitive, high-volume applications, this device delivers 50,000 system gates in a compact 100-pin VQFP package, making it an ideal choice for embedded control, digital signal processing, and I/O expansion tasks. Whether you’re a design engineer sourcing components or a procurement specialist comparing FPGA options, this guide covers everything you need to know about the XC3S50-4VQG100C.


What Is the XC3S50-4VQG100C?

The XC3S50-4VQG100C belongs to Xilinx’s Spartan-3 FPGA series — a family engineered to offer programmable logic at the lowest possible system cost. The part number breaks down as follows:

  • XC3S50 — Spartan-3 series, 50K system gate density
  • -4 — Speed grade (faster timing performance)
  • VQG100 — 100-pin Plastic Very-Thin Quad Flat Pack (VQFP) package
  • C — Commercial temperature range (0°C to +85°C)

As a Xilinx FPGA, the XC3S50 leverages proven 90nm process technology to combine abundant logic resources, dedicated multipliers, and block RAM into a single, reprogrammable device.


XC3S50-4VQG100C Key Specifications

General Device Parameters

Parameter Value
Manufacturer AMD (Xilinx)
Series Spartan-3
Part Number XC3S50-4VQG100C
System Gates 50,000
Logic Cells 1,728
CLB (Configurable Logic Blocks) 192
CLB Slices 768
Distributed RAM 12 Kb
Block RAM 72 Kb
Dedicated Multipliers (18×18) 4
DCM (Digital Clock Manager) 2

Package & Mechanical Specifications

Parameter Value
Package Type VQFP (Very-Thin Quad Flat Pack)
Package Code VQG100
Pin Count 100
Maximum User I/O Pins 63
I/O Standards Supported LVTTL, LVCMOS 1.2V–3.3V, SSTL, HSTL, PCI, GTL+
Mounting Type Surface Mount
Operating Temperature 0°C to +85°C (Commercial)

Electrical Characteristics

Parameter Value
Core Voltage (VCCINT) 1.2 V
I/O Voltage (VCCAUX) 3.3 V
Speed Grade -4
Maximum System Clock (fMAX) Up to ~200+ MHz (design-dependent)
Configuration Interfaces JTAG, Master/Slave Serial, SelectMAP

XC3S50-4VQG100C Logic Resources Breakdown

Understanding the internal architecture helps you evaluate whether this FPGA is right for your design.

Configurable Logic Blocks (CLBs)

The Spartan-3 CLB contains four slices, and each slice contains two 4-input LUTs (Look-Up Tables), two flip-flops, carry logic, and multiplexers. This structure gives the XC3S50 the following distributed logic resources:

Resource Count
CLBs 192
Slices 768
4-Input LUTs 1,536
Flip-Flops 1,536
Max Distributed RAM 12 Kb

Block RAM (BRAM)

The device includes two 18 Kb block RAM primitives that can be used as single-port or true dual-port memory, FIFOs, or shift registers — giving designers 36 Kb total of on-chip storage.

BRAM Parameter Value
Number of BRAMs 2
BRAM Size (each) 18 Kb
Total Block RAM 36 Kb (72 Kb with parity bits)
FIFO Support Yes

Digital Clock Managers (DCMs)

The two on-chip DCMs provide clock synthesis, phase shifting, frequency multiplication, and deskew capabilities — simplifying multi-clock domain designs without external PLLs.


XC3S50-4VQG100C I/O Capabilities

With 63 user I/O pins available on the 100-pin package, the XC3S50-4VQG100C supports a broad range of single-ended and differential I/O standards.

Supported I/O Standards

Standard Voltage
LVTTL 3.3 V
LVCMOS 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V
SSTL2 / SSTL3 2.5 V / 3.3 V
HSTL 1.5 V
PCI 3.3 V
GTL / GTL+

Each I/O block includes individually programmable drive strength, slew rate control, pull-up/pull-down resistors, and optional keeper circuits.


Configuration Options for XC3S50-4VQG100C

The XC3S50-4VQG100C is a volatile FPGA that requires configuration on every power-up. It supports several industry-standard configuration modes:

Mode Description
Master Serial Loads bitstream from external SPI Flash
Slave Serial Driven by an external controller
Master SelectMAP Byte-wide parallel configuration
Slave SelectMAP Parallel config driven externally
JTAG (Boundary Scan) For debugging and direct programming

A companion PROM (such as the XCF01S or XCF02S) is commonly used to store the configuration bitstream for automatic loading on power-up.


Ordering Information & Product Variants

The XC3S50 is available in multiple speed grades, package types, and temperature ranges. The table below shows common ordering variants to help you select the right part.

Part Number Speed Grade Package Pins Temp Range User I/O
XC3S50-4VQG100C -4 VQFP 100 Commercial (0–85°C) 63
XC3S50-5VQG100C -5 VQFP 100 Commercial (0–85°C) 63
XC3S50-4PQG208C -4 PQFP 208 Commercial (0–85°C) 124
XC3S50-4TQG144C -4 TQFP 144 Commercial (0–85°C) 97
XC3S50-4VQG100I -4 VQFP 100 Industrial (−40–100°C) 63

Note: The -4 speed grade in the XC3S50-4VQG100C denotes a mid-range timing performance tier within the Spartan-3 family. The higher the speed grade number, the faster the device.


Typical Applications of the XC3S50-4VQG100C

The Spartan-3 XC3S50’s combination of low cost, sufficient logic density, and rich I/O makes it well-suited for:

#### Embedded Control Systems

Replace fixed-function ASICs or MCUs with a reconfigurable logic block that can implement custom state machines, PWM controllers, and peripheral interfaces.

#### Industrial I/O Expansion

Act as a glue logic device to bridge multiple bus protocols (SPI, I²C, UART, parallel buses) in industrial automation and instrumentation designs.

#### Digital Signal Processing (DSP)

Leverage the four 18×18 dedicated multipliers and block RAM to implement FIR filters, FFT stages, or correlators in radar, sonar, or audio processing systems.

#### Prototyping & Academic Projects

The affordable price point and compact VQFP package make the XC3S50-4VQG100C a popular choice for university lab boards and rapid design prototyping.

#### Communication Interface Bridging

Implement custom protocol converters and bus translators between incompatible interfaces in telecom line cards, network appliances, and test equipment.


Design Tools & Development Support

Xilinx (AMD) provides comprehensive EDA tool support for the XC3S50-4VQG100C:

Tool Description
ISE Design Suite Legacy Xilinx toolchain for Spartan-3 synthesis, P&R, and timing analysis
ChipScope Pro On-chip logic analyzer for real-time debugging
CORE Generator IP core generator for standard functions (FIFOs, memory controllers, etc.)
XST Xilinx Synthesis Technology for HDL synthesis
iMPACT Bitstream programming and JTAG configuration tool

HDL support includes both VHDL and Verilog, and third-party synthesis tools such as Synopsys Synplify and Mentor Precision are also compatible.


XC3S50-4VQG100C vs. Other Spartan-3 Devices

Choosing the right Spartan-3 variant depends on your logic and I/O requirements. Here’s how the XC3S50 compares to neighboring members of the family:

Device System Gates Logic Cells Block RAM Multipliers Max User I/O
XC3S50 50,000 1,728 72 Kb 4 124 (208-pin)
XC3S200 200,000 4,320 216 Kb 12 173 (208-pin)
XC3S400 400,000 8,064 288 Kb 16 264 (320-pin)
XC3S1000 1,000,000 17,280 432 Kb 24 391 (456-pin)

For the most resource-constrained designs where board area and cost are the primary drivers, the XC3S50-4VQG100C in the 100-pin VQFP package remains one of the most compact and economical FPGA solutions available.


Compliance & Regulatory Information

Attribute Status
RoHS Compliance RoHS Compliant
Moisture Sensitivity Level (MSL) 3 (Per IPC/JEDEC J-STD-020)
REACH Compliance Yes
Export Control (ECCN) 3A001.a.7.b

Frequently Asked Questions (FAQ)

Q: Is the XC3S50-4VQG100C still in production?
The Spartan-3 family has reached end-of-life status with Xilinx/AMD. However, authorized distributors and component suppliers continue to stock the XC3S50-4VQG100C from existing inventory. Always verify availability and date codes with your distributor.

Q: What is the difference between the -4 and -5 speed grades?
The -5 speed grade offers faster propagation delays and higher maximum clock frequencies compared to -4. Choose -5 if your design has tight timing margins; -4 is sufficient for most standard designs.

Q: Can I use Vivado to design for the XC3S50-4VQG100C?
No. Vivado only supports 7-Series and newer Xilinx devices. The Spartan-3 family requires the ISE Design Suite (version 14.7 recommended).

Q: What PROM should I use to configure the XC3S50-4VQG100C?
The XCF01S (1Mb) or XCF02S (2Mb) Platform Flash PROMs from Xilinx are the standard companion configuration devices for the XC3S50, providing non-volatile bitstream storage.

Q: Is the XC3S50-4VQG100C suitable for automotive applications?
The “C” suffix denotes a Commercial temperature range (0°C to +85°C). For automotive or extended environments, consider the “I” industrial grade variant (XC3S50-4VQG100I, rated to −40°C to +100°C), or evaluate the Spartan-3A or newer Spartan-7 families.


Summary

The XC3S50-4VQG100C is a proven, cost-effective FPGA solution that delivers 50K system gates, 63 user I/O pins, 36 Kb block RAM, four 18×18 hardware multipliers, and two digital clock managers in a compact 100-pin VQFP surface-mount package. Backed by robust Xilinx tooling and a wide range of supported I/O standards, it remains a reliable choice for embedded control, protocol bridging, and DSP applications where form factor and economics are critical design constraints.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.