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Notes:
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XC3S50-4CPG132I: Xilinx Spartan-3 FPGA – Full Specifications, Features & Datasheet Guide

Product Details

The XC3S50-4CPG132I is a high-value, industrial-grade Field Programmable Gate Array from the Xilinx Spartan-3 family. Designed for cost-sensitive, high-volume embedded applications, it delivers a compelling blend of logic density, memory resources, and reliable performance in a compact 132-pin Chip-Scale Ball Grid Array (CSBGA) package. Whether you are prototyping an embedded control system or deploying a volume IoT product, this Xilinx FPGA offers the flexibility and feature set that engineers demand.


What Is the XC3S50-4CPG132I?

The XC3S50-4CPG132I is part of the eight-member Spartan-3 family, built on Xilinx’s advanced 90nm process technology. The part number breaks down as follows:

Code Segment Meaning
XC3S50 Spartan-3 family, 50K system gates
-4 Speed grade 4 (Standard Performance)
CPG 132-pin Chip-Scale Package, Pb-free (Green)
132 132-pin count
I Industrial temperature range (–40°C to +100°C)

This device targets embedded designers who need reprogrammable logic with a small PCB footprint and industrial operating range.


XC3S50-4CPG132I Key Specifications at a Glance

Parameter Value
Family Spartan-3
Device XC3S50
System Gates 50,000
Logic Cells 1,728
CLB Array 16 × 12
CLB Flip-Flops 1,536
Maximum Distributed RAM 12 Kb
Block RAM 72 Kb (4 × 18 Kb blocks)
Dedicated Multipliers 4
Digital Clock Managers (DCMs) 2
Maximum I/O Pins 97 (up to 63 user I/Os in CPG132 package)
Maximum Frequency 630 MHz (internal logic)
Core Supply Voltage 1.2V
Process Technology 90nm
Package 132-pin CSBGA (CPG132)
Operating Temperature –40°C to +100°C (Industrial)
RoHS Compliance Pb-free (Green)
Manufacturer AMD / Xilinx
Manufacturer Part Number XC3S50-4CPG132I

XC3S50-4CPG132I Detailed Feature Overview

## Logic Resources: Configurable Logic Blocks (CLBs)

The XC3S50 contains a 16 × 12 array of Configurable Logic Blocks, providing 1,728 logic cells. Each CLB contains four Slices, and each Slice includes two 4-input Look-Up Tables (LUTs), two storage elements (registers or latches), and dedicated carry and arithmetic logic. This architecture supports efficient implementation of combinational and sequential logic, arithmetic functions, and small state machines.

## Memory Architecture: Block RAM and Distributed RAM

The device integrates 72 Kb of dedicated Block RAM across four 18 Kb dual-port RAM blocks. Each block RAM can be configured as a true dual-port memory, enabling simultaneous read and write access from two independent clock domains — ideal for FIFO buffers, look-up tables, and data buffering in embedded systems.

In addition to block RAM, the CLB LUTs can be used as distributed RAM, providing up to 12 Kb of fast, logic-embedded storage without consuming block RAM resources.

Memory Type Capacity Configuration
Block RAM 72 Kb 4 × 18 Kb dual-port
Distributed RAM 12 Kb CLB LUT-based
Total On-Chip RAM 84 Kb

## Dedicated Multipliers for DSP Applications

The XC3S50-4CPG132I includes 4 dedicated 18×18-bit hardware multipliers, each paired with a block RAM. These multipliers perform signed or unsigned 18-bit × 18-bit multiplication with a 36-bit result, offloading compute-intensive tasks from the general logic fabric and enabling efficient DSP, signal processing, and math-heavy designs.

## Digital Clock Management (DCM)

The device provides 2 Digital Clock Managers (DCMs), strategically placed at the ends of the block RAM column. Each DCM supports:

  • Clock multiplication and division
  • Phase shifting (fine and coarse)
  • Frequency synthesis
  • Clock deskew and alignment

DCMs are implemented using the standard DCM primitive in Xilinx ISE or Vivado tools, making clock domain management straightforward in complex designs.

## I/O Bank Architecture and Supported Standards

The XC3S50-4CPG132I supports a wide range of single-ended and differential I/O standards, making it compatible with virtually any system interface. The 132-pin CSBGA package provides up to 63 user I/O pins organized across multiple I/O banks.

Supported I/O Standards

Standard Type Examples
Single-Ended LVTTL, LVCMOS 3.3V / 2.5V / 1.8V / 1.5V
Differential LVDS, LVPECL, BLVDS, ULVDS
Memory Interface SSTL2, SSTL3, HSTL
High-Speed GTL, GTL+

Note: DCI (Digitally Controlled Impedance) signal standards are not supported in Bank 5 for CPG132-packaged devices.


XC3S50-4CPG132I Package Information: 132-Pin CSBGA (CPG132)

The CPG132 package is a 132-ball Chip-Scale Ball Grid Array with a fine pitch layout, enabling a very small PCB footprint — critical for space-constrained designs in industrial controllers, portable devices, and embedded systems.

Package Attribute Detail
Package Type CSBGA (Chip-Scale Ball Grid Array)
Pin Count 132
Package Code CPG132
Lead-Free (Pb-free) Yes (G in CPG)
Temperature Grade I = Industrial (–40°C to +100°C)

Ordering Information and Part Number Decoder

Understanding the Xilinx part numbering system helps ensure you order exactly the right variant for your application.

Field Code Description
Device Family XC3S Spartan-3 Series
Gate Density 50 50,000 system gates
Speed Grade -4 Standard performance
Package Lead Style C Chip-Scale Package (non-Pb-free note: G suffix = Pb-free)
Package Size PG132 132-pin, Pb-free
Temperature Range I Industrial: –40°C to +100°C

Full Part Number: XC3S50-4CPG132I


XC3S50-4CPG132I vs. Related Spartan-3 Variants

When selecting the right Spartan-3 device, it helps to compare closely related variants:

Part Number Gates Package Temp Grade Speed
XC3S50-4CPG132I 50K 132-pin CSBGA Industrial -4
XC3S50-4CPG132C 50K 132-pin CSBGA Commercial -4
XC3S50-5CPG132I 50K 132-pin CSBGA Industrial -5 (High Perf.)
XC3S200-4CPG132I 200K 132-pin CSBGA Industrial -4
XC3S50-4VQG100I 50K 100-pin VQFP Industrial -4

The XC3S50-4CPG132I is the preferred choice for industrial applications requiring the compact CPG132 footprint with a guaranteed operating range down to –40°C.


Typical Applications for the XC3S50-4CPG132I

The Spartan-3 XC3S50-4CPG132I is well-suited for a broad range of embedded and industrial applications:

  • Industrial Control Systems — Motor control, PLC I/O expansion, sensor interfacing
  • Embedded Processor Cores — Soft-core processor implementations (e.g., MicroBlaze, PicoBlaze)
  • Communications Bridging — Protocol converters, UART/SPI/I²C bridges
  • Automotive Electronics — Body control modules, diagnostic interfaces (industrial temp range)
  • Test & Measurement — Custom logic for data acquisition and signal conditioning
  • Consumer Electronics — Display controllers, USB/HDMI glue logic
  • IoT Edge Devices — Custom hardware accelerators for edge computing nodes

Programming and Design Tools

The XC3S50-4CPG132I is fully supported by Xilinx’s legacy ISE Design Suite and remains compatible with the ISE Webpack free edition for HDL design entry, synthesis, implementation, and bitstream generation.

Tool Purpose
Xilinx ISE Design Suite Primary design and implementation toolchain
ISE Webpack (Free) Entry-level design tools, no license needed for XC3S50
ChipScope Pro In-circuit debug and signal analysis
CORE Generator IP core instantiation (memory controllers, DSP, etc.)
iMPACT JTAG-based device programming and configuration

Configuration is loaded into robust reprogrammable static CMOS configuration latches (CCLs), which collectively control all functional elements and routing resources, supporting multiple configuration modes including Master Serial, Slave Serial, JTAG, and SelectMAP.


XC3S50-4CPG132I Electrical Characteristics Summary

Parameter Min Typical Max Unit
Core Supply Voltage (VCCINT) 1.14 1.20 1.26 V
I/O Supply Voltage (VCCO) 1.14 3.465 V
Operating Temperature (Industrial) –40 +100 °C
Maximum System Frequency 630 MHz
Static Current (ICCINTQ) TBD mA

Why Choose the XC3S50-4CPG132I for Your Design?

The XC3S50-4CPG132I delivers several advantages that make it a compelling choice for embedded designers:

Industrial Reliability — The “I” temperature suffix guarantees operation from –40°C to +100°C, making it suitable for harsh environments where commercial-grade parts fall short.

Compact Footprint — The 132-ball CSBGA package minimizes PCB real estate, enabling dense board designs without sacrificing I/O count.

Balanced Resource Profile — With 1,728 logic cells, 72 Kb block RAM, 4 dedicated multipliers, and 2 DCMs, the XC3S50 provides a well-rounded feature set for small-to-medium complexity designs.

Cost-Effective — As the entry-level member of the Spartan-3 family, the XC3S50 is one of the most economical reprogrammable logic solutions available, especially for high-volume production runs.

Pb-Free Compliance — The CPG132 package variant is RoHS-compliant, meeting modern environmental and regulatory requirements for electronics manufacturing.


Frequently Asked Questions (FAQ)

Q: What is the difference between XC3S50-4CPG132I and XC3S50-4CPG132C? The only difference is the operating temperature range. The “I” suffix denotes Industrial grade (–40°C to +100°C), while the “C” suffix denotes Commercial grade (0°C to +85°C). All other electrical and logic specifications are identical.

Q: Is the XC3S50-4CPG132I still recommended for new designs? As of the latest Xilinx documentation revision (v3.1, June 2013), the Spartan-3 family is listed as recommended for new designs. However, engineers starting fresh projects should also evaluate the newer Spartan-6 or Spartan-7 families for improved performance and longevity.

Q: What programming interface does the XC3S50-4CPG132I support? The device supports JTAG (IEEE 1149.1), Master Serial, Slave Serial, and SelectMAP (parallel) configuration modes.

Q: How many user I/Os are available in the CPG132 package? The CPG132 package provides up to 63 user I/O pins for the XC3S50 device.

Q: What is the maximum internal clock frequency? The XC3S50-4CPG132I supports internal logic operation up to 630 MHz, depending on design implementation and routing.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.