The XC3S4000-4FGG900C is a high-performance Field Programmable Gate Array (FPGA) manufactured by AMD (formerly Xilinx), belonging to the Spartan-3 family. Designed for cost-sensitive, high-volume applications, this device delivers exceptional logic density, flexible I/O, and proven reliability in a 900-ball Fine-Pitch BGA package. Whether you are developing embedded systems, digital signal processing pipelines, or custom logic controllers, the XC3S4000-4FGG900C provides the programmable platform to meet demanding design requirements.
XC3S4000-4FGG900C Key Specifications at a Glance
| Parameter |
Value |
| Manufacturer |
AMD (Xilinx) |
| Part Number |
XC3S4000-4FGG900C |
| Series |
Spartan-3 |
| Package |
900-Ball FBGA (Fine-Pitch Ball Grid Array) |
| Package Size |
31mm × 31mm |
| Logic Cells |
62,208 |
| System Gates |
4,000,000 |
| CLB Slices |
27,648 |
| Distributed RAM |
864 Kbits |
| Block RAM |
1,728 Kbits |
| Multipliers (18×18) |
96 |
| DCMs (Digital Clock Managers) |
4 |
| Maximum User I/O |
712 |
| Speed Grade |
-4 |
| Operating Voltage (VCC INT) |
1.2V |
| Operating Temperature |
0°C to +85°C (Commercial) |
| RoHS Compliant |
Yes |
| Moisture Sensitivity Level (MSL) |
3 |
What Is the XC3S4000-4FGG900C? Overview and Product Family
The XC3S4000-4FGG900C belongs to the Xilinx Spartan-3 FPGA family, one of the most widely deployed Xilinx FPGA product lines in the electronics industry. The Spartan-3 series was purpose-built to address cost-sensitive markets without compromising on programmable logic performance. The “4000” in the part number denotes an approximate 4 million system gate equivalent capacity, making this one of the largest devices in the Spartan-3 lineup.
The “-4” speed grade indicates a mid-range timing performance, offering a practical balance between propagation delay and power consumption. The “FGG900” suffix specifies the 900-ball Fine-Pitch Ball Grid Array (FBGA) package, which supports up to 712 user I/O pins — a critical advantage for designs requiring dense external interfaces.
XC3S4000-4FGG900C Architecture and Internal Structure
Configurable Logic Blocks (CLBs)
The XC3S4000-4FGG900C contains 27,648 logic slices organized into Configurable Logic Blocks. Each slice includes two 4-input Look-Up Tables (LUTs), two storage elements (flip-flops or latches), and dedicated carry logic. This architecture enables efficient implementation of both combinational and sequential logic at high utilization rates.
Block RAM (BRAM)
With 1,728 Kbits of on-chip block RAM, the device supports dual-port memory access for simultaneous read/write operations. Block RAMs are configurable in various width/depth combinations, making them suitable for FIFOs, data buffers, coefficient storage, and embedded lookup tables.
Distributed RAM
Beyond block RAM, the device provides 864 Kbits of distributed RAM formed from CLB LUTs. Distributed RAM is optimal for small, latency-sensitive data structures that benefit from proximity to logic resources.
18×18 Hardware Multipliers
The XC3S4000-4FGG900C includes 96 dedicated 18×18-bit hardware multipliers. These multipliers accelerate DSP operations such as filtering, correlation, and FFT computation without consuming CLB resources, making the device well-suited for signal processing applications.
Digital Clock Managers (DCMs)
Four Digital Clock Managers provide on-chip clock synthesis, phase shifting, frequency multiplication, and deskewing. DCMs allow designers to derive multiple clock domains from a single input reference, eliminating the need for external PLLs in many use cases.
XC3S4000-4FGG900C I/O and Pin Configuration
I/O Standards Supported
| I/O Standard |
Description |
| LVTTL |
Low-Voltage TTL (3.3V) |
| LVCMOS3.3 / 2.5 / 1.8 / 1.5 |
Low-Voltage CMOS variants |
| SSTL2 / SSTL3 |
Stub Series Terminated Logic |
| HSTL |
High-Speed Transceiver Logic |
| PCI / PCI-X |
PCI bus compatible |
| LVDS / LVPECL |
Differential signaling standards |
| GTL / GTL+ |
Gunning Transceiver Logic |
Package Pin Summary
| Feature |
Value |
| Package Type |
FBGA (Fine-Pitch BGA) |
| Package Designator |
FGG900 |
| Total Balls |
900 |
| Maximum User I/O |
712 |
| Dedicated Configuration Pins |
Included |
| Differential I/O Pairs |
Up to 356 pairs |
The 900-ball package enables high pin-count designs in a compact 31mm × 31mm footprint, suitable for applications with limited PCB area.
Electrical Characteristics
Absolute Maximum Ratings
| Parameter |
Min |
Max |
Unit |
| Supply Voltage (VCCINT) |
-0.5 |
1.32 |
V |
| Supply Voltage (VCCO) |
-0.5 |
4.0 |
V |
| Input Voltage (VI) |
-0.5 |
VCCO + 0.5 |
V |
| Storage Temperature |
-65 |
+150 |
°C |
Recommended Operating Conditions
| Parameter |
Min |
Typical |
Max |
Unit |
| VCCINT (Core Voltage) |
1.14 |
1.20 |
1.26 |
V |
| VCCO (I/O Bank Voltage) |
1.14 |
Variable |
3.465 |
V |
| Operating Temperature |
0 |
25 |
85 |
°C |
XC3S4000-4FGG900C Performance and Speed Grade
The -4 speed grade is the slowest commercial speed grade in the Spartan-3 XC3S4000 lineup. The available speed grades for this device family are -4, -5, and -5Q (reduced power). The -4 speed grade provides:
- Reliable timing closure for moderately clocked designs
- Lower dynamic power consumption compared to faster speed grades
- Wide availability and cost-optimized pricing
For designs running below 100 MHz system clocks and not requiring the fastest propagation delays, the -4 speed grade is a pragmatic choice. Higher-speed variants (XC3S4000-5FGG900C) are available when timing margins demand them.
Configuration and Programming
Configuration Modes
The XC3S4000-4FGG900C supports multiple configuration modes to suit a variety of system architectures:
| Mode |
Description |
| Master Serial |
FPGA drives the configuration clock; data loaded from serial Flash |
| Slave Serial |
External master provides the configuration bitstream |
| Master SelectMAP |
8-bit parallel configuration from external memory |
| Slave SelectMAP |
8-bit parallel configuration driven by external processor |
| JTAG |
IEEE 1149.1 compliant boundary scan and configuration |
| Master SPI |
Serial Peripheral Interface Flash configuration |
| Master BPI |
Byte-wide Parallel NOR Flash configuration |
Configuration Storage
The FPGA is SRAM-based and requires re-configuration upon power-up. Bitstream storage is typically handled using:
- Xilinx Platform Flash (XCF series)
- SPI Flash (e.g., Winbond, Micron)
- Parallel NOR Flash
- External microcontroller/processor via SelectMAP or JTAG
Typical Applications of XC3S4000-4FGG900C
The XC3S4000-4FGG900C is deployed across a wide range of industries and applications:
| Application Domain |
Use Case Examples |
| Industrial Automation |
Motor control, PLC expansion, real-time sensor fusion |
| Communications |
Protocol bridging, line cards, packet processing |
| Consumer Electronics |
Video processing, display control, audio DSP |
| Medical Devices |
Imaging acquisition, data logging, real-time monitoring |
| Test & Measurement |
Logic analyzers, signal generators, ATE interfaces |
| Embedded Systems |
Soft-core CPU (MicroBlaze), custom SoC designs |
| Aerospace & Defense |
Custom controllers (commercial temp versions) |
| Automotive |
HMI controllers, gateway logic (non-AEC-Q100) |
Comparison: XC3S4000 vs Other Spartan-3 Devices
| Device |
Logic Cells |
Block RAM |
Multipliers |
Max I/O |
Package Options |
| XC3S200 |
4,320 |
216 Kbits |
12 |
173 |
PQ208, FT256 |
| XC3S400 |
8,064 |
288 Kbits |
16 |
264 |
PQ208, FT256, FG320 |
| XC3S1000 |
17,280 |
432 Kbits |
24 |
391 |
FT256, FG320, FG456 |
| XC3S1500 |
29,952 |
648 Kbits |
32 |
487 |
FG320, FG456, FG676 |
| XC3S4000 |
62,208 |
1,728 Kbits |
96 |
712 |
FG676, FGG900 |
| XC3S5000 |
74,880 |
1,872 Kbits |
104 |
784 |
FG900 |
The XC3S4000 occupies a premium position within the Spartan-3 family, offering nearly 4× the logic resources of the XC3S1000 while remaining significantly more economical than equivalent Virtex-family devices.
PCB Design Guidelines for XC3S4000-4FGG900C
Power Supply Decoupling
Proper power supply decoupling is essential for stable FPGA operation. Recommended practices include:
- Place 100nF ceramic decoupling capacitors (X5R or X7R, 0402/0603) at every VCCINT and VCCO pin
- Use bulk capacitors (10µF–47µF) near the power entry points on each voltage plane
- Maintain short, low-inductance traces between decoupling capacitors and BGA pads
Ball Grid Array (BGA) Assembly
- Use IPC-7093 guidelines for BGA component placement and soldering
- 0.8mm ball pitch requires careful PCB layer stackup planning (minimum 6-layer recommended)
- Ensure soldermask-defined (SMD) pads are used as specified in the package mechanical drawing
- Perform X-ray inspection post-reflow to verify solder joint quality under the BGA body
Signal Integrity
- Implement proper length matching for differential pairs (LVDS, SSTL)
- Use series termination resistors (22–47Ω) on high-speed single-ended outputs
- Route VREF signals with adequate filtering and trace isolation
Ordering Information
| Part Number |
Speed Grade |
Package |
Temperature |
Status |
| XC3S4000-4FGG900C |
-4 (Slowest) |
900-Ball FBGA |
Commercial (0°C – 85°C) |
Active |
| XC3S4000-5FGG900C |
-5 (Faster) |
900-Ball FBGA |
Commercial (0°C – 85°C) |
Active |
| XC3S4000-4FGG676C |
-4 (Slowest) |
676-Ball FBGA |
Commercial (0°C – 85°C) |
Active |
DigiKey Part Number: 1951738
Manufacturer Part Number: XC3S4000-4FGG900C
Manufacturer: AMD (Xilinx)
Category: Integrated Circuits (ICs) → Embedded → FPGAs (Field Programmable Gate Array)
Frequently Asked Questions (FAQ)
Q: What is the core voltage of the XC3S4000-4FGG900C?
A: The core operating voltage (VCCINT) is 1.2V nominal, with a tolerance range of 1.14V to 1.26V.
Q: Is the XC3S4000-4FGG900C RoHS compliant?
A: Yes, the “C” suffix in the part number denotes a commercial temperature range RoHS-compliant device with lead-free solder balls.
Q: Can I use MicroBlaze soft-core processor on this FPGA?
A: Yes. The XC3S4000 has sufficient logic resources to support one or more MicroBlaze soft-processor cores along with peripheral IP, making it suitable for embedded processing applications.
Q: What configuration Flash memory is compatible with this FPGA?
A: Xilinx Platform Flash (XCF16P, XCF32P) or standard SPI/parallel NOR Flash devices are compatible. Refer to Xilinx Application Note XAPP974 for configuration circuit examples.
Q: What is the difference between XC3S4000-4FGG900C and XC3S4000-4FG900C?
A: The “FGG” designation refers to the fine-pitch BGA package variant. Both part numbers refer to the same 900-ball FBGA package; “FGG900” is the standard Xilinx nomenclature for this package type.
Q: Is this device suitable for automotive applications?
A: The “C” suffix indicates a commercial temperature grade (0°C to +85°C), which does not meet AEC-Q100 automotive qualification. For automotive applications, consider the industrial temperature version or explore Xilinx Automotive (XA) series products.
Summary
The XC3S4000-4FGG900C is a powerful, cost-effective FPGA solution from AMD’s Spartan-3 product line. With 62,208 logic cells, 1,728 Kbits of block RAM, 96 hardware multipliers, 4 DCMs, and up to 712 user I/O pins in a compact 900-ball FBGA package, this device addresses a wide spectrum of digital design challenges — from high-density glue logic replacement to complex multi-channel DSP and embedded processing systems. Its proven architecture, broad IP ecosystem, and wide tool support through AMD Vivado and ISE design environments make it a reliable choice for engineers developing commercial and industrial electronic systems.
