The XC3S400-FGG456EGQ is a high-performance, cost-effective Field-Programmable Gate Array (FPGA) from the Xilinx Spartan-3 family. Manufactured by Xilinx (now AMD), this device is engineered for high-volume, cost-sensitive consumer and industrial electronic applications. Whether you are designing broadband access equipment, home networking devices, display systems, or digital television hardware, the XC3S400-FGG456EGQ delivers outstanding programmable logic performance in a compact 456-pin Fine-pitch Ball Grid Array (FBGA) package.
If you are sourcing or evaluating Xilinx FPGA components, this guide covers everything you need — from key electrical specifications and logic resources to package details, I/O standards, and application use cases.
What Is the XC3S400-FGG456EGQ?
The XC3S400-FGG456EGQ belongs to the Spartan-3 FPGA family, a generation that significantly advanced on the earlier Spartan-IIE platform. It incorporates numerous enhancements derived from Xilinx’s Virtex-II platform technology, resulting in increased logic capacity, expanded internal RAM, higher I/O counts, improved clock management, and greater overall bandwidth per dollar.
The “EGQ” suffix in the part number indicates this is an Automotive/Extended temperature grade variant, qualified for operation in environments that require extended reliability and wider temperature tolerances beyond the standard commercial range.
XC3S400-FGG456EGQ Key Specifications at a Glance
| Parameter |
Value |
| Manufacturer |
Xilinx (AMD) |
| Series |
Spartan-3 |
| Part Number |
XC3S400-FGG456EGQ |
| Logic Gates |
400,000 |
| Logic / System Cells |
8,064 Cells |
| CLB Array |
56 × 72 (Configurable Logic Blocks) |
| Maximum Frequency |
630 MHz |
| Process Technology |
90nm |
| Core Supply Voltage (VCCINT) |
1.2V |
| I/O Supply Voltage (VCCO) |
1.2V – 3.3V |
| Package Type |
FGG456 (Fine-pitch Ball Grid Array) |
| Pin Count |
456 Pins |
| Maximum User I/Os |
264 |
| Distributed RAM |
56 Kb |
| Block RAM |
288 Kb |
| Multipliers (18×18) |
16 |
| DCM (Digital Clock Manager) Blocks |
4 |
| RoHS Status |
Not Compliant (EGQ = Automotive/Extended Grade) |
XC3S400-FGG456EGQ Logic Resources Detail
The programmable logic architecture of the XC3S400-FGG456EGQ provides a rich set of resources tailored for complex digital design work. The Spartan-3 architecture organizes logic into five fundamental programmable elements: Configurable Logic Blocks (CLBs), Input/Output Blocks (IOBs), Block RAM, Multiplier Blocks, and Digital Clock Manager (DCM) tiles.
Configurable Logic Blocks (CLBs)
| Resource |
Quantity |
| Total CLBs |
3,584 |
| Slices per CLB |
4 |
| Total Slices |
14,336 (estimated) |
| LUTs (4-input) |
8,064 |
| Flip-Flops |
8,064 |
| Distributed RAM |
56 Kb |
Each CLB contains four slices, and each slice provides two 4-input Look-Up Tables (LUTs) and two flip-flops. The LUTs can also be configured as 16-bit distributed RAM or 16-bit shift registers, giving designers a flexible and efficient resource pool.
Block RAM
| Resource |
Quantity |
| Block RAM Tiles |
16 |
| Capacity per Block |
18 Kb (true dual-port) |
| Total Block RAM |
288 Kb |
The block RAM tiles support true dual-port operation, allowing simultaneous read and write operations at independent clock domains — ideal for FIFO buffers, data storage, and pipeline architectures.
Dedicated Multiplier Blocks
| Resource |
Quantity |
| 18×18 Multipliers |
16 |
| Operation |
Signed / Unsigned Multiplication |
The XC3S400-FGG456EGQ includes 16 dedicated 18×18-bit hardware multipliers. These blocks deliver high-throughput arithmetic operations for DSP, video processing, and signal processing applications without consuming CLB resources.
XC3S400-FGG456EGQ I/O and Package Information
Package Details
| Parameter |
Value |
| Package Code |
FGG456 |
| Package Type |
Fine-pitch Ball Grid Array (FBGA) |
| Total Pins |
456 |
| Maximum User I/Os |
264 |
| I/O Banks |
8 |
| Ball Pitch |
1.0 mm |
Supported I/O Standards
The XC3S400-FGG456EGQ supports a broad range of single-ended and differential I/O signaling standards, making it compatible with many system-level interface requirements.
| I/O Standard Category |
Supported Standards |
| Single-Ended |
LVTTL, LVCMOS (1.2V / 1.5V / 1.8V / 2.5V / 3.3V) |
| Differential |
LVDS, LVPECL, BLVDS, ULVDS, LDT |
| High-Speed Memory |
SSTL2 Class I/II, SSTL18 Class I/II, HSTL Class I/II/III/IV |
| PCI / PCI-X |
PCI 3.3V / 5V tolerant |
| GTL / GTL+ |
GTL, GTLP |
| DCI (Digitally Controlled Impedance) |
Supported on selected banks |
XC3S400-FGG456EGQ Clock Management
Digital Clock Manager (DCM) Blocks
| Resource |
Quantity |
| DCM Tiles |
4 |
| Features |
Clock multiplication, division, phase shifting, duty-cycle correction |
| Input Frequency Range |
24 MHz – 333 MHz (DLL mode) |
| Output Frequencies |
Up to 630 MHz (system frequency) |
The four on-chip DCMs eliminate the need for external clock conditioning circuitry. Each DCM can multiply or divide the input clock, shift its phase, and correct duty-cycle distortion — critical for high-speed synchronous design.
XC3S400-FGG456EGQ Electrical Characteristics
| Parameter |
Min |
Typical |
Max |
Unit |
| Core Supply Voltage (VCCINT) |
1.14 |
1.20 |
1.26 |
V |
| I/O Supply Voltage (VCCO) |
— |
1.2 – 3.3 |
— |
V |
| Operating Temperature (Commercial) |
0 |
— |
+85 |
°C |
| Operating Temperature (Industrial) |
–40 |
— |
+100 |
°C |
| Standby Current (ICCINTQ) |
— |
TBD |
— |
mA |
| Configuration Modes |
Master Serial, Slave Serial, SelectMAP (x8), JTAG |
— |
— |
— |
Note on the EGQ Grade: The “EGQ” in XC3S400-FGG456EGQ designates an automotive/extended qualification grade, meaning the device has been tested and characterized for enhanced reliability, typically targeting –40°C to +125°C or other extended ranges beyond standard commercial specifications. Always verify the exact temperature range in the official Xilinx/AMD datasheet (DS099) and the specific ordering information for this grade.
XC3S400-FGG456EGQ Configuration Options
The XC3S400-FGG456EGQ supports multiple industry-standard configuration modes, providing flexibility during system design.
| Configuration Mode |
Description |
| Master Serial |
Uses external serial PROM (e.g., XCFxxS) |
| Slave Serial |
Controlled by an external master |
| SelectMAP (Parallel x8) |
Fastest non-JTAG configuration method |
| JTAG (IEEE 1149.1) |
Boundary scan and in-system programming |
| SPI Flash |
Via platform flash or third-party SPI devices |
Configuration bitstream capacity for the XC3S400 device is approximately 1,699,136 bits.
XC3S400-FGG456EGQ Part Number Decoder
Understanding the Xilinx part number nomenclature helps with ordering and cross-referencing.
| Field |
Code |
Meaning |
| Family |
XC3S |
Spartan-3 |
| Gate Count |
400 |
400K system gates |
| Speed Grade (if present) |
–4 or –5 |
Timing performance (–4 = slower, –5 = fastest) |
| Package |
FGG |
Fine-pitch Ball Grid Array (FBGA) |
| Pin Count |
456 |
456-pin package |
| Temperature / Grade |
EGQ |
Extended/Automotive grade, Pb-free |
Note: The XC3S400-FGG456EGQ does not include a numeric speed grade suffix in its standard ordering code, which often indicates an automotive or special qualification variant. Cross-reference with AMD/Xilinx product tables or contact your distributor to confirm the speed grade and operating conditions for this specific part.
XC3S400-FGG456EGQ vs. Related Spartan-3 400K Variants
| Part Number |
Speed Grade |
Package |
Pins |
Temperature Grade |
| XC3S400-4FGG456C |
–4 |
FGG456 |
456 |
Commercial (0°C to +85°C) |
| XC3S400-4FGG456I |
–4 |
FGG456 |
456 |
Industrial (–40°C to +100°C) |
| XC3S400-5FGG456C |
–5 |
FGG456 |
456 |
Commercial (0°C to +85°C) |
| XC3S400-FGG456EGQ |
Extended |
FGG456 |
456 |
Automotive/Extended Grade |
| XC3S400-4FGG320C |
–4 |
FGG320 |
320 |
Commercial (0°C to +85°C) |
| XC3S400-4TQ144C |
–4 |
TQG144 |
144 |
Commercial (0°C to +85°C) |
All variants above share the same core logic (400K gates, 8,064 cells, 90nm, 1.2V), differing only in speed grade, package, and temperature qualification.
XC3S400-FGG456EGQ Applications
The XC3S400-FGG456EGQ is an ideal solution for a wide spectrum of industries and applications:
Consumer Electronics
- Digital television (DTV) and set-top box processing
- Home networking and broadband gateway equipment
- Display and projection system control
- Digital still camera and video capture interfaces
Industrial & Automotive
- Motor control and drive systems
- Industrial Ethernet and fieldbus interfaces
- Automotive infotainment and ADAS modules (automotive-grade EGQ variant)
- Factory automation and sensor fusion
Communications & Networking
- Protocol bridging and conversion
- SONET/SDH framing and processing
- Wireless base station control planes
- High-speed serial interface management
Embedded & Computing
- Custom co-processor acceleration
- FPGA-based soft-core processor (MicroBlaze-compatible)
- Memory controller and bus arbitration
- Test and measurement instrumentation
Why Choose the XC3S400-FGG456EGQ Over an ASIC?
The XC3S400-FGG456EGQ offers a compelling alternative to traditional mask-programmed ASICs for medium-to-high volume designs.
| Factor |
XC3S400-FGG456EGQ (FPGA) |
Traditional ASIC |
| NRE (Non-Recurring Engineering) Cost |
None |
Very High ($100K–$5M+) |
| Time to Market |
Weeks |
6–18 Months |
| Design Iteration |
Unlimited, in-field |
Requires new tape-out |
| Field Upgradability |
Yes, reconfigurable |
No |
| Volume Break-Even Point |
Low-to-medium volume |
High volume only |
| Risk |
Low |
High |
For designs requiring flexibility, rapid iteration, or field updates, the XC3S400-FGG456EGQ provides cost advantages and time-to-market benefits that ASICs cannot match at low and medium production volumes.
XC3S400-FGG456EGQ Design Tools & Support
Xilinx (now AMD) provides a comprehensive ecosystem of design tools and IP for the Spartan-3 family.
| Tool / Resource |
Description |
| ISE Design Suite |
Primary synthesis, implementation, and bitstream generation tool for Spartan-3 |
| ChipScope Pro |
On-chip logic analysis and debugging |
| XPower Analyzer |
Power estimation and optimization |
| iMPACT |
JTAG programming and configuration |
| CORE Generator |
Parameterized IP core generation (FIFO, memory, DSP, etc.) |
| MicroBlaze Soft Processor |
32-bit soft-core CPU deployable on Spartan-3 logic |
The Vivado Design Suite does not support Spartan-3 devices. Use ISE Design Suite 14.7 (the final ISE release) for XC3S400-FGG456EGQ design and programming workflows.
Frequently Asked Questions About the XC3S400-FGG456EGQ
Q: What is the difference between XC3S400-FGG456EGQ and XC3S400-4FGG456C? The “EGQ” suffix denotes an automotive/extended qualification grade and Pb-free (lead-free) packaging, typically offering a wider or extended operating temperature range. The “4FGG456C” is a commercial temperature grade (0°C to +85°C) with a –4 speed grade designation.
Q: Is the XC3S400-FGG456EGQ RoHS compliant? The “EGQ” suffix typically indicates a Pb-free, RoHS-compliant package variant. However, always confirm with your distributor or the AMD/Xilinx official product tables, as compliance status can vary by production lot and date code.
Q: What programming file does the XC3S400-FGG456EGQ use? It uses a bitstream (.bit) file generated by Xilinx ISE. The configuration bitstream is approximately 1.7 Mb and can be stored in an external XCFxxS Platform Flash PROM or SPI flash device.
Q: Can the XC3S400-FGG456EGQ run a soft-core processor? Yes. The MicroBlaze 32-bit soft processor is deployable within the Spartan-3 logic fabric and is supported by Xilinx EDK (Embedded Development Kit) for embedded software development.
Q: What is the maximum I/O count for the FGG456 package? The FGG456 package supports up to 264 user I/Os across 8 I/O banks.
Summary
The XC3S400-FGG456EGQ is a versatile, reliable, and cost-efficient FPGA solution from the Xilinx Spartan-3 family. With 400K system gates, 8,064 logic cells, 288 Kb of block RAM, 16 dedicated multipliers, and 4 DCMs — all housed in a 456-pin FBGA package running on 90nm process technology at 1.2V core voltage — it addresses a wide range of digital design challenges. The extended-grade EGQ qualification makes it particularly suited for automotive, industrial, and demanding application environments.
For engineers seeking a proven, programmable logic platform with strong toolchain support, extensive I/O flexibility, and a well-established supplier ecosystem, the XC3S400-FGG456EGQ remains a capable and trusted choice.
