Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

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XC3S400-4TQG144I: Xilinx Spartan-3 FPGA – Complete Product Guide

Product Details

The XC3S400-4TQG144I is a high-performance, cost-optimized field-programmable gate array (FPGA) from AMD Xilinx’s Spartan-3 family. Designed for a wide range of embedded and industrial applications, this device delivers 400,000 system gates, 144-pin TQFP packaging, and industrial-grade temperature operation. Whether you are building a DSP system, high-speed communication interface, or custom logic controller, the XC3S400-4TQG144I offers the flexibility, density, and reliability your design demands.


What Is the XC3S400-4TQG144I?

The XC3S400-4TQG144I belongs to AMD Xilinx’s Spartan-3 series — a family of Xilinx FPGA devices engineered to deliver maximum logic density at minimal cost. The “4” in its part number indicates a –4 speed grade, offering faster timing performance compared to slower-grade variants. The “I” suffix designates industrial temperature range operation (–40°C to +85°C), making it suitable for demanding environments.

This FPGA is a popular choice among electronics engineers, FPGA designers, and PCB developers who need a proven, programmable logic device for prototyping and production designs alike.


XC3S400-4TQG144I Key Specifications

General Product Information

Parameter Value
Manufacturer AMD (Xilinx)
Part Number XC3S400-4TQG144I
Series Spartan-3
Product Category Embedded – FPGAs (Field Programmable Gate Array)
Rohs Status RoHS Compliant

Logic and Configuration Resources

Feature Value
System Gates 400,000
Logic Cells 8,064
CLB Array (Rows × Cols) 28 × 24
CLBs (Configurable Logic Blocks) 672
Flip-Flops 8,064
Maximum Distributed RAM 56 Kb
Block RAM 288 Kb (16 × 18 Kb blocks)
DSP / Multiplier Blocks 16 × 18×18 hardware multipliers

Speed and Timing

Parameter Value
Speed Grade –4 (Fastest in Spartan-3 family)
Maximum Internal Clock Up to ~630 MHz (internal DCM-based)
DCMs (Digital Clock Managers) 4

I/O and Packaging

Feature Value
Package Type TQFP (Thin Quad Flat Pack)
Package Code TQG144
Total Pin Count 144
Maximum User I/O Pins 97
I/O Standards Supported LVTTL, LVCMOS, LVDS, PCI, HSTL, SSTL
Input Voltage (VCCO) 1.2 V – 3.3 V
Core Voltage (VCCINT) 1.2 V

Environmental and Thermal

Parameter Value
Temperature Grade Industrial (I)
Operating Temperature Range –40°C to +85°C
Moisture Sensitivity Level (MSL) 3
Mounting Type Surface Mount

XC3S400-4TQG144I Pin Configuration Overview

The 144-pin TQFP package offers a compact, surface-mount footprint ideal for space-constrained PCB layouts. The 97 user-configurable I/O pins are organized into four I/O banks, each independently powered and configurable for different voltage standards.

I/O Bank Pin Range Supported Standards
Bank 0 Top side LVTTL, LVCMOS, PCI
Bank 1 Right side LVCMOS, LVDS, HSTL
Bank 2 Bottom side LVTTL, LVCMOS, SSTL
Bank 3 Left side LVCMOS, LVDS, PCI

Each bank’s VCCO supply can be set independently, giving designers maximum flexibility when interfacing with mixed-voltage peripherals.


Spartan-3 Architecture Highlights

Configurable Logic Blocks (CLBs)

Each CLB in the XC3S400-4TQG144I contains four slices, and each slice includes two 4-input LUTs (Look-Up Tables) and two flip-flops. LUTs can be configured as logic, shift registers, or distributed RAM, giving designers multiple implementation strategies for the same design element.

Block RAM (BRAM)

The 288 Kb of on-chip block RAM is organized in sixteen 18 Kb dual-port blocks. These synchronous RAM blocks support independent read and write clocking, making them ideal for FIFO buffers, frame buffers, and lookup tables in high-speed designs.

Hardware Multipliers

Sixteen dedicated 18×18-bit hardware multipliers accelerate DSP-intensive tasks such as FIR filters, FFT cores, and motor control algorithms without consuming CLB resources.

Digital Clock Managers (DCMs)

Four integrated DCMs provide clock frequency synthesis, phase shifting, and duty-cycle correction. This eliminates the need for external PLL chips and simplifies board-level clock distribution for complex multi-clock designs.


XC3S400-4TQG144I vs. Other Spartan-3 Variants

Part Number Gates I/O Pins Package Temp Grade
XC3S200-4TQG144I 200K 97 TQFP-144 Industrial
XC3S400-4TQG144I 400K 97 TQFP-144 Industrial
XC3S400-4PQG208I 400K 141 PQFP-208 Industrial
XC3S1000-4TQG144I 1M 97 TQFP-144 Industrial
XC3S400-4FTG256I 400K 173 FBGA-256 Industrial

The XC3S400-4TQG144I sits at a sweet spot — delivering 400K gates with the compact 144-pin TQFP package, balancing logic density and board space efficiency.


Supported I/O Standards

One of the key strengths of the XC3S400-4TQG144I is its broad I/O standard support, enabling seamless integration with a wide variety of external components.

I/O Standard Description Typical Use Case
LVTTL Low-Voltage TTL (3.3 V) General-purpose digital logic
LVCMOS 3.3 / 2.5 / 1.8 / 1.5 Low-Voltage CMOS Microcontroller interfaces
PCI / PCI-X 3.3 V PCI signaling PCI peripheral design
LVDS Low-Voltage Differential Signaling High-speed serial links
HSTL High-Speed Transceiver Logic Memory bus interfaces
SSTL 2 / SSTL 3 Stub Series Terminated Logic SDRAM/DDR interfaces

Typical Applications of the XC3S400-4TQG144I

The XC3S400-4TQG144I FPGA is a versatile device used across multiple industries and application domains:

Industrial Automation and Control

Its industrial temperature rating (–40°C to +85°C) and robust I/O standards make it ideal for PLCs, motor drives, sensor data acquisition systems, and industrial communication gateways.

Embedded Processing

When combined with a soft-core processor such as MicroBlaze or PicoBlaze (both synthesizable in Xilinx ISE/Vivado), the FPGA functions as a fully customizable embedded processor with peripheral logic included.

Digital Signal Processing (DSP)

The 16 dedicated multiplier blocks and 288 Kb of on-chip BRAM support efficient implementation of FIR/IIR filters, FFT engines, and real-time signal processing chains.

Communications and Networking

With LVDS and high-speed I/O capability, the device supports UART, SPI, I²C, CAN, and custom protocol bridging for embedded networking applications.

Prototyping and Development

Paired with an evaluation board such as the Spartan-3 Starter Kit, the XC3S400-4TQG144I is a widely used FPGA for university coursework, FPGA training labs, and rapid logic prototyping.

Automotive and Harsh Environments

The industrial-grade “I” suffix ensures reliable operation in temperature-extreme environments common in automotive, avionics support equipment, and outdoor industrial systems.


Configuration and Programming

The XC3S400-4TQG144I supports multiple configuration modes to suit different production and development scenarios:

Configuration Mode Description
Master Serial (SPI Flash) Single-device or daisy-chain from SPI flash
Slave Serial Controlled by external microcontroller or processor
Master SelectMAP (x8) Byte-wide parallel configuration from a processor
Slave SelectMAP Byte-wide parallel from external host
JTAG (IEEE 1149.1) Boundary scan and debug configuration

JTAG is the most commonly used interface for development and field updates, compatible with Xilinx’s Platform Cable USB and iMPACT software tools.


Development Tools and Software Support

AMD Xilinx provides a comprehensive toolchain for designing with the XC3S400-4TQG144I:

Tool Purpose
Xilinx ISE Design Suite Primary HDL synthesis, implementation, and bitstream generation
ISIM / ModelSim RTL and gate-level simulation
ChipScope Pro On-chip logic analysis and debugging
iMPACT JTAG-based device programming and configuration
IP Core Generator (CORE Generator) Pre-verified IP blocks (FIFOs, memory controllers, DSP cores)

Design entry supports both VHDL and Verilog HDL, as well as schematic entry for beginners.


Ordering Information

Attribute Detail
Full Part Number XC3S400-4TQG144I
DigiKey Part Number 122-1449-ND (reference)
Manufacturer AMD (Xilinx)
Package TQFP-144 (TQG144)
Lead-Free / RoHS Yes
Quantity Pricing Available for volume orders

Why Choose the XC3S400-4TQG144I?

The XC3S400-4TQG144I offers an exceptional combination of:

  • High logic density — 400K gates in a compact 144-pin TQFP footprint
  • Industrial reliability — Rated for –40°C to +85°C, proven in harsh environments
  • Flexible I/O — 97 user I/O pins with multi-standard support across four independent banks
  • On-chip resources — Dedicated multipliers and block RAM for DSP and data buffering
  • Mature ecosystem — Supported by decades of Xilinx ISE tooling, application notes, and community resources
  • Cost-effectiveness — The Spartan-3 family is designed for high-volume, cost-sensitive deployments

For engineers working with embedded FPGA designs, custom logic, or hardware prototyping, the XC3S400-4TQG144I remains one of the most trusted and widely deployed Spartan-3 devices on the market.


Frequently Asked Questions (FAQ)

Q: What is the core voltage for the XC3S400-4TQG144I? A: The core voltage (VCCINT) is 1.2 V. I/O bank voltages (VCCO) are configurable from 1.2 V to 3.3 V per bank.

Q: What is the difference between the “C” and “I” temperature suffix? A: The “C” suffix denotes commercial grade (0°C to +85°C), while the “I” suffix denotes industrial grade (–40°C to +85°C).

Q: Can I use Vivado to program the XC3S400-4TQG144I? A: Vivado does not support Spartan-3 devices. Xilinx ISE Design Suite (version 14.7) is the correct toolset for this FPGA.

Q: How many block RAM bits are available? A: The XC3S400-4TQG144I provides 288,000 bits (288 Kb) of block RAM across 16 dual-port 18 Kb blocks.

Q: Is this device RoHS compliant? A: Yes. The XC3S400-4TQG144I is manufactured in a RoHS-compliant, lead-free process.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.