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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XC3S400-4TQ144C: Xilinx Spartan-3 FPGA – Complete Product Guide

Product Details

The XC3S400-4TQ144C is a high-performance, cost-optimized Xilinx FPGA from the Spartan-3 family, manufactured by AMD (formerly Xilinx). Designed for applications requiring flexible digital logic, embedded processing, and signal processing, the XC3S400-4TQ144C delivers 400,000 system gates in a compact 144-pin TQFP package at a commercial temperature grade. Whether you are prototyping a new design or deploying a production system, the XC3S400-4TQ144C offers the performance, density, and I/O flexibility engineers need.


What Is the XC3S400-4TQ144C?

The XC3S400-4TQ144C belongs to Xilinx’s Spartan-3 FPGA family, one of the most widely deployed low-cost FPGA platforms in the industry. The part number breaks down as follows:

Part Number Segment Meaning
XC3S Spartan-3 Family
400 400,000 System Gates
-4 Speed Grade (-4, slowest of the family)
TQ TQFP Package (Thin Quad Flat Pack)
144 144 Pin Count
C Commercial Temperature Range (0°C to +85°C)

XC3S400-4TQ144C Key Specifications

General Device Specifications

Parameter Value
Manufacturer AMD (Xilinx)
Series Spartan-3
Part Number XC3S400-4TQ144C
Logic Cells 8,064
System Gates 400,000
CLB Slices 3,584
Distributed RAM 56 Kbits
Block RAM 288 Kbits
Multipliers (18×18) 16
DCM (Digital Clock Manager) 4
Maximum User I/O 97

Package and Thermal Specifications

Parameter Value
Package Type TQFP (Thin Quad Flat Pack)
Pin Count 144
Package Dimensions 20mm × 20mm
Operating Temperature 0°C to +85°C (Commercial)
Voltage Supply (VCCINT) 1.2V
Voltage Supply (VCCAUX) 2.5V
I/O Voltage (VCCO) 1.2V, 1.5V, 1.8V, 2.5V, 3.3V

Speed and Performance

Parameter Value
Speed Grade -4
Maximum Frequency Up to ~200 MHz (design dependent)
Clock-to-Out ~3.5 ns typical
Setup Time ~0.5 ns typical

XC3S400-4TQ144C Features and Architecture

Configurable Logic Blocks (CLBs)

The XC3S400-4TQ144C is built around Xilinx’s proven CLB architecture. Each CLB contains four slices, and each slice includes two 4-input look-up tables (LUTs) and two flip-flops. This architecture enables efficient implementation of combinational logic, sequential logic, and distributed RAM.

Block RAM (BRAM)

With 288 Kbits of dedicated on-chip block RAM organized into 18 Kbit blocks, the XC3S400-4TQ144C is well-suited for buffering, FIFOs, and lookup table storage. The dual-port BRAM supports simultaneous read and write operations at different clock domains, making it ideal for multi-clock designs.

Digital Clock Manager (DCM)

Four integrated DCMs provide clock synthesis, deskewing, phase shifting, and frequency division/multiplication. The DCM eliminates clock distribution delays and allows designers to generate multiple derived clocks from a single input reference — critical in synchronous system designs.

Dedicated Multipliers

Sixteen 18×18 dedicated multiplier blocks enable high-performance DSP and arithmetic operations without consuming CLB resources. These are especially valuable in signal processing applications such as FIR filters, FFT engines, and motor control algorithms.

I/O Standards Supported

I/O Standard Description
LVCMOS 3.3V / 2.5V / 1.8V / 1.5V General-purpose single-ended I/O
LVTTL Low-voltage TTL compatible
LVDS Low-voltage differential signaling
HSTL High-speed transceiver logic
SSTL2 / SSTL3 Stub series terminated logic
PCI 3.3V PCI compatible

XC3S400-4TQ144C vs. Other Spartan-3 Devices

Part Number System Gates CLB Slices Block RAM Max I/O Package Options
XC3S50-4TQ144C 50,000 768 72 Kbits 97 TQ144
XC3S400-4TQ144C 400,000 3,584 288 Kbits 97 TQ144
XC3S1000-4TQ144C 1,000,000 7,680 432 Kbits 97 TQ144
XC3S1500-4FG320C 1,500,000 13,312 576 Kbits 221 FG320

The XC3S400-4TQ144C sits in the mid-range of the Spartan-3 family, providing significantly more resources than the XC3S50 while remaining pin-compatible within the TQ144 footprint, making it an easy upgrade path for scalable designs.


Applications of the XC3S400-4TQ144C

The XC3S400-4TQ144C is used across a wide range of industries and applications:

Industrial and Embedded Control

  • Motor control and drive systems
  • Industrial automation and PLC expansion
  • Real-time data acquisition and processing

Communications and Networking

  • Protocol bridging (UART, SPI, I2C, Ethernet)
  • Custom bus interface logic
  • Line card and backplane interface logic

Consumer Electronics

  • Video signal processing
  • Display controllers and scalers
  • Audio processing and codec interfaces

Defense and Aerospace (Commercial-grade constraints apply)

  • Signal interception and processing
  • Radar and sonar signal processing
  • Embedded control systems

Development and Education

  • FPGA learning platforms
  • Prototype digital design verification
  • University research and coursework

XC3S400-4TQ144C Ordering and Availability

Attribute Details
Manufacturer AMD (Xilinx)
Manufacturer Part Number XC3S400-4TQ144C
DigiKey Part Number 122-1432-ND
Series Spartan-3
Package 144-TQFP
Lead Status EOL / Last-Time-Buy status — verify with distributor
RoHS Compliance Yes (check specific lot date code)
Moisture Sensitivity Level MSL 3

Note: The Spartan-3 family has reached end-of-life (EOL) from AMD Xilinx. Buyers should confirm stock availability with authorized distributors and consider pin-compatible alternatives such as the Spartan-6 or Artix-7 families for new designs.


Programming and Development Tools

Xilinx ISE Design Suite

The XC3S400-4TQ144C is supported by Xilinx ISE Design Suite, specifically ISE 14.7 (the final release for Spartan-3 devices). ISE provides a complete FPGA design environment including:

  • VHDL and Verilog synthesis
  • Place and route (PaR)
  • Timing analysis and simulation
  • iMPACT programming software for JTAG configuration

Configuration Methods

Configuration Mode Description
JTAG (Boundary Scan) Direct download via JTAG cable (most common for development)
Master Serial SPI flash memory boot configuration
Slave Serial External controller drives configuration
SelectMAP Parallel configuration for fast startup

Supported Development Boards

Several popular development boards feature the XC3S400 or compatible Spartan-3 devices, including boards from Digilent, Avnet, and Xilinx itself (Spartan-3 Starter Kit). These boards provide USB-JTAG interfaces, oscillators, SRAM, and expansion headers for rapid prototyping.


Design Considerations and Tips

Power Supply Design

The XC3S400-4TQ144C requires three power supply rails: VCCINT (1.2V core), VCCAUX (2.5V auxiliary), and VCCO (I/O bank voltage, 1.2V–3.3V). Careful decoupling capacitor placement is critical — Xilinx recommends placing 100nF and 10µF capacitors at each power pin for stable operation.

PCB Layout Guidelines

  • Use a four-layer PCB minimum (signal, ground, power, signal)
  • Route high-frequency clock signals with controlled impedance (50 Ω)
  • Keep VCCINT decoupling capacitors within 2mm of power pins
  • Separate I/O bank power planes to avoid cross-bank noise coupling

Thermal Management

Operating within the commercial temperature range (0°C to +85°C junction), the XC3S400-4TQ144C requires no active cooling in most applications. For high-utilization designs, calculate power dissipation using Xilinx’s XPower Analyzer tool and add a heatsink if the junction temperature budget is tight.


Frequently Asked Questions (FAQ)

Q: Is the XC3S400-4TQ144C still in production? A: The Spartan-3 family, including the XC3S400-4TQ144C, is in end-of-life (EOL) status with AMD Xilinx. Stock is available through authorized distributors and franchised excess inventory suppliers, but new designs should consider migrating to the Spartan-6 (XC6SLX series) or Artix-7 (XC7A series) families.

Q: What is the difference between XC3S400-4TQ144C and XC3S400-5TQ144C? A: The only difference is the speed grade. The -4 suffix indicates a slower speed grade, while -5 offers higher maximum operating frequencies. For timing-critical designs, choose the -5 speed grade.

Q: Can the XC3S400-4TQ144C be used in industrial temperature applications? A: The “C” suffix denotes a commercial temperature range (0°C to +85°C). For industrial temperature requirements (–40°C to +100°C), use the XC3S400-4TQ144I variant.

Q: What configuration memory is compatible with the XC3S400-4TQ144C? A: Common choices include Xilinx Platform Flash (XCF02S), Cypress SPI flash, and Atmel DataFlash devices. The XC3S400 requires approximately 1.7 Mbit of configuration memory.

Q: Is the XC3S400-4TQ144C RoHS compliant? A: Most production lots are RoHS compliant. Verify the specific date code and lot traceability with your distributor to confirm compliance documentation.


Summary

The XC3S400-4TQ144C remains a reliable and capable mid-range FPGA for embedded logic, communications, and signal processing applications. With 400,000 system gates, 97 user I/O pins, 288 Kbits of block RAM, 16 hardware multipliers, and 4 DCMs — all in a 144-pin TQFP package — it provides a compelling combination of density and versatility. While its EOL status makes it unsuitable as a primary choice for new product designs, it remains widely used in legacy systems, retrofit applications, and educational platforms.

For engineers evaluating FPGA solutions across the Xilinx portfolio, the XC3S400-4TQ144C represents a mature, well-documented device with extensive toolchain support through ISE 14.7.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.