Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC3S400-4FG320C: Xilinx Spartan-3 FPGA – Complete Product Guide

Product Details

The XC3S400-4FG320C is a mid-range, commercially graded Xilinx FPGA from AMD’s Spartan-3 family, housed in a 320-ball Fine-pitch Ball Grid Array (FBGA) package. With 400,000 system gates, a -4 speed grade, and robust I/O flexibility, this device is a proven choice for cost-sensitive embedded systems, digital signal processing, and communication applications. This guide covers every specification, feature, and application consideration you need to make a confident purchasing decision.


What Is the XC3S400-4FG320C?

The XC3S400-4FG320C is a field-programmable gate array (FPGA) manufactured by AMD (formerly Xilinx). It belongs to the Spartan-3 generation — a family designed to deliver high logic density at low cost. The “4” in the part number designates the speed grade, “FG320” indicates the 320-ball FBGA package, and “C” denotes the commercial temperature range (0°C to +85°C).

This device is widely used in production hardware, prototyping platforms, and legacy designs that require a reliable, well-supported programmable logic solution.


XC3S400-4FG320C Key Specifications

Parameter Value
Manufacturer AMD (Xilinx)
Part Number XC3S400-4FG320C
Series Spartan-3
Logic Cells 8,064
System Gates 400,000
CLB Flip-Flops 7,168
Distributed RAM 56 Kb
Block RAM 288 Kb
Multipliers (18×18) 16
DCMs (Digital Clock Managers) 4
I/O Standards Supported 26
Maximum User I/O Pins 264
Package FG320 (FBGA, 320-Ball)
Package Dimensions 15 mm × 15 mm
Speed Grade -4
Operating Voltage (VCCINT) 1.2 V
Temperature Range 0°C to +85°C (Commercial)
RoHS Status RoHS Compliant

XC3S400-4FG320C Package and Pinout Overview

FG320 FBGA Package Details

Package Attribute Detail
Package Type Fine-Pitch Ball Grid Array (FBGA)
Ball Count 320
Body Size 15 mm × 15 mm
Ball Pitch 1.0 mm
Mounting Type Surface Mount Technology (SMT)
Max User I/Os 264

The compact 15 × 15 mm footprint of the FG320 package makes the XC3S400-4FG320C ideal for board designs with tight spatial constraints. Its 1.0 mm ball pitch is compatible with standard PCB fabrication processes, keeping manufacturing costs low.


Logic Architecture and On-Chip Resources

Configurable Logic Blocks (CLBs)

The Spartan-3 CLB architecture is organized into a matrix of slices, each containing:

  • Look-Up Tables (LUTs) for implementing combinatorial logic
  • Storage elements (flip-flops and latches)
  • Wide multiplexers for routing and function generation
  • Carry and arithmetic logic chains for efficient adder/subtractor implementation

Memory Resources

Memory Type Capacity
Distributed RAM 56 Kb
Block RAM (BRAM) 288 Kb (16 × 18 Kb blocks)

Block RAM in the XC3S400 supports true dual-port operation, making it suitable for FIFOs, lookup tables, and frame buffers in embedded video or communication applications.

DSP and Arithmetic Resources

The device integrates 16 dedicated 18×18-bit hardware multipliers, enabling efficient implementation of multiply-accumulate (MAC) operations without consuming CLB resources. This is particularly valuable in DSP, filtering, and motor control applications.

Clock Management

DCM Feature Detail
Number of DCMs 4
Functions Clock multiplication, division, phase shifting, deskewing
DLL Frequency Range 24 MHz to 326 MHz

The four Digital Clock Managers (DCMs) provide flexible clock synthesis and management, supporting designs that require multiple clock domains or precise phase relationships.


I/O Features and Supported Standards

I/O Bank Organization

The XC3S400-4FG320C organizes its I/O pins into multiple banks, each independently configurable for voltage and I/O standard. This allows a single device to interface with multiple voltage domains on the same board.

Supported I/O Standards

Category Supported Standards
Single-Ended LVTTL, LVCMOS 3.3V / 2.5V / 1.8V / 1.5V / 1.2V
Differential LVDS, LVDS_25, BLVDS, LVPECL, RSDS
Legacy / PCI PCI 3.3V, PCI-X
High-Speed HSTL Class I/II, SSTL2 Class I/II, SSTL3 Class I/II

With support for 26 I/O standards, the XC3S400-4FG320C is highly adaptable to mixed-voltage board environments.


Electrical Characteristics

Absolute Maximum Ratings

Parameter Min Max
VCCINT (Core Voltage) –0.5 V 1.32 V
VCCO (I/O Voltage) –0.5 V 4.0 V
Storage Temperature –65°C +150°C
Operating Temperature (Commercial) 0°C +85°C

Typical Power Consumption

Power consumption depends heavily on design activity, clock frequency, and I/O loading. Xilinx provides the XPower Estimator tool for accurate pre-layout power analysis.

Supply Rail Nominal Voltage
VCCINT 1.20 V
VCCO 1.2 V – 3.3 V (I/O bank dependent)
VCCAUX 2.5 V

Configuration Modes

The XC3S400-4FG320C supports multiple configuration modes, providing flexibility for different system architectures:

Configuration Mode Description
Master Serial Uses an external serial Flash (e.g., Xilinx Platform Flash)
Slave Serial Driven by an external microprocessor or FPGA
Master SPI Interfaces directly with standard SPI Flash memory
Master BPI Parallel NOR Flash configuration
JTAG In-system programming and debug via IEEE 1149.1 boundary scan
Slave SelectMAP Byte-wide parallel configuration by a host processor

The JTAG interface is invaluable for in-circuit debugging and iterative firmware development without removing the device from the board.


Speed Grade -4 Performance

The “-4” speed grade is the fastest commercially available speed grade for the Spartan-3 family. It supports higher clock frequencies and shorter propagation delays compared to -5 or -4C grades in other contexts. Key timing parameters:

Timing Parameter Value (Typical, -4 Grade)
Maximum Flip-Flop Frequency Up to ~326 MHz (DCM output)
CLB Logic Propagation Delay Sub-nanosecond (LUT path)
I/O Setup Time See Spartan-3 DC & Switching Characteristics datasheet

For timing-critical designs, Xilinx ISE or Vivado (legacy) static timing analysis tools should be used alongside the device-specific timing models provided in the official datasheet.


Comparison: XC3S400-4FG320C vs. Related Spartan-3 Variants

Part Number Gates Block RAM Multipliers Package Speed Grade Temp
XC3S400-4FG320C 400K 288 Kb 16 FG320 -4 Commercial
XC3S400-4PQ208C 400K 288 Kb 16 PQ208 -4 Commercial
XC3S400-4FG320I 400K 288 Kb 16 FG320 -4 Industrial
XC3S200-4FG256C 200K 216 Kb 12 FG256 -4 Commercial
XC3S1000-4FG320C 1M 432 Kb 24 FG320 -4 Commercial
XC3S1500-4FG320C 1.5M 576 Kb 32 FG320 -4 Commercial

The XC3S400-4FG320C occupies the mid-range sweet spot of the Spartan-3 family — offering substantially more resources than the XC3S200 while sharing the same compact FG320 footprint as higher-density variants, enabling easy design scalability.


Typical Application Areas

Embedded System Control

The combination of 8,064 logic cells, block RAM, and hardware multipliers makes the XC3S400-4FG320C a capable controller for embedded peripherals, custom CPU implementations (e.g., MicroBlaze soft processor), and custom state machines.

Digital Signal Processing (DSP)

With 16 dedicated hardware multipliers and efficient CLB arithmetic chains, the device is well-suited for FIR/IIR filters, FFT engines, and digital modulation/demodulation in communications systems.

Communications and Networking

Support for LVDS, SSTL, HSTL, and other high-speed I/O standards enables the XC3S400-4FG320C to interface with high-speed memory, serial transceivers, and line-rate logic in Ethernet, SPI, I2C, UART, and custom protocol implementations.

Industrial Automation

The commercial temperature range (0°C to +85°C) covers the majority of industrial control environments. The device is commonly found in motor drive controllers, sensor interfaces, and real-time control loops.

Video and Imaging

Block RAM depth and distributed memory support line-buffer and frame-buffer implementations for VGA, CameraLink, or custom video pipeline designs.


Development Tools and Design Flow

Xilinx ISE Design Suite

The XC3S400-4FG320C is supported by Xilinx ISE Design Suite (the legacy toolchain), which provides:

  • HDL synthesis (VHDL/Verilog)
  • Placement and routing
  • Static timing analysis
  • Bitstream generation and configuration

ISE 14.7 is the final version and remains freely downloadable from the AMD/Xilinx website.

CORE Generator and IP Cores

ISE includes CORE Generator, which offers pre-verified IP cores including:

  • FIFO generators
  • Block memory controllers
  • DCM/PLL wrappers
  • Communication interfaces (UART, SPI, I2C)
  • DSP building blocks

ChipScope Pro

Xilinx’s ChipScope Pro embeds logic analyzer functionality directly into the FPGA fabric, enabling in-system signal capture without external test equipment — essential for debugging complex timing issues.


Ordering and Availability

Attribute Detail
Part Number XC3S400-4FG320C
Manufacturer AMD (Xilinx)
Manufacturer Series Spartan-3
Package FG320 (FBGA 320-Ball)
Operating Temperature 0°C ~ 85°C
Moisture Sensitivity Level MSL 3
RoHS Compliant
ECCN 3A991.a.2
HTSUS 8542.39.00.01

Frequently Asked Questions (FAQ)

Q: What is the difference between XC3S400-4FG320C and XC3S400-4FG320I? The only difference is the temperature rating. The “C” suffix designates a commercial range (0°C to +85°C), while the “I” suffix designates an industrial range (–40°C to +100°C). All logic and electrical characteristics are otherwise identical.

Q: Is the XC3S400-4FG320C still in production? The Spartan-3 family is in the mature/end-of-life phase. It is still available through authorized distributors and component brokers, but designers starting new projects should evaluate Spartan-6, Artix-7, or newer Xilinx families for long-term availability.

Q: What programming software do I need? Use Xilinx ISE Design Suite 14.7 for synthesis, implementation, and bitstream generation. This is the last version to officially support the Spartan-3 family and is available free of charge.

Q: Can I use a JTAG programmer to configure the XC3S400-4FG320C? Yes. The device supports IEEE 1149.1 JTAG configuration and boundary scan. Compatible programmers include the Xilinx Platform Cable USB II and compatible third-party JTAG tools.

Q: What voltage does the XC3S400-4FG320C core require? The core (VCCINT) requires 1.2 V. I/O banks (VCCO) can range from 1.2 V to 3.3 V depending on the I/O standard in use. An auxiliary supply (VCCAUX) of 2.5 V is also required.


Summary

The XC3S400-4FG320C is a well-documented, cost-effective FPGA that delivers 400K system gates, 288 Kb of block RAM, 16 hardware multipliers, and 4 DCMs in a compact 15 × 15 mm BGA package. Its broad I/O standard support and -4 speed grade make it a versatile choice for embedded control, DSP, and communications applications. While the Spartan-3 family is mature, the XC3S400-4FG320C remains a dependable solution for both legacy system maintenance and new designs where proven silicon and comprehensive documentation are priorities.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.