Contact Sales & After-Sales Service

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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC3S200-5VQG100C: Xilinx Spartan-3 FPGA – Full Product Description & Specifications

Product Details

The XC3S200-5VQG100C is a high-performance, cost-optimized Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-3 family. Manufactured on advanced 90nm CMOS process technology, this device delivers 200,000 system gates in a compact 100-pin VQFP package — making it an ideal choice for high-volume, cost-sensitive digital design applications. Whether you’re developing consumer electronics, telecommunications equipment, or industrial control systems, the XC3S200-5VQG100C offers the flexibility and performance of a Xilinx FPGA at an accessible price point.


What Is the XC3S200-5VQG100C?

The XC3S200-5VQG100C belongs to Xilinx’s Spartan-3 FPGA family — one of the most widely adopted low-cost FPGA platforms in the semiconductor industry. The part number decodes as follows:

Part Number Segment Meaning
XC3S Spartan-3 Series
200 200,000 System Gates
-5 Speed Grade 5 (Highest Performance)
VQ VQFP Package Type
G Pb-Free (RoHS Compliant)
100 100-Pin Package
C Commercial Temperature Range (0°C to +85°C)

The “-5” speed grade designates this as the fastest available speed grade in the Spartan-3 lineup, delivering a maximum system clock frequency of up to 725 MHz — ideal for performance-critical applications.


XC3S200-5VQG100C Key Specifications

General Electrical Specifications

Parameter Value
Part Number XC3S200-5VQG100C
Series Spartan-3
Manufacturer Xilinx (AMD)
Technology Node 90nm CMOS
System Gates 200,000
Logic Cells / Slices 4,320
Configurable Logic Blocks (CLBs) 480
Maximum System Clock 725 MHz
Core Supply Voltage (VCCINT) 1.14V – 1.26V (nominal 1.2V)
I/O Supply Voltage (VCCO) Up to 3.3V
Total RAM Bits 221,184
User I/O Pins 63
Operating Temperature (TJ) 0°C to +85°C (Commercial)
RoHS Compliance Yes (Pb-Free, “G” suffix)

Package Specifications

Parameter Value
Package Type VQFP (Very Thin Quad Flat Pack)
Pin Count 100
Package Dimensions 14mm × 14mm
Lead Form Gull Wing (Surface Mount)
Packaging Tray
Mounting Type Surface Mount Technology (SMT)

XC3S200-5VQG100C Internal Architecture

Configurable Logic Blocks (CLBs) and Slices

The XC3S200-5VQG100C features 480 CLBs containing 4,320 logic cells. Each CLB consists of four slices, and each slice includes:

  • Two 4-input Look-Up Tables (LUTs)
  • Two storage elements (flip-flops or latches)
  • Dedicated carry logic for fast arithmetic operations
  • Wide-function multiplexers

The LUTs on left-hand slices can be configured as Distributed RAM or 16-bit shift registers (SRL16), providing additional memory and pipeline flexibility without consuming block RAM resources.

Block RAM

Resource Detail
Block RAM Columns 2
Block RAM Blocks 12
Block RAM Size per Block 18 Kb
Total Block RAM 216 Kb (221,184 bits)
Port Structure True Dual-Port
Supported Widths ×1, ×2, ×4, ×9, ×18, ×36

Each block RAM supports independent dual-port access, allowing simultaneous reads and writes on separate ports at different clock frequencies — an important feature for FIFO buffers, memory interfaces, and DSP pipelines.

Dedicated Multipliers

The Spartan-3 XC3S200 includes 12 dedicated 18×18-bit hardware multipliers, each paired with a block RAM column. These hardened multipliers accelerate DSP operations like digital filters, FFTs, and arithmetic-intensive algorithms without consuming CLB resources.

Digital Clock Manager (DCM)

DCM Feature Value
Number of DCMs 4
Supported Functions Clock synthesis, deskew, phase shifting
Frequency Synthesis Yes
Phase Shift Resolution 1/256 of clock period

The four Digital Clock Managers (DCMs) provide flexible clock synthesis and management, enabling precise phase adjustment, frequency multiplication/division, and clock deskewing across the device.


I/O Capabilities of the XC3S200-5VQG100C

I/O Bank Structure

The 100-pin VQFP package provides 63 user I/O pins organized into multiple I/O banks. Each bank is powered independently, allowing different voltage standards to coexist on the same device.

Note: DCI (Digitally Controlled Impedance) signal standards are not supported in Bank 5 of the VQ100 package.

Supported I/O Standards

I/O Standard Type
LVTTL Single-Ended
LVCMOS 3.3V / 2.5V / 1.8V / 1.5V Single-Ended
HSTL Class I, II, III, IV Single-Ended & Differential
SSTL2 / SSTL18 Class I & II Single-Ended & Differential
LVDS Differential
LVPECL Differential
PCI / PCI-X Single-Ended

The XC3S200-5VQG100C supports both single-ended and differential I/O standards, enabling seamless integration with a wide variety of memory interfaces, communication buses, and high-speed serial links.


Configuration Modes

The XC3S200-5VQG100C supports multiple configuration modes to fit different system architectures:

Configuration Mode Description
Master Serial FPGA drives clock; reads from serial PROM
Slave Serial External device drives configuration
Master Parallel (SelectMAP) Fast 8-bit parallel configuration
Slave Parallel External microcontroller drives 8-bit bus
JTAG (Boundary Scan) IEEE 1149.1 compliant debug and config

Configuration data is stored in reprogrammable static CMOS configuration latches (CCLs), which are loaded on every power-up from an external non-volatile source such as a serial PROM, SPI Flash, or parallel NOR Flash.


XC3S200-5VQG100C Ordering Information & Variants

Understanding the speed grade and temperature range options helps buyers select the correct variant for their application:

Part Number Speed Grade Temperature Range Package RoHS
XC3S200-5VQG100C -5 (Fastest) Commercial (0°C to 85°C) 100-VQFP Yes
XC3S200-4VQG100C -4 Commercial (0°C to 85°C) 100-VQFP Yes
XC3S200-4VQ100C -4 Commercial (0°C to 85°C) 100-VQFP No
XC3S200-4VQ100I -4 Industrial (−40°C to 100°C) 100-VQFP No
XC3S200-5VQ100C -5 (Fastest) Commercial (0°C to 85°C) 100-VQFP No

The “G” in the part number (XC3S200-5VGQ100C) denotes a Pb-free, RoHS-compliant package — important for compliance with modern environmental regulations in consumer and industrial electronics.


Typical Applications

The XC3S200-5VQG100C’s combination of low cost, flexible I/O, and built-in DSP resources makes it suitable for a broad range of applications:

#### Consumer Electronics

  • Digital television set-top boxes
  • Home networking equipment
  • Display and projection controllers
  • Broadband access modems

#### Telecommunications

  • Line cards and protocol converters
  • Network interface controllers
  • Optical transceiver control

#### Industrial & Embedded Control

  • Motor control and servo drives
  • PLC (Programmable Logic Controller) designs
  • Industrial sensor interfacing
  • Machine vision systems

#### Prototyping & ASIC Replacement

  • Replacing mask-programmed ASICs with field-updatable logic
  • Rapid prototyping of digital designs
  • FPGA-based testing and emulation

Why Choose the XC3S200-5VQG100C?

#### Cost-Effective High Performance

The Spartan-3 family was purpose-built for high-volume, cost-sensitive applications. Despite its low cost, the XC3S200-5VQG100C delivers functionality comparable to much more expensive FPGAs of an earlier generation, thanks to Xilinx’s 90nm process technology.

#### Pb-Free & RoHS Compliant

The “G” suffix confirms full RoHS-3 compliance, meeting global environmental standards for lead-free manufacturing — essential for products destined for EU, Chinese, and other regulated markets.

#### Flexible Clock Architecture

With four DCMs and a maximum clock of 725 MHz, designers can implement complex multi-clock domain systems with precision phase control — a significant advantage over simpler CPLD or ASIC solutions.

#### Field Upgradability

Unlike mask-programmed ASICs, the XC3S200-5VQG100C can be reconfigured in the field without hardware replacement, reducing the cost and time associated with design revisions.

#### Strong Ecosystem Support

The XC3S200-5VQG100C is supported by Xilinx ISE Design Suite, which provides synthesis, simulation, place-and-route, and programming tools. Board-level support is available through community platforms such as Basys, Nexys, and custom designs.


XC3S200-5VQG100C vs. XC3S200A-5VQG100C: Key Differences

Buyers sometimes confuse the Spartan-3 and Spartan-3A variants. Here is a comparison:

Feature XC3S200-5VQG100C (Spartan-3) XC3S200A-5VQG100C (Spartan-3A)
Family Spartan-3 Spartan-3A
System Gates 200,000 200,000
Logic Cells 4,320 4,032
Total RAM Bits 221,184 294,912
Max Frequency 725 MHz 770 MHz
User I/Os (VQ100) 63 68
Technology 90nm 90nm
Core Voltage 1.2V 1.2V

The Spartan-3A variant offers more RAM bits and slightly higher I/O count in the same package. Choose based on your specific memory and I/O requirements.


Development Tools & Support

Tool Description
Xilinx ISE Design Suite Primary synthesis, implementation & programming tool
ModelSim / ISIM HDL simulation and functional verification
JTAG Programmer In-system programming and debug via JTAG
ChipScope Pro On-chip logic analysis tool
XST (Xilinx Synthesis Tool) Integrated logic synthesis within ISE

Xilinx ISE Design Suite remains the recommended toolchain for all Spartan-3 family devices. Vivado Design Suite does not support Spartan-3 devices; ISE should be used for all XC3S200-series designs.


Summary

The XC3S200-5VQG100C is a proven, production-ready Xilinx Spartan-3 FPGA delivering 200K gates, 63 user I/Os, 221Kb of block RAM, four DCMs, and 12 hardware multipliers — all in a compact 100-pin VQFP package. Its speed grade -5 designation ensures maximum performance headroom, while the Pb-free “G” package meets modern RoHS requirements. From consumer electronics and broadband equipment to industrial control and ASIC replacement, the XC3S200-5VQG100C remains a highly versatile and cost-effective programmable logic solution.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.