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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
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Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XC3S200-5VQ100C: Xilinx Spartan-3 FPGA — Complete Product Guide

Product Details

The XC3S200-5VQ100C is a high-performance, cost-optimized Field Programmable Gate Array (FPGA) from Xilinx (now AMD), part of the popular Spartan-3 family. Designed for high-volume, cost-sensitive applications, this device delivers 200K system gates in a compact 100-pin VQFP package — making it one of the most versatile Xilinx FPGA solutions available for embedded, industrial, and consumer electronics designs.


What Is the XC3S200-5VQ100C?

The XC3S200-5VQ100C is a commercial-grade, speed grade -5 variant of the Xilinx Spartan-3 XC3S200 FPGA, built on 90nm CMOS process technology. It operates at a core supply voltage of 1.2V and supports up to 63 user I/O pins within its 100-pin VTQFP (Very-thin Quad Flat Package) footprint.

This device sits at the entry-level of the Spartan-3 family, offering a powerful combination of logic capacity, on-chip memory, and clock management features — all at an industry-leading price point. It is widely used for prototyping, signal processing, embedded control, and digital interface bridging.


XC3S200-5VQ100C Key Specifications

General Overview

Parameter Value
Part Number XC3S200-5VQ100C
Manufacturer Xilinx (AMD)
Series Spartan-3
Logic Gates 200,000 (200K)
Logic Cells (CLBs) 4,320
Configurable Logic Blocks (CLBs) 480
User I/O Pins 63
Package 100-Pin VTQFP (VQFP)
Speed Grade -5 (High Performance)
Process Technology 90nm
Core Voltage (VCC) 1.2V (1.14V – 1.26V)
Temperature Range 0°C to +85°C (Commercial)
RoHS Compliance Yes
Mounting Type Surface Mount (SMD)

Memory & Logic Resources

Resource Quantity
Total RAM Bits 221,184
Block RAM Blocks (18Kb each) 12
Dedicated Multipliers (18×18) 12
Digital Clock Managers (DCMs) 4
Maximum Distributed RAM 28Kb

I/O & Electrical Characteristics

Parameter Value
User I/O Pins 63
Maximum System I/O Clock 725 MHz
VCCO Supply Voltage 1.2V / 1.8V / 2.5V / 3.3V
Supported I/O Standards LVTTL, LVCMOS, PCI, SSTL, HSTL, LVDS, LVPECL
Differential I/O Pairs Supported
Programmable Drive Strength 2mA – 24mA
Input Hysteresis Optional (Schmitt Trigger)

Package Details

Parameter Value
Package Type VTQFP (Very-Thin Quad Flat Pack)
Pin Count 100
Package Dimensions 14mm × 14mm
Lead Pitch 0.5mm
Height 1.0mm (max)
Lead Finish Tin/Lead (SnPb)

XC3S200-5VQ100C Part Number Decoder

Understanding the ordering code helps engineers quickly identify the exact variant:

Code Segment Meaning
XC Xilinx commercial FPGA
3S Spartan-3 family
200 200K system gate density
-5 Speed grade -5 (highest performance in Spartan-3)
VQ VTQFP (Very-thin Quad Flat Pack) package
100 100 total pin count
C Commercial temperature range (0°C to +85°C)

Architecture Deep Dive: Five Functional Elements

Configurable Logic Blocks (CLBs)

The XC3S200-5VQ100C contains 480 CLBs, each made up of four logic slices. Every slice includes two 4-input Look-Up Tables (LUTs), two storage elements (registers or latches), fast carry logic, and wide-function multiplexers. This allows efficient implementation of combinational logic, arithmetic, and sequential circuits.

Block RAM

The device integrates 12 independent 18Kb dual-port block RAM blocks, totaling 221,184 bits of on-chip storage. Each block RAM supports configurable aspect ratios, true dual-port access, and optional output registers. Multiple blocks can be cascaded for deeper or wider memory configurations — essential for FIFO buffers, lookup tables, and embedded processor data storage.

Dedicated Hardware Multipliers

Twelve 18×18-bit dedicated multipliers are tightly coupled to the block RAM array, enabling high-throughput DSP functions such as FIR filters, FFTs, and signal correlation without consuming CLB resources.

Digital Clock Managers (DCMs)

Four fully digital DCMs provide on-chip clock management, including:

  • Clock frequency synthesis (multiply/divide)
  • Clock deskew and phase shifting
  • Duty cycle correction
  • Phase-lock to an external clock source

DCMs support a wide input frequency range and provide stable, jitter-minimized clock networks for system synchronization.

SelectIO™ Input/Output Blocks (IOBs)

Each user I/O pin is controlled by a sophisticated SelectIO™ IOB, which supports a wide range of single-ended and differential I/O standards. The IOBs include programmable input delays, optional Schmitt trigger input hysteresis, slew rate control, and configurable drive strength — making the XC3S200-5VQ100C compatible with most modern board-level interfaces.


Configuration Modes

The XC3S200-5VQ100C supports multiple configuration modes to suit different system requirements:

Configuration Mode Interface Typical Use Case
Master Serial 1-bit SPI-like Low-cost PROM-based boot
Slave Serial 1-bit external clock Daisy-chain or processor-controlled
Master Parallel (SelectMAP) 8-bit parallel Fast configuration
Slave Parallel (SelectMAP) 8-bit parallel Processor-controlled configuration
Boundary Scan (JTAG) IEEE 1149.1 In-system programming and testing

Configuration data is stored externally in a serial PROM or parallel flash memory and loaded into reprogrammable static CMOS configuration latches (CCLs) on power-up.


Supported I/O Standards

The XC3S200-5VQ100C supports a comprehensive range of I/O voltage standards:

I/O Standard Type VCCO Required
LVCMOS33 Single-ended 3.3V
LVCMOS25 Single-ended 2.5V
LVCMOS18 Single-ended 1.8V
LVCMOS12 Single-ended 1.2V
LVTTL Single-ended 3.3V
PCI / PCI-X Single-ended 3.3V
SSTL2 / SSTL18 Differential 2.5V / 1.8V
HSTL Differential 1.5V / 1.8V
LVDS Differential 2.5V
LVPECL Differential 2.5V/3.3V

Typical Application Areas

#### Embedded Control Systems

The XC3S200-5VQ100C is ideal for implementing custom embedded processors (e.g., MicroBlaze soft-core) and peripheral controllers in industrial automation and robotics platforms.

#### Broadband Access & Home Networking

Its high I/O count, flexible clock management, and low cost make it a natural fit for broadband access equipment, DSL line cards, and Ethernet switches.

#### Display & Projection Systems

With fast I/O timing, DCMs for pixel clock generation, and sufficient logic for display control, this FPGA is widely used in LCD controllers, video scalers, and projection systems.

#### Digital Television & Set-Top Boxes

The combination of block RAM, dedicated multipliers, and SelectIO™ interfaces enables digital video decoding and transport stream processing in DTV and IPTV equipment.

#### Test & Measurement Equipment

Engineers leverage the JTAG interface, flexible I/O standards, and logic capacity for implementing protocol analyzers, signal generators, and automated test equipment (ATE) glue logic.

#### ASIC Prototyping & Bridge Logic

As a superior alternative to mask-programmed ASICs, the XC3S200-5VQ100C allows field-upgradable logic without hardware replacement — reducing development risk and time-to-market.


XC3S200-5VQ100C vs. Comparable Spartan-3 Variants

Part Number Gates I/O Pins Package Speed Grade Temp Range
XC3S200-5VQ100C 200K 63 100-VQFP -5 Commercial
XC3S200-4VQ100C 200K 63 100-VQFP -4 Commercial
XC3S200-5TQG144C 200K 97 144-TQFP -5 Commercial
XC3S200-5FT256C 200K 141 256-FTBGA -5 Commercial
XC3S50-5VQ100C 50K 33 100-VQFP -5 Commercial
XC3S400-5TQ144C 400K 97 144-TQFP -5 Commercial

The XC3S200-5VQ100C offers the highest speed grade (-5) in the smallest package of the 200K-gate Spartan-3 family, making it the optimal choice when board real estate is at a premium.


Development & Design Tools

Designers working with the XC3S200-5VQ100C can use the following Xilinx (AMD) tools:

Tool Purpose
Xilinx ISE Design Suite Primary synthesis, implementation, and bitstream generation
PlanAhead Floorplanning and constraint management
ChipScope Pro In-system logic analysis and debugging
iMPACT Device programming and JTAG configuration
CORE Generator Instantiate pre-built IP cores (memory, DSP, interfaces)
MicroBlaze Soft Processor 32-bit embedded CPU for FPGA-based SoC designs

Note: For new designs, AMD recommends evaluating the newer Spartan-7 family (XC7S) for enhanced performance and longer-term availability.


Ordering Information

Attribute Detail
Manufacturer Part Number XC3S200-5VQ100C
Manufacturer AMD (Xilinx)
Digi-Key Part Number 122-1336-ND
Product Category Embedded – FPGAs
Series Spartan-3
Operating Temperature 0°C ~ 85°C
Package / Case 100-VQFP
Supplier Device Package 100-VTQFP (14×14)

Frequently Asked Questions (FAQ)

Q: What is the difference between XC3S200-5VQ100C and XC3S200-4VQ100C? The only difference is the speed grade. The “-5” variant operates at a higher maximum frequency (725 MHz system clock) compared to the “-4” variant, making it suitable for more timing-critical designs.

Q: Is the XC3S200-5VQ100C still in production? This device has limited ongoing production and is considered a mature product. Engineers designing new systems are advised to check current stock availability or consider migration to Xilinx Spartan-7 devices.

Q: What programming software is needed for XC3S200-5VQ100C? The device is programmed using Xilinx ISE Design Suite with the iMPACT programming tool. JTAG-based in-system programming via an Xilinx Platform Cable USB or Digilent JTAG-HS2 is the most common approach.

Q: Can the XC3S200-5VQ100C run a soft-core processor? Yes. With 4,320 logic cells and 221,184 bits of block RAM, the device has sufficient resources to run a MicroBlaze 32-bit soft processor with limited peripherals, suitable for control and communication applications.

Q: What is the power consumption of the XC3S200-5VQ100C? Typical core power depends heavily on toggle rates and logic utilization. Static power is very low due to the 90nm process. Xilinx’s XPower Analyzer tool provides accurate power estimates based on the specific design.


Summary

The XC3S200-5VQ100C is a proven, reliable FPGA that combines 200K gates of programmable logic, 221Kb of block RAM, 12 hardware multipliers, 4 DCMs, and 63 flexible I/O pins in a compact 100-pin VQFP surface-mount package. Its speed grade -5 rating ensures the highest performance available in the Spartan-3 200K family, while its commercial temperature rating and mature process technology guarantee production-quality reliability.

Whether you are developing broadband access equipment, consumer electronics, embedded controllers, or ASIC prototypes, the XC3S200-5VQ100C delivers outstanding functionality-per-dollar — a hallmark of the entire Spartan-3 FPGA portfolio.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.