The XC3S1500-5FG456C is a high-performance, cost-optimized field-programmable gate array from the Xilinx Spartan-3 family (now under AMD). Designed for high-volume, price-sensitive applications, this FPGA delivers 1.5 million system gates, 26,624 logic cells, and a 456-pin Fine-pitch Ball Grid Array (FBGA) package — making it an ideal choice for embedded systems, digital signal processing, and telecommunications design. Whether you are prototyping or moving to production, the XC3S1500-5FG456C offers exceptional logic density, flexible I/O, and reliable performance at an accessible price point.

For engineers sourcing programmable logic devices, explore our full range of Xilinx FPGA solutions to find the right fit for your project.

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XC3S1500-5FG456C Key Specifications at a Glance

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What Is the XC3S1500-5FG456C? Understanding the Spartan-3 Family

The XC3S1500-5FG456C belongs to Xilinx’s Spartan-3 FPGA family, a generation of devices specifically engineered to bring reconfigurable logic to cost-sensitive, high-volume markets. The Spartan-3 architecture introduced a 90 nm process technology with a host of improvements over earlier Spartan generations, including dedicated multiplier blocks, larger block RAMs, and improved digital clock management (DCM).

The “XC3S1500” portion of the part number designates the Spartan-3 device with 1.5 million equivalent system gates. The “-5” suffix indicates the speed grade (with -5 being the fastest in the Spartan-3 commercial range), and “FG456” refers to the 456-ball Fine-pitch BGA package. The trailing “C” denotes commercial temperature grade (0°C to +85°C).

Why Choose the Spartan-3 FPGA for Your Design?

The Spartan-3 family was groundbreaking for delivering ASIC-like density at FPGA flexibility. The XC3S1500-5FG456C is particularly compelling because it provides:

• A large logic fabric suitable for complex state machines, bus interfaces, and control logic
• Dedicated 18×18 multiplier blocks that accelerate DSP tasks without consuming CLB resources
• Flexible, multi-standard I/O supporting LVTTL, LVCMOS, HSTL, SSTL, and more
• Four Digital Clock Managers (DCMs) for clock synthesis, phase shifting, and deskewing
• Abundant block RAM for buffering, FIFOs, and look-up tables

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Detailed Technical Specifications

Logic Resources

Memory Resources

Clock and DSP Resources

I/O and Package Details

Power Supply Requirements

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XC3S1500-5FG456C Speed Grade and Timing

The -5 speed grade is the highest (fastest) commercial speed grade available in the Spartan-3 family, making the XC3S1500-5FG456C the best choice when timing margins are tight. Representative performance figures for the -5 grade include:

Note: Actual timing depends on design complexity, place-and-route results, and operating conditions. Always verify against the Xilinx XC3S1500 data sheet and generated timing reports.

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Package Information: 456-FBGA (FG456)

The FG456 package uses a Fine-pitch Ball Grid Array with 456 solder balls arranged on a 1.00 mm pitch grid. This package style is favored in space-constrained PCB designs where a smaller footprint is essential, and it supports high-density routing with modern PCB fabrication techniques.

PCB Design Tips for the FG456 Package:

• Use a minimum of 4-layer PCB to properly route power, ground, and signal planes.
• Follow Xilinx package application notes for recommended via styles (dog-bone or in-pad via).
• Pay attention to the 1.00 mm ball pitch when selecting solder paste stencil thickness (typically 0.12–0.15 mm).
• Decouple VCCINT and VCCIO pins with 100 nF ceramic capacitors placed as close as possible to each power pin.

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XC3S1500-5FG456C vs. Other Spartan-3 Devices

Understanding how the XC3S1500 compares to adjacent devices in the family helps designers select the right density for their application.

The XC3S1500-5FG456C occupies a sweet spot: larger than mid-range Spartan-3 devices but contained within the popular 456-ball package also shared with the XC3S2000, allowing pin-compatible design migration to higher density if needed.

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Supported I/O Standards

The Spartan-3 I/O banks support a wide range of single-ended and differential signaling standards, enabling the XC3S1500-5FG456C to interface with virtually any modern digital peripheral or processor.

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Digital Clock Management (DCM) in the XC3S1500-5FG456C

What Is a DCM?

The four Digital Clock Managers (DCMs) in the XC3S1500 provide fully digital clock control with no analog components. Each DCM can:

• Eliminate clock skew across the chip by deskewing the feedback path
• Multiply or divide the input clock frequency using a programmable ratio
• Phase-shift the output clock in fine steps (as small as 1/256th of the clock period)
• Generate quadrature clocks (0°, 90°, 180°, 270°) from a single source
• Detect clock failure and optionally switch to a backup clock source

DCMs make the XC3S1500-5FG456C well-suited for designs that need precise, phase-aligned, or synthesized clocks — including DDR memory interfaces, high-speed serial communications, and multi-clock-domain SoC designs.

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Typical Applications for the XC3S1500-5FG456C

The XC3S1500-5FG456C is deployed across a broad set of markets and applications due to its combination of logic density, dedicated DSP resources, flexible I/O, and competitive cost:

Embedded Systems and SoC Prototyping

• Soft processor cores (MicroBlaze, PicoBlaze) for custom SoC development
• Peripheral expansion for microprocessor-based boards (SPI, I2C, UART, custom buses)
• Glue logic replacement for legacy board designs

Digital Signal Processing (DSP)

• FIR and IIR digital filters using the 32 dedicated multiplier blocks
• FFT accelerators for audio and baseband processing
• Motor control algorithms (FOC, PWM generation)

Communications and Networking

• Physical layer interface control (LVDS, HSTL-based buses)
• Protocol bridging (PCIe legacy bridging, multi-protocol interfaces)
• Packet processing and routing logic

Industrial and Medical

• Real-time control planes for industrial automation
• Data acquisition front ends
• Image processing pipelines

Consumer Electronics

• Display controller logic
• Set-top box and multimedia processing
• Interface standardization between mixed-voltage subsystems

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Development Tools and Design Flow

Xilinx ISE Design Suite

The XC3S1500-5FG456C is fully supported by Xilinx ISE Design Suite (specifically ISE 14.7, the final ISE release). The design flow includes:

1. Design Entry: VHDL, Verilog, or schematic capture in ISE Project Navigator
2. Synthesis: XST (Xilinx Synthesis Technology) or third-party synthesizers (Synplify, Precision)
3. Implementation: Map, Place & Route (PAR), and timing analysis (TRCE)
4. Bitstream Generation: .bit file for direct JTAG programming or .mcs for flash configuration
5. Simulation: ISim or ModelSim for functional and timing simulation

Configuration Modes

The XC3S1500-5FG456C supports multiple configuration modes:

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Ordering Information and Part Number Breakdown

Understanding the Xilinx part numbering convention helps confirm you are ordering exactly the right device.

Full Part Number: XC3S1500-5FG456C

Related Part Numbers

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Absolute Maximum Ratings

⚠️ Warning: Exceeding absolute maximum ratings may permanently damage the device. These are stress ratings only, not operating conditions.

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Frequently Asked Questions (FAQ)

Q: Is the XC3S1500-5FG456C still in production? A: The Spartan-3 family has reached end-of-life (EOL) for new production orders from AMD/Xilinx. However, the XC3S1500-5FG456C remains widely available through authorized distributors and component brokers for maintenance, repair, and last-time-buy purposes.

Q: Can I replace an XC3S1500-4FG456C with an XC3S1500-5FG456C? A: Yes. The -5 speed grade is pin-compatible and functionally identical to the -4. The -5 part meets all timing requirements of the -4 and is a drop-in replacement.

Q: What software do I need to program the XC3S1500-5FG456C? A: Xilinx ISE Design Suite 14.7 (free WebPACK edition supports the Spartan-3 family). For programming, use iMPACT (included in ISE) with a Xilinx Platform Cable USB or compatible JTAG programmer.

Q: Can the XC3S1500-5FG456C be used in an industrial temperature application? A: The “C” suffix denotes commercial grade (0°C to +85°C). For industrial temperatures (-40°C to +100°C), specify the XC3S1500-5FG456I instead.

Q: What is the difference between the FG456 and FG676 packages for the XC3S1500? A: Both contain the same silicon. The FG676 (676-ball BGA) exposes more I/O pins (up to 487 vs. 333) and is used when the design requires a large number of user I/O. The FG456 is preferred for smaller PCB footprints.

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Summary

The XC3S1500-5FG456C is a mature, proven FPGA that delivers 1.5 million system gates, 26,624 logic cells, 576 Kb of block RAM, 32 dedicated multipliers, and 333 user I/O pins in a compact 456-ball FBGA package. Operating at the fastest commercial speed grade (-5) on a 1.2 V core supply, it is well-suited for embedded control, DSP, communications bridging, and industrial applications. Its pin compatibility with the XC3S2000-5FG456C also provides a straightforward path to higher density when design requirements grow.

For a broader selection of programmable logic devices and expert sourcing support, visit Xilinx FPGA.