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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XC3S1500-5FGG320C: Xilinx Spartan-3 FPGA with 1.5M Gates in 320-Pin FBGA Package

Product Details

The XC3S1500-5FGG320C is a high-performance, cost-optimized Field Programmable Gate Array (FPGA) from Xilinx (now AMD), belonging to the industry-proven Spartan-3 family. Featuring 1.5 million system gates, 29,952 logic cells, and a compact 320-pin Fine-pitch Ball Grid Array (FBGA) package, this device is engineered for high-volume, cost-sensitive consumer and industrial electronics applications. Whether you’re designing broadband access equipment, home networking devices, digital displays, or embedded control systems, the XC3S1500-5FGG320C delivers outstanding logic density, flexible I/O, and robust clock management — all at a competitive price point.

As part of the broader Xilinx FPGA portfolio, the Spartan-3 family continues to serve designers who need reliable, field-upgradeable logic without the high NRE costs of custom ASICs.


What Is the XC3S1500-5FGG320C?

The XC3S1500-5FGG320C is a Spartan-3 series FPGA manufactured by Xilinx using 90nm process technology. It is powered at 1.2V core voltage and operates at up to 725 MHz internal clock frequency, making it suitable for demanding signal processing, control, and interface applications. The “5” in its part number denotes the commercial speed grade, and the “FGG320” refers to its 320-pin lead-free Fine-pitch BGA (FBGA) package measuring 19 × 19 mm.

This device builds on the success of the earlier Spartan-IIE family by expanding logic resources, increasing internal RAM capacity, broadening I/O flexibility, and improving digital clock management — all while maintaining the low-cost DNA of the Spartan product line.


XC3S1500-5FGG320C Key Specifications

Parameter Value
Manufacturer Xilinx (AMD)
Part Number XC3S1500-5FGG320C
FPGA Family Spartan-3
System Gates 1,500,000
Logic Cells 29,952
Process Technology 90nm CMOS
Core Supply Voltage 1.2V
Internal Clock Frequency Up to 725 MHz
User I/O Pins 221
Package 320-Pin FBGA (19 × 19 mm)
Package Code FGG320
Speed Grade -5 (Commercial)
Operating Temperature 0°C to +85°C
RoHS / Lead-Free Yes
Mounting Style SMD/SMT
ECCN Code 3A991.D

XC3S1500-5FGG320C Logic and Memory Resources

The XC3S1500-5FGG320C provides an extensive set of programmable logic and memory resources, making it one of the most capable mid-range devices in the Spartan-3 lineup.

Logic Resources

Resource Specification
System Gates 1,500,000
Logic Cells (CLBs) 29,952
Flip-Flops 53,712
4-input LUTs 26,624
Dedicated 18×18 Multipliers 32
Maximum Shift Register Length 16 bits per LUT
Fast Look-Ahead Carry Logic Yes
Wide Multiplexers Yes

Memory Resources

Memory Type Capacity
Total Block RAM Up to 576 Kbits
Distributed RAM Up to 208 Kbits
Total On-Chip RAM Up to 784 Kbits
Block RAM Configuration 18Kb per block
Block RAM Width Configurable (1–36 bits)

I/O and Interface Capabilities

The XC3S1500-5FGG320C in the FGG320 package provides 221 user I/O pins with broad support for modern signal standards.

I/O Standards Supported

Standard Type Supported Standards
Single-Ended LVCMOS 1.8V/2.5V/3.3V, LVTTL, PCI, GTL, HSTL, SSTL
Differential LVDS, RSDS, LVPECL, BLVDS, MLVDS
Total Single-Ended Standards 18
Total Differential Standards 8
Data Transfer Rate 622+ Mb/s per I/O
Signal Swing Range 1.14V to 3.465V
DDR Support DDR, DDR2 SDRAM up to 333 Mb/s
Impedance Control Digitally Controlled Impedance (DCI)

SelectIO™ Technology

The XC3S1500-5FGG320C uses Xilinx SelectIO™ interface technology, which enables each I/O bank to be independently configured for different voltage standards. This makes it easy to interface with a wide range of external devices such as microprocessors, memory chips, and communications ICs without external level shifters.


Clock Management Features

Digital Clock Manager (DCM)

One of the most powerful features of the XC3S1500-5FGG320C is its integrated Digital Clock Manager (DCM) subsystem, which provides:

DCM Feature Description
Number of DCMs Up to 4
Clock Skew Elimination Yes — zero-delay buffering
Frequency Synthesis Yes — multiply/divide clocks
Phase Shifting High-resolution, fine-grained
Duty Cycle Correction Yes
Global Clock Lines 8 dedicated global clock lines
DLL Lock Time Fast lock across temperature range

The DCM ensures that internal clock trees remain perfectly aligned across the chip, eliminating skew between synchronized flip-flops. This is particularly valuable in high-speed memory interfaces, communications protocols, and multi-clock domain designs.


Part Number Decoder: Understanding XC3S1500-5FGG320C

Field Value Meaning
XC XC Xilinx Component
3S 3S Spartan-3 Family
1500 1500 1.5M System Gates
-5 -5 Speed Grade (Commercial: fastest)
FGG FGG Fine-pitch Ball Grid Array (Lead-Free)
320 320 320 Pin Count
C C Commercial Temperature Range (0°C to +85°C)

XC3S1500-5FGG320C vs. Other Spartan-3 Variants

Understanding how the XC3S1500-5FGG320C compares to its siblings helps engineers select the right device for their design.

Parameter XC3S1500-5FGG320C XC3S1000-5FGG320C XC3S2000-5FGG456C
System Gates 1,500,000 1,000,000 2,000,000
Logic Cells 29,952 17,280 46,080
Block RAM 576 Kbits 432 Kbits 720 Kbits
User I/O (this pkg) 221 221
Package 320 FBGA 320 FBGA 456 FBGA
Speed Grade -5 -5 -5
Core Voltage 1.2V 1.2V 1.2V

Typical Applications for the XC3S1500-5FGG320C

The XC3S1500-5FGG320C is a proven solution across a broad range of embedded and consumer markets:

Consumer Electronics

  • Digital television (DTV) and set-top boxes
  • Display and projection systems
  • Home networking appliances
  • Broadband access modems and routers

Industrial & Embedded Systems

  • Motor control and industrial automation
  • Pro audio/video signal processing
  • Test and measurement equipment
  • Embedded processor implementations (MicroBlaze soft core)

Communications

  • Ethernet MAC and switching logic
  • Protocol bridging and conversion (UART, SPI, I2C, USB)
  • Wireless infrastructure signal processing

Automotive (ADAS)

  • Advanced Driver Assistance Systems (ADAS)
  • In-vehicle networking and gateway modules

Why Choose the XC3S1500-5FGG320C Over an ASIC?

The Spartan-3 FPGA architecture provides a compelling advantage over traditional mask-programmed ASICs:

Factor ASIC XC3S1500-5FGG320C FPGA
NRE Cost High ($500K–$5M+) None
Development Time 6–18 months Days to weeks
Field Upgradability Not possible Yes, via bitstream reload
Design Risk High (one-shot) Low (iterative)
Volume Break-Even Very high Low
Time-to-Market Slow Fast

Development Tools and Design Support

The XC3S1500-5FGG320C is fully supported by Xilinx’s official design toolchains:

Xilinx ISE Design Suite

The Xilinx ISE (Integrated Software Environment) is the primary design tool for Spartan-3 devices. It includes synthesis, implementation, simulation, and configuration tools. ISE supports all popular HDL languages including VHDL and Verilog.

Soft Processor Support

The XC3S1500-5FGG320C has sufficient logic resources to instantiate Xilinx’s MicroBlaze soft-core 32-bit RISC processor, enabling complete embedded system designs within the FPGA fabric.

JTAG Programming

The device supports IEEE 1149.1/1532 JTAG for boundary-scan testing and in-system programming, simplifying board-level debug and production test.


Ordering and Compliance Information

Attribute Details
Part Number XC3S1500-5FGG320C
Manufacturer Xilinx / AMD
RoHS Compliant Yes (Lead-Free)
Pb-Free Yes
Moisture Sensitivity Level (MSL) Yes (see datasheet)
ECCN Code 3A991.D
HTS Code Available on request
Lifecycle Status Active
Datasheet Available from AMD/Xilinx official site

Frequently Asked Questions (FAQ)

What is the difference between XC3S1500-5FGG320C and XC3S1500-5FG320C?

The “FGG320” and “FG320” designations both refer to 320-pin FBGA packages. The “FGG” explicitly designates a lead-free (RoHS compliant) package variant, while “FG” may refer to an earlier version. Always specify FGG320 for new designs requiring RoHS compliance.

Is the XC3S1500-5FGG320C still in production?

The Spartan-3 family is currently in an active/end-of-life transition status. Sufficient stock remains available through authorized distributors. For new designs, Xilinx recommends evaluating newer families such as Spartan-6 or Artix-7.

What software do I need to program the XC3S1500-5FGG320C?

You need Xilinx ISE Design Suite (version 14.x is the last to support Spartan-3). The device is programmed via JTAG using the Xilinx Platform Cable USB or equivalent.

What is the maximum I/O count for the XC3S1500 in a larger package?

In the FG676 package, the XC3S1500 supports up to 487 user I/O pins, offering significantly more connectivity than the 320-pin variant.

Can the XC3S1500-5FGG320C implement DDR memory interfaces?

Yes. The device supports DDR and DDR2 SDRAM interfaces at data rates up to 333 Mb/s using dedicated DDR I/O registers and SelectIO technology.


Conclusion

The XC3S1500-5FGG320C is a battle-tested, cost-effective FPGA that delivers 1.5 million system gates, rich memory resources, flexible multi-standard I/O, and robust clock management in a compact 320-pin lead-free FBGA package. It remains an excellent choice for engineers designing high-volume consumer electronics, embedded systems, and industrial applications who need programmable logic without ASIC-level investment.

For comprehensive support across the full Xilinx FPGA ecosystem — from legacy Spartan-3 to the latest Versal devices — explore our Xilinx FPGA resource hub.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.