The XC3S1500-4FGG320I is a high-performance, industrial-grade field-programmable gate array (FPGA) from AMD Xilinx’s Spartan-3 family. Designed for cost-sensitive, high-volume applications, this device delivers 1.5 million system gates in a compact 320-ball Fine-Pitch BGA (FBGA) package. Whether you are designing embedded systems, telecommunications equipment, motor control, or digital signal processing platforms, the XC3S1500-4FGG320I offers an ideal balance of logic density, I/O flexibility, and thermal ruggedness. If you are sourcing Xilinx FPGA components for your next project, this device is a top-tier choice for industrial environments.
What Is the XC3S1500-4FGG320I?
The XC3S1500-4FGG320I belongs to the Xilinx Spartan-3 series — one of the most widely deployed FPGA families in the industry. The part number breaks down as follows:
| Part Number Segment |
Meaning |
| XC3S |
Xilinx Spartan-3 Family |
| 1500 |
1.5 Million System Gates |
| -4 |
Speed Grade (−4, slowest of the series) |
| FGG320 |
Fine-Pitch BGA, 320 Balls |
| I |
Industrial Temperature Range (−40°C to +100°C) |
The “I” suffix is critical for applications that operate in harsh or wide-temperature environments, distinguishing this component from the commercial-grade “C” variant.
XC3S1500-4FGG320I Key Specifications
General Electrical Characteristics
| Parameter |
Value |
| Family |
Spartan-3 |
| Manufacturer |
AMD (Xilinx) |
| Part Number |
XC3S1500-4FGG320I |
| Logic Cells |
33,792 |
| System Gates |
1,500,000 (1.5M) |
| CLB Slices |
13,312 |
| Maximum User I/O Pins |
221 |
| Distributed RAM |
424 Kb |
| Block RAM |
720 Kb |
| Dedicated Multipliers |
32 (18×18-bit) |
| DCM (Digital Clock Manager) |
4 |
| Core Supply Voltage (VCCINT) |
1.2V |
| I/O Supply Voltage (VCCIO) |
1.2V – 3.3V |
| Speed Grade |
-4 |
| Temperature Range |
−40°C to +100°C (Industrial) |
Package & Physical Specifications
| Parameter |
Value |
| Package Type |
FBGA (Fine-Pitch Ball Grid Array) |
| Package Code |
FGG320 |
| Ball Count |
320 |
| Package Dimensions |
19mm × 19mm |
| Ball Pitch |
1.0mm |
| RoHS Compliant |
Yes |
| Mounting Type |
Surface Mount Technology (SMT) |
I/O Bank and Differential Pair Support
| Feature |
Specification |
| I/O Banks |
8 |
| Maximum Differential I/O Pairs |
96 |
| Supported I/O Standards |
LVTTL, LVCMOS, SSTL, HSTL, LVDS, RSDS, PCI |
| Output Drive Strength |
2mA to 24mA (configurable) |
| Input Hysteresis |
Optional (Schmitt Trigger) |
XC3S1500-4FGG320I Features & Capabilities
#### Configurable Logic Blocks (CLBs)
The Spartan-3 CLB architecture uses a two-slice structure per CLB. Each slice contains two 4-input Look-Up Tables (LUTs), two flip-flops, and dedicated carry and control logic. With 13,312 slices, the XC3S1500 provides ample logic resources for complex state machines, data path implementations, and protocol engines.
#### Block RAM (BRAM)
The device integrates 720 Kb of dedicated block RAM organized as 20 × 18 Kb dual-port BRAM blocks. These are ideal for FIFOs, look-up tables, frame buffers, and embedded microprocessor memory.
#### Dedicated DSP Multipliers
Thirty-two 18×18-bit dedicated multipliers provide hardware acceleration for DSP applications such as FIR/IIR filters, FFT engines, and motor control algorithms — without consuming CLB logic resources.
#### Digital Clock Manager (DCM)
Four on-chip DCMs support clock frequency synthesis, phase shifting, and duty-cycle correction. DCMs allow designers to derive multiple derived clocks from a single input reference, simplifying multi-clock domain designs.
#### SelectIO Technology
Xilinx SelectIO supports a broad range of I/O standards, enabling direct interfacing to memories (DDR SDRAM, SRAM), processors, and high-speed buses without external level translators.
Industrial Grade: Why the “I” Suffix Matters
The XC3S1500-4FGG320I is rated for the industrial temperature range of −40°C to +100°C (junction temperature). This makes it suitable for:
- Automotive test equipment
- Industrial motor drives and PLCs
- Military and defense electronics
- Outdoor communications equipment
- Medical instrumentation
In contrast, the commercial “C” variant (XC3S1500-4FGG320C) is only rated from 0°C to +85°C, making it unsuitable for extreme environments.
Comparison: XC3S1500-4FGG320I vs. Similar Devices
| Feature |
XC3S1500-4FGG320I |
XC3S1000-4FGG320I |
XC3S2000-4FGG320I |
| System Gates |
1,500,000 |
1,000,000 |
2,000,000 |
| Logic Cells |
33,792 |
17,280 |
46,080 |
| CLB Slices |
13,312 |
7,680 |
19,456 |
| Block RAM |
720 Kb |
432 Kb |
1,080 Kb |
| Multipliers |
32 |
24 |
40 |
| User I/O |
221 |
391* |
221 |
| Package |
FGG320 |
FGG320 |
FGG320 |
| Temp Grade |
Industrial |
Industrial |
Industrial |
*I/O count varies by package selection.
Typical Applications for XC3S1500-4FGG320I
The XC3S1500-4FGG320I is widely deployed in the following application domains:
| Application Area |
Use Case |
| Embedded Systems |
Soft-core processor (MicroBlaze, PicoBlaze) implementations |
| Communications |
Ethernet MAC, UART, SPI, I²C controllers |
| Motor Control |
PWM generation, encoder processing, PID loops |
| Digital Signal Processing |
FIR filters, FFTs, digital demodulation |
| Video & Imaging |
Image preprocessing, pixel pipeline control |
| Industrial Automation |
Sensor fusion, data logging, PLC logic |
| Prototyping |
ASIC prototyping and hardware emulation |
Programming and Configuration
#### Supported Configuration Modes
The XC3S1500-4FGG320I supports multiple configuration methods:
| Configuration Mode |
Description |
| Master Serial |
FPGA loads bitstream from external serial Flash (e.g., Xilinx Platform Flash) |
| Slave Serial |
Configuration controlled by external host processor |
| Master SPI |
Load from standard SPI Flash memory |
| JTAG |
IEEE 1149.1-compliant boundary scan and in-system programming |
| Master/Slave SelectMAP |
Parallel 8-bit configuration interface |
#### Design Tools
- Xilinx ISE Design Suite (legacy): Synthesis, implementation, and bitstream generation
- Xilinx Vivado (limited Spartan-3 support via ISE compatibility mode)
- Third-party tools: Synplify Pro, Mentor Precision
Power Consumption Overview
| Power Domain |
Typical Operating Voltage |
Notes |
| Core (VCCINT) |
1.2V |
Powers internal logic fabric |
| I/O (VCCIO) |
1.2V – 3.3V |
Bank-selectable; varies by I/O standard |
| Auxiliary (VCCAUX) |
3.3V |
Powers DCM, DCI, configuration logic |
Dynamic power consumption depends on logic utilization, clock frequency, and I/O toggle rates. Static current (quiescent) is typically under 20mA at 1.2V VCCINT under no-load conditions.
Ordering Information
| Parameter |
Detail |
| Manufacturer Part Number |
XC3S1500-4FGG320I |
| Manufacturer |
AMD (formerly Xilinx) |
| Product Status |
Active / End-of-Life monitoring recommended |
| Lead-Free / RoHS |
Yes |
| Export Control (ECCN) |
3A991 |
| HTS Code |
8542.39.00.01 |
Note: The XC3S1500-4FGG320I may be subject to lead time variability. Always check with authorized distributors for current stock and pricing.
Frequently Asked Questions (FAQ)
Q: What is the difference between XC3S1500-4FGG320I and XC3S1500-4FGG320C?
A: The only difference is the temperature rating. The “I” suffix denotes industrial grade (−40°C to +100°C), while the “C” suffix denotes commercial grade (0°C to +85°C). Both are otherwise electrically identical.
Q: Is XC3S1500-4FGG320I still in production?
A: The Spartan-3 family is mature. AMD Xilinx continues to fulfill orders, but designers starting new projects should evaluate migration to Spartan-6 or Artix-7 for longer longevity. Check with your distributor for EOL notices.
Q: Can I use Vivado to program the XC3S1500-4FGG320I?
A: No. The Spartan-3 family is only supported by Xilinx ISE Design Suite (version 14.7 is the final release). Vivado does not support Spartan-3 devices.
Q: What is the maximum operating frequency of the XC3S1500-4FGG320I?
A: Being speed grade -4 (the slowest Spartan-3 grade), internal logic timing paths typically support up to 200+ MHz depending on design complexity. The DCM supports up to 280 MHz output frequency.
Q: What Flash memory is compatible for configuration?
A: Xilinx Platform Flash (XCF Series) is the recommended choice. Standard SPI Flash devices (e.g., Spansion, Micron) are also supported in SPI configuration mode.
Summary
The XC3S1500-4FGG320I is a proven, reliable industrial-grade FPGA delivering 1.5 million system gates, 33,792 logic cells, 720 Kb of block RAM, and 32 hardware multipliers — all in a 320-ball FBGA package rated for −40°C to +100°C operation. It remains a solid choice for embedded control, DSP, and communications applications where cost-efficiency and industrial robustness are essential requirements.
For engineers looking to explore the full range of programmable logic devices, including more recent Xilinx families, visit our comprehensive Xilinx FPGA resource page for datasheets, selection guides, and sourcing information.