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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XC3S1500-4FGG320I: Xilinx Spartan-3 FPGA – Full Specifications & Datasheet Guide

Product Details

The XC3S1500-4FGG320I is a high-performance, industrial-grade field-programmable gate array (FPGA) from AMD Xilinx’s Spartan-3 family. Designed for cost-sensitive, high-volume applications, this device delivers 1.5 million system gates in a compact 320-ball Fine-Pitch BGA (FBGA) package. Whether you are designing embedded systems, telecommunications equipment, motor control, or digital signal processing platforms, the XC3S1500-4FGG320I offers an ideal balance of logic density, I/O flexibility, and thermal ruggedness. If you are sourcing Xilinx FPGA components for your next project, this device is a top-tier choice for industrial environments.


What Is the XC3S1500-4FGG320I?

The XC3S1500-4FGG320I belongs to the Xilinx Spartan-3 series — one of the most widely deployed FPGA families in the industry. The part number breaks down as follows:

Part Number Segment Meaning
XC3S Xilinx Spartan-3 Family
1500 1.5 Million System Gates
-4 Speed Grade (−4, slowest of the series)
FGG320 Fine-Pitch BGA, 320 Balls
I Industrial Temperature Range (−40°C to +100°C)

The “I” suffix is critical for applications that operate in harsh or wide-temperature environments, distinguishing this component from the commercial-grade “C” variant.


XC3S1500-4FGG320I Key Specifications

General Electrical Characteristics

Parameter Value
Family Spartan-3
Manufacturer AMD (Xilinx)
Part Number XC3S1500-4FGG320I
Logic Cells 33,792
System Gates 1,500,000 (1.5M)
CLB Slices 13,312
Maximum User I/O Pins 221
Distributed RAM 424 Kb
Block RAM 720 Kb
Dedicated Multipliers 32 (18×18-bit)
DCM (Digital Clock Manager) 4
Core Supply Voltage (VCCINT) 1.2V
I/O Supply Voltage (VCCIO) 1.2V – 3.3V
Speed Grade -4
Temperature Range −40°C to +100°C (Industrial)

Package & Physical Specifications

Parameter Value
Package Type FBGA (Fine-Pitch Ball Grid Array)
Package Code FGG320
Ball Count 320
Package Dimensions 19mm × 19mm
Ball Pitch 1.0mm
RoHS Compliant Yes
Mounting Type Surface Mount Technology (SMT)

I/O Bank and Differential Pair Support

Feature Specification
I/O Banks 8
Maximum Differential I/O Pairs 96
Supported I/O Standards LVTTL, LVCMOS, SSTL, HSTL, LVDS, RSDS, PCI
Output Drive Strength 2mA to 24mA (configurable)
Input Hysteresis Optional (Schmitt Trigger)

XC3S1500-4FGG320I Features & Capabilities

#### Configurable Logic Blocks (CLBs)

The Spartan-3 CLB architecture uses a two-slice structure per CLB. Each slice contains two 4-input Look-Up Tables (LUTs), two flip-flops, and dedicated carry and control logic. With 13,312 slices, the XC3S1500 provides ample logic resources for complex state machines, data path implementations, and protocol engines.

#### Block RAM (BRAM)

The device integrates 720 Kb of dedicated block RAM organized as 20 × 18 Kb dual-port BRAM blocks. These are ideal for FIFOs, look-up tables, frame buffers, and embedded microprocessor memory.

#### Dedicated DSP Multipliers

Thirty-two 18×18-bit dedicated multipliers provide hardware acceleration for DSP applications such as FIR/IIR filters, FFT engines, and motor control algorithms — without consuming CLB logic resources.

#### Digital Clock Manager (DCM)

Four on-chip DCMs support clock frequency synthesis, phase shifting, and duty-cycle correction. DCMs allow designers to derive multiple derived clocks from a single input reference, simplifying multi-clock domain designs.

#### SelectIO Technology

Xilinx SelectIO supports a broad range of I/O standards, enabling direct interfacing to memories (DDR SDRAM, SRAM), processors, and high-speed buses without external level translators.


Industrial Grade: Why the “I” Suffix Matters

The XC3S1500-4FGG320I is rated for the industrial temperature range of −40°C to +100°C (junction temperature). This makes it suitable for:

  • Automotive test equipment
  • Industrial motor drives and PLCs
  • Military and defense electronics
  • Outdoor communications equipment
  • Medical instrumentation

In contrast, the commercial “C” variant (XC3S1500-4FGG320C) is only rated from 0°C to +85°C, making it unsuitable for extreme environments.


Comparison: XC3S1500-4FGG320I vs. Similar Devices

Feature XC3S1500-4FGG320I XC3S1000-4FGG320I XC3S2000-4FGG320I
System Gates 1,500,000 1,000,000 2,000,000
Logic Cells 33,792 17,280 46,080
CLB Slices 13,312 7,680 19,456
Block RAM 720 Kb 432 Kb 1,080 Kb
Multipliers 32 24 40
User I/O 221 391* 221
Package FGG320 FGG320 FGG320
Temp Grade Industrial Industrial Industrial

*I/O count varies by package selection.


Typical Applications for XC3S1500-4FGG320I

The XC3S1500-4FGG320I is widely deployed in the following application domains:

Application Area Use Case
Embedded Systems Soft-core processor (MicroBlaze, PicoBlaze) implementations
Communications Ethernet MAC, UART, SPI, I²C controllers
Motor Control PWM generation, encoder processing, PID loops
Digital Signal Processing FIR filters, FFTs, digital demodulation
Video & Imaging Image preprocessing, pixel pipeline control
Industrial Automation Sensor fusion, data logging, PLC logic
Prototyping ASIC prototyping and hardware emulation

Programming and Configuration

#### Supported Configuration Modes

The XC3S1500-4FGG320I supports multiple configuration methods:

Configuration Mode Description
Master Serial FPGA loads bitstream from external serial Flash (e.g., Xilinx Platform Flash)
Slave Serial Configuration controlled by external host processor
Master SPI Load from standard SPI Flash memory
JTAG IEEE 1149.1-compliant boundary scan and in-system programming
Master/Slave SelectMAP Parallel 8-bit configuration interface

#### Design Tools

  • Xilinx ISE Design Suite (legacy): Synthesis, implementation, and bitstream generation
  • Xilinx Vivado (limited Spartan-3 support via ISE compatibility mode)
  • Third-party tools: Synplify Pro, Mentor Precision

Power Consumption Overview

Power Domain Typical Operating Voltage Notes
Core (VCCINT) 1.2V Powers internal logic fabric
I/O (VCCIO) 1.2V – 3.3V Bank-selectable; varies by I/O standard
Auxiliary (VCCAUX) 3.3V Powers DCM, DCI, configuration logic

Dynamic power consumption depends on logic utilization, clock frequency, and I/O toggle rates. Static current (quiescent) is typically under 20mA at 1.2V VCCINT under no-load conditions.


Ordering Information

Parameter Detail
Manufacturer Part Number XC3S1500-4FGG320I
Manufacturer AMD (formerly Xilinx)
Product Status Active / End-of-Life monitoring recommended
Lead-Free / RoHS Yes
Export Control (ECCN) 3A991
HTS Code 8542.39.00.01

Note: The XC3S1500-4FGG320I may be subject to lead time variability. Always check with authorized distributors for current stock and pricing.


Frequently Asked Questions (FAQ)

Q: What is the difference between XC3S1500-4FGG320I and XC3S1500-4FGG320C?
A: The only difference is the temperature rating. The “I” suffix denotes industrial grade (−40°C to +100°C), while the “C” suffix denotes commercial grade (0°C to +85°C). Both are otherwise electrically identical.

Q: Is XC3S1500-4FGG320I still in production?
A: The Spartan-3 family is mature. AMD Xilinx continues to fulfill orders, but designers starting new projects should evaluate migration to Spartan-6 or Artix-7 for longer longevity. Check with your distributor for EOL notices.

Q: Can I use Vivado to program the XC3S1500-4FGG320I?
A: No. The Spartan-3 family is only supported by Xilinx ISE Design Suite (version 14.7 is the final release). Vivado does not support Spartan-3 devices.

Q: What is the maximum operating frequency of the XC3S1500-4FGG320I?
A: Being speed grade -4 (the slowest Spartan-3 grade), internal logic timing paths typically support up to 200+ MHz depending on design complexity. The DCM supports up to 280 MHz output frequency.

Q: What Flash memory is compatible for configuration?
A: Xilinx Platform Flash (XCF Series) is the recommended choice. Standard SPI Flash devices (e.g., Spansion, Micron) are also supported in SPI configuration mode.


Summary

The XC3S1500-4FGG320I is a proven, reliable industrial-grade FPGA delivering 1.5 million system gates, 33,792 logic cells, 720 Kb of block RAM, and 32 hardware multipliers — all in a 320-ball FBGA package rated for −40°C to +100°C operation. It remains a solid choice for embedded control, DSP, and communications applications where cost-efficiency and industrial robustness are essential requirements.

For engineers looking to explore the full range of programmable logic devices, including more recent Xilinx families, visit our comprehensive Xilinx FPGA resource page for datasheets, selection guides, and sourcing information.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.