Overview

The XC3S1400A-5FGG484C is a Field Programmable Gate Array (FPGA) from the AMD (Xilinx) Spartan-3A family, designed for high-volume, cost-sensitive applications. Built on 90nm process technology, this FPGA delivers exceptional performance-per-dollar with 1.4 million system gates and advanced I/O capabilities. The -5 speed grade designation indicates the fastest commercial speed grade available, supporting clock frequencies up to 770MHz.

Key Features

• 4 Million System Gates with 25,344 equivalent logic cells
• 576Kb Block RAM and 176Kb Distributed RAM for flexible memory architecture
• 32 dedicated 18×18 hardware multipliers for DSP applications
• 8 Digital Clock Managers (DCMs) for advanced clock management
• 375 user I/O pins supporting 26 single-ended and differential I/O standards
• Up to 227 differential I/O pairs (LVDS, RSDS, mini-LVDS)
• Suspend and Hibernate power modes for low-power operation
• 2V core voltage with multi-voltage I/O support
• JTAG programming interface and IEEE 1149.1/1532 compliant
• Commercial temperature range: 0°C to +85°C

Applications

• Industrial automation and control systems
• Video and display processing equipment
• Telecommunications and networking infrastructure
• Consumer electronics and home networking
• Medical device interfaces
• Security and surveillance systems
• Automotive infotainment systems
• Data acquisition and signal processing

Table 1: Basic Specifications

Parameter	Value
Manufacturer	AMD (formerly Xilinx)
Part Number	XC3S1400A-5FGG484C
Family	Spartan-3A
Device Type	FPGA – Field Programmable Gate Array
System Gates	1.4 Million (1,400K)
Logic Cells	25,344
Speed Grade	-5 (Fastest Commercial)
Package	484-FBGA (Fine-pitch Ball Grid Array)
Temperature Grade	C (Commercial: 0°C to +85°C)
RoHS Status	RoHS Compliant (Pb-Free)
Process Technology	90nm

 

Table 2: Logic Resources

Resource	Quantity
CLBs (Configurable Logic Blocks)	2,816
Slices	11,264
Logic Cells (Equivalent)	25,344
Flip-Flops	22,528
4-Input LUTs	22,528
Dedicated Multipliers (18×18)	32
Digital Clock Managers (DCM)	8

 

Table 3: Memory Resources

Memory Type	Capacity
Block RAM (Total)	576 Kbits (72 KB)
Block RAM Blocks	32
Distributed RAM	176 Kbits
Total RAM	752 Kbits

 

Table 4: I/O Specifications

I/O Parameter	Specification
Maximum User I/O	375
Maximum Differential I/O Pairs	227
I/O Standards Supported	26
Single-Ended Standards	LVCMOS, LVTTL, HSTL, SSTL, PCI
Differential Standards	LVDS, RSDS, mini-LVDS, BLVDS
I/O Banking	4 Banks

 

Table 5: Electrical Specifications

Parameter	Value
Core Voltage (VCCINT)	1.2V (1.14V – 1.26V)
Auxiliary Voltage (VCCAUX)	2.5V or 3.3V
I/O Voltage (VCCO)	1.2V to 3.3V
Maximum Clock Frequency	770 MHz
Operating Temperature	0°C to +85°C (TJ)

 

Table 6: Package Information

Package Parameter	Specification
Package Type	FG484 (FBGA)
Pin Count	484
Ball Pitch	1.0 mm
Package Dimensions	23 x 23 mm
Mounting Type	Surface Mount (SMD)
Package Material	Pb-Free (RoHS Compliant)

 

Table 7: Part Number Breakdown

Code	Meaning	Description
XC3S	Family	Spartan-3 Series
1400A	Density + Generation	1.4M Gates, A-Series
-5	Speed Grade	Fastest (-5 > -4)
FG	Package Type	Fine-pitch BGA
G	Lead Type	Pb-Free (RoHS)
484	Pin Count	484 Balls
C	Temperature	Commercial (0-85°C)