The XC3S1000-4FG676I is a high-performance, cost-optimized field-programmable gate array (FPGA) from the Xilinx Spartan-3 family, now under AMD’s portfolio. Designed for high-volume, cost-sensitive applications, it delivers robust logic capacity, flexible I/O, and proven reliability in industrial-grade environments. Whether you’re developing embedded systems, digital signal processing pipelines, or communication interfaces, the XC3S1000-4FG676I is a trusted choice for engineers worldwide.
What Is the XC3S1000-4FG676I?
The XC3S1000-4FG676I is a member of the Xilinx FPGA Spartan-3 product family. It features 1,000,000 system gates, 1,920 logic cells, and is housed in a 676-ball Fine-pitch Ball Grid Array (FBGA) package. The “4” in the part number denotes a speed grade of -4, and the “I” suffix indicates an industrial temperature range of -40°C to +100°C, making it suitable for demanding environments.
This device supports a wide range of design applications and is built on a 90nm process technology, offering an ideal balance between performance, power consumption, and cost efficiency.
XC3S1000-4FG676I Key Specifications
General Specifications
| Parameter |
Value |
| Manufacturer |
AMD (Xilinx) |
| Part Number |
XC3S1000-4FG676I |
| Series |
Spartan-3 |
| Family |
FPGA – Field Programmable Gate Array |
| Logic Cells |
1,920 |
| System Gates |
1,000,000 |
| CLB Slices |
7,680 |
| Flip-Flops |
15,360 |
| Maximum User I/O |
391 |
| Block RAM (bits) |
432,000 |
| Multiplier Blocks |
24 |
| DCM (Digital Clock Manager) |
4 |
Package & Electrical Specifications
| Parameter |
Value |
| Package Type |
FBGA (Fine Pitch Ball Grid Array) |
| Package Code |
FG676 |
| Ball Count |
676 |
| Speed Grade |
-4 |
| Temperature Grade |
Industrial |
| Operating Temperature |
-40°C to +100°C |
| Core Voltage (VCCINT) |
1.2V |
| I/O Voltage (VCCO) |
1.2V – 3.3V |
| Process Technology |
90nm |
| RoHS Compliant |
Yes |
XC3S1000-4FG676I Functional Overview
Logic Resources
The XC3S1000-4FG676I provides 1,920 logic cells, each composed of a 4-input Look-Up Table (LUT) and a D-type flip-flop. These are organized into 7,680 CLB slices, giving designers the flexibility to implement complex digital logic, state machines, arithmetic functions, and control circuits.
Each CLB (Configurable Logic Block) contains two slices, and each slice contains two LUTs and two flip-flops — a well-structured hierarchy that enables efficient packing of logic functions.
Memory Resources
With 432 Kbits of on-chip Block RAM, the XC3S1000-4FG676I supports data buffering, FIFO queues, lookup tables, and small on-chip memories. The Block RAMs are true dual-port, allowing simultaneous read and write access from two independent ports, making them ideal for high-throughput applications.
DSP and Arithmetic
The device includes 24 dedicated 18×18-bit hardware multiplier blocks, enabling high-speed multiply-accumulate (MAC) operations essential in DSP, image processing, and communications applications without consuming LUT resources.
Clock Management
Four Digital Clock Managers (DCMs) provide flexible clock distribution and management. DCMs support frequency synthesis, phase shifting, and clock deskew — critical for synchronous digital designs requiring precise timing control.
I/O Resources
The XC3S1000-4FG676I supports up to 391 user I/O pins (in the FG676 package). The I/O banks support a wide range of single-ended and differential I/O standards.
Supported I/O Standards
| I/O Standard |
Type |
| LVCMOS 3.3V / 2.5V / 1.8V / 1.5V |
Single-Ended |
| LVTTL |
Single-Ended |
| LVDS |
Differential |
| RSDS |
Differential |
| HSTL Class I / II |
Single-Ended |
| SSTL 2 / 3 |
Single-Ended |
| PCI / PCI-X |
Single-Ended |
This wide I/O standard support enables interfacing with memories, processors, FPGAs, ASICs, and communication peripherals with ease.
XC3S1000-4FG676I vs. Other Spartan-3 Devices
Understanding where the XC3S1000 sits within the Spartan-3 family helps engineers make the right device selection.
| Device |
System Gates |
Logic Cells |
Block RAM (Kbits) |
Multipliers |
Max User I/O |
| XC3S50 |
50K |
1,728 |
72 |
4 |
124 |
| XC3S200 |
200K |
4,320 |
216 |
12 |
173 |
| XC3S1000 |
1,000K |
17,280 |
432 |
24 |
391 |
| XC3S2000 |
2,000K |
46,080 |
864 |
40 |
565 |
| XC3S4000 |
4,000K |
62,208 |
1,728 |
96 |
633 |
The XC3S1000 strikes an excellent balance between resource density, I/O flexibility, and affordability, making it one of the most popular devices in the Spartan-3 lineup.
Typical Applications
The XC3S1000-4FG676I is well-suited for a wide variety of embedded and industrial applications:
- Industrial Control Systems – Motor control, PLC interfaces, sensor fusion
- Communications Equipment – Protocol bridges, UART/SPI/I2C controllers, line-rate logic
- Digital Signal Processing – FIR/IIR filters, FFT engines, audio processing
- Video & Image Processing – Pixel manipulation, frame buffers, display controllers
- Embedded System Acceleration – Custom peripherals for microcontrollers and SoCs
- Test & Measurement – Pattern generators, logic analyzers, data acquisition
- Automotive Electronics – ADAS support logic, sensor interface
- Military & Aerospace – Industrial-grade temperature tolerance makes it suitable for harsh environments
Why Choose the Industrial Temperature Grade (-I Suffix)?
The “I” temperature suffix designates the device for industrial-grade operation from -40°C to +100°C, compared to the commercial-grade range of 0°C to +85°C. This broader range is essential for:
- Outdoor and field-deployed electronics
- Industrial automation and factory floor equipment
- Automotive systems where thermal cycling is significant
- Military-grade and ruggedized electronics
Configuration Modes
The XC3S1000-4FG676I supports multiple configuration modes to suit different system architectures:
| Mode |
Description |
| Master Serial |
FPGA drives a SPI/serial flash |
| Slave Serial |
External controller loads bitstream serially |
| Master Parallel (SelectMAP) |
FPGA loads bitstream from parallel flash |
| Slave Parallel (SelectMAP) |
External processor loads bitstream in parallel |
| JTAG |
IEEE 1149.1 boundary scan / debug mode |
Configuration data can be stored in Xilinx Platform Flash (XCF series) or standard SPI flash devices for flexible deployment.
Development Tools & Support
The XC3S1000-4FG676I is fully supported by the Xilinx ISE Design Suite (the primary tool for Spartan-3 development). While newer devices use Vivado, ISE remains the authoritative environment for Spartan-3, offering:
- XST – Xilinx Synthesis Technology for RTL synthesis
- MAP / PAR – Placement and routing tools
- ChipScope Pro – On-chip logic analysis
- iMPACT – Device programming and configuration
- CORE Generator – IP core instantiation (FIFOs, memories, interfaces)
Third-party support includes Synopsys Synplify, Mentor Precision, and open-source toolchains for specific use cases.
Ordering Information
| Part Number |
Package |
Speed Grade |
Temperature |
Description |
| XC3S1000-4FG676I |
FG676 (676-FBGA) |
-4 |
Industrial (-40°C to +100°C) |
Spartan-3 FPGA, 1M Gates |
| XC3S1000-4FG676C |
FG676 (676-FBGA) |
-4 |
Commercial (0°C to +85°C) |
Spartan-3 FPGA, 1M Gates |
| XC3S1000-5FG676I |
FG676 (676-FBGA) |
-5 |
Industrial (-40°C to +100°C) |
Spartan-3 FPGA, 1M Gates (Faster) |
Note: The “-4” speed grade is the standard; “-5” offers improved timing closure for high-frequency designs.
Package Dimensions – FG676 (676-Ball FBGA)
| Dimension |
Value |
| Package Type |
Fine Pitch Ball Grid Array |
| Ball Count |
676 |
| Body Size |
27 × 27 mm |
| Ball Pitch |
1.0 mm |
| Height (max) |
2.55 mm |
| Lead-Free |
Yes (RoHS) |
The compact FBGA footprint supports high-density PCB layouts while providing the full 391 user I/O pins needed for complex system designs.
Summary
The XC3S1000-4FG676I is a versatile, industrial-grade Spartan-3 FPGA that continues to serve a broad base of embedded and industrial applications. Its combination of 1 million system gates, 24 hardware multipliers, 432 Kbits of block RAM, 4 DCMs, and 391 user I/Os — all in a compact 676-ball FBGA package — makes it an enduring and reliable choice for engineers seeking proven FPGA technology. With industrial temperature range certification and full Xilinx ISE toolchain support, it remains a dependable platform for both new designs and long-lifecycle production programs.
