Meta Description: Buy XC3S1000-4FG676CES – Xilinx Spartan-3 FPGA with 1M gates, 676-pin FBGA, 90nm technology, 1.2V supply. Full specs, pinout, applications, and datasheet info.
The XC3S1000-4FG676CES is a high-performance Field-Programmable Gate Array (FPGA) from Xilinx’s industry-leading Spartan-3 family. Designed for cost-sensitive, high-volume applications, this device delivers 1 million system gates in a compact 676-ball Fine-Pitch Ball Grid Array (FBGA) package — making it a top choice for engineers in communications, industrial automation, data centers, and embedded systems design.
Whether you are upgrading from an older Spartan-IIE design or evaluating Xilinx FPGA solutions for a new project, the XC3S1000-4FG676CES provides an outstanding balance of logic density, I/O capability, and cost-efficiency.
What Is the XC3S1000-4FG676CES?
The XC3S1000-4FG676CES belongs to the eight-member Spartan-3 FPGA family, which spans logic densities from 50,000 to 5,000,000 system gates. Built on advanced 90nm process technology and enhanced with architectural innovations derived from Xilinx’s Virtex-II platform, the XC3S1000-4FG676CES delivers more functionality and bandwidth per dollar than previous generations.
The suffix breakdown is as follows:
| Code Segment |
Meaning |
| XC3S |
Spartan-3 Family |
| 1000 |
1,000,000 System Gates |
| -4 |
Speed Grade 4 (Standard Performance) |
| FG |
Fine-Pitch Ball Grid Array (FBGA) Package |
| 676 |
676 Pins |
| C |
Commercial Temperature Range (0°C to 85°C) |
| ES |
Engineering Sample |
XC3S1000-4FG676CES Key Specifications
Core Device Parameters
| Parameter |
Value |
| Manufacturer |
Xilinx (AMD) |
| Series |
Spartan-3 |
| Part Number |
XC3S1000-4FG676CES |
| System Gates |
1,000,000 (1M) |
| Equivalent Logic Cells |
17,280 |
| CLB Array |
48 rows × 40 columns (1,920 CLBs) |
| Distributed RAM |
120K bits |
| Block RAM |
432K bits |
| Dedicated Multipliers |
24 |
| DCMs (Digital Clock Managers) |
4 |
| Maximum User I/O |
391 |
| Maximum Differential I/O Pairs |
175 |
Electrical and Timing Characteristics
| Parameter |
Value |
| Core Supply Voltage |
1.2V |
| Process Technology |
90nm CMOS |
| Maximum Frequency |
630 MHz |
| Speed Grade |
-4 (Standard Performance) |
| Operating Temperature |
0°C to 85°C (Commercial) |
Package Information
| Parameter |
Value |
| Package Type |
Fine-Pitch Ball Grid Array (FBGA) |
| Package Code |
FG676 |
| Total Pins |
676 |
| RoHS Status |
Engineering Sample (ES) — verify compliance before production use |
XC3S1000-4FG676CES Architecture Overview
Configurable Logic Blocks (CLBs)
The XC3S1000-4FG676CES contains 1,920 CLBs, each consisting of four slices. Each slice includes two RAM-based 4-input Look-Up Tables (LUTs) that can implement logic functions or serve as distributed memory. Storage elements in each slice can be configured as flip-flops or latches, providing exceptional design flexibility for both combinational and sequential logic.
Block RAM
With 432K bits of block RAM organized in dedicated 18-Kbit blocks, the XC3S1000-4FG676CES supports high-throughput data storage for FIFOs, buffers, and lookup tables. Each block RAM is paired with a dedicated 18×18 multiplier, enabling efficient DSP and filtering applications without consuming CLB resources.
Input/Output Blocks (IOBs)
The IOB architecture supports 26 single-ended and differential I/O standards, including eight high-performance differential standards. Key IOB features include:
- Double Data-Rate (DDR) registers
- Digitally Controlled Impedance (DCI) for automatic on-chip termination
- Support for HSTL and SSTL signaling standards
- 3-state operation and bidirectional data flow
Digital Clock Managers (DCMs)
Four on-chip DCMs provide flexible clock synthesis, phase shifting, and duty-cycle correction. DCMs eliminate clock skew and enable frequency multiplication and division, simplifying multi-clock domain designs.
XC3S1000-4FG676CES vs. Spartan-3 Family Comparison
| Device |
System Gates |
Logic Cells |
Block RAM |
Multipliers |
Max I/O |
| XC3S200 |
200K |
4,320 |
216K bits |
12 |
173 |
| XC3S400 |
400K |
8,064 |
288K bits |
16 |
264 |
| XC3S1000 |
1M |
17,280 |
432K bits |
24 |
391 |
| XC3S1500 |
1.5M |
29,952 |
576K bits |
32 |
487 |
| XC3S2000 |
2M |
46,080 |
720K bits |
40 |
565 |
Ordering Code Explanation
Understanding the “ES” Suffix
The ES (Engineering Sample) designation indicates that the XC3S1000-4FG676CES is an early production or pre-production device intended for prototyping and design validation. Engineering samples are electrically equivalent to production parts but are typically not recommended for final production builds without verifying production availability and compliance status.
For production use, the equivalent standard part number is XC3S1000-4FG676C.
Available Package Options for XC3S1000
| Package Code |
Package Type |
Pin Count |
| PQ(G)208 |
Plastic Quad Flat Pack (PQFP) |
208 |
| FG(G)320 |
Fine-Pitch Ball Grid Array (FBGA) |
320 |
| FG(G)456 |
Fine-Pitch Ball Grid Array (FBGA) |
456 |
| FG(G)676 |
Fine-Pitch Ball Grid Array (FBGA) |
676 |
Configuration Modes
The XC3S1000-4FG676CES supports five configuration modes, allowing flexible integration in virtually any system architecture:
| Mode |
Interface Width |
Description |
| Master Parallel |
8-bit (SelectMAP) |
FPGA controls configuration clock |
| Slave Parallel |
8-bit (SelectMAP) |
External device controls clock |
| Master Serial |
1-bit |
Standard SPI-compatible serial configuration |
| Slave Serial |
1-bit |
Daisy-chain serial configuration |
| Boundary Scan (JTAG) |
1-bit |
IEEE 1149.1 JTAG interface |
Configuration data is stored externally in a Xilinx Platform Flash PROM or other non-volatile memory and loaded into on-chip static CMOS Configuration Latches (CCLs) at power-up.
Applications of the XC3S1000-4FG676CES
The XC3S1000-4FG676CES is engineered for a broad range of high-volume and cost-sensitive applications:
Communications Equipment
The device’s rich I/O standards, DDR support, and high-speed differential signaling make it ideal for line cards, switching equipment, and datacom modules that require deterministic latency and flexible interfacing.
Industrial Automation
With commercial temperature support and robust clock management, the XC3S1000-4FG676CES is used in motor controllers, PLCs, industrial vision systems, and real-time control loops.
Test and Measurement
Its high logic density and on-chip multipliers support waveform generation, signal capture, and protocol analysis in bench and embedded test instruments.
Enterprise and Data Center Systems
The device handles high-bandwidth data processing tasks such as compression, encryption, packet inspection, and protocol bridging in enterprise networking and storage infrastructure.
Embedded Processing
With its large distributed and block RAM capacity plus dedicated multipliers, designers implement embedded soft-core processors (e.g., MicroBlaze) and custom accelerators within a single device.
Advantages Over Mask-Programmed ASICs
The XC3S1000-4FG676CES offers significant advantages over traditional ASICs:
- No NRE costs — eliminate expensive mask tooling fees
- Faster time-to-market — begin prototyping immediately
- In-field reprogrammability — update designs without hardware replacement
- Design flexibility — iterate and optimize during development without fabrication delays
- Lower risk — validate functionality before committing to fixed silicon
Design Tools and Software Support
The XC3S1000-4FG676CES is fully supported by Xilinx design tools:
| Tool |
Use Case |
| ISE Design Suite |
Legacy synthesis, implementation, and bitstream generation for Spartan-3 |
| Vivado Design Suite |
Modern design environment (limited Spartan-3 support; ISE preferred) |
| ChipScope Pro |
In-system logic analysis and debugging |
| Platform Flash PROM |
Recommended non-volatile configuration storage |
Frequently Asked Questions
What does the “4” speed grade mean in XC3S1000-4FG676CES?
The -4 speed grade indicates standard performance. Spartan-3 devices also come in a -5 (high performance) speed grade. A higher number means faster timing performance.
Is the XC3S1000-4FG676CES RoHS compliant?
As an Engineering Sample (ES), RoHS status should be confirmed with your supplier. The standard production part XC3S1000-4FGG676C (note the double “G”) denotes a Pb-free, RoHS-compliant package.
What is the difference between FG676 and FGG676?
The FGG676 designation indicates a Pb-free (lead-free) package variant. The single-G FG676 is the standard (non-Pb-free) package. Both are electrically identical.
Can the XC3S1000-4FG676CES replace XC3S1000-4FG676C?
Yes — the ES version is functionally equivalent and pin-compatible with the production part. However, confirm with your component supplier before using ES parts in volume production.
Summary
The XC3S1000-4FG676CES is a versatile, cost-effective FPGA solution from Xilinx’s Spartan-3 family, offering 1M system gates, 17,280 logic cells, 432K bits of block RAM, 24 dedicated multipliers, and up to 391 user I/Os — all in a 676-pin FBGA package. Its 90nm process technology, 1.2V core voltage, and advanced clock management capabilities make it suitable for communications, industrial, test, and embedded computing applications.
For engineers seeking a scalable, reprogrammable alternative to ASICs, the XC3S1000-4FG676CES delivers proven performance backed by comprehensive Xilinx toolchain support.
