Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC3195A-3PG175C: High-Performance Field Programmable Gate Array for Advanced Digital Design

Product Details

Product Overview: XC3195A-3PG175C FPGA Technical Specifications

The XC3195A-3PG175C is a sophisticated Field Programmable Gate Array (FPGA) from AMD Xilinx’s XC3000 series, engineered to deliver exceptional performance for complex digital logic applications. This programmable logic device combines high-speed processing capabilities with flexible architecture, making it an ideal solution for telecommunications, industrial automation, and embedded systems development.

As part of the renowned Xilinx FPGA family, the XC3195A-3PG175C represents a proven technology platform trusted by engineers worldwide for mission-critical applications requiring reliable, reconfigurable logic solutions.

Key Features and Technical Advantages

Core Architecture Specifications

The XC3195A-3PG175C features advanced CMOS static memory technology with configurable logic blocks (CLBs) that provide exceptional flexibility for custom VLSI design tasks:

  • Logic Capacity: 7,500 usable gates with 484 configurable logic cells
  • High-Speed Performance: Toggle rates up to 270 MHz with logic delays as low as 3 nanoseconds
  • System Clock Speed: Exceeds 85 MHz for demanding applications
  • I/O Configuration: 120 user-programmable input/output pins
  • Package Type: 175-Pin Plastic Pin Grid Array (PPGA/CPGA)
  • Operating Voltage: Standard 5V operation
  • Temperature Range: Industrial-grade temperature tolerance

Advanced FPGA Architecture Benefits

The XC3195A-3PG175C utilizes a Logic Cell Array (LCA) architecture composed of three essential configurable elements:

  1. Input/Output Blocks (IOBs): Perimeter-based I/O management for flexible interface design
  2. Configurable Logic Blocks (CLBs): Core array enabling custom logic implementation
  3. Interconnection Resources: Extensive routing capabilities with low-skew clock distribution

Technical Specifications Comparison Table

Parameter XC3195A-3PG175C Specification Details
Product Family XC3000 Series XC3100 Family
Gate Count 7,500 Gates Usable Logic Gates
Logic Cells 484 Cells Configurable Logic Blocks
Maximum Frequency 270 MHz Toggle Rate
Logic Delay 3 ns Minimum Propagation Delay
I/O Pins 120 Pins User Configurable
Total Pin Count 175 Pins PPGA Package
Supply Voltage 5V Standard Operating Voltage
Package Type PPGA/CPGA Plastic Pin Grid Array
Technology CMOS Static Memory High-Performance Architecture
Speed Grade -3 Commercial/Industrial Grade

Application Areas and Use Cases

Primary Applications

The XC3195A-3PG175C FPGA excels in diverse application environments:

Application Category Specific Use Cases
Telecommunications Protocol processing, signal routing, baseband processing
Industrial Control Programmable logic controllers, motor control, sensor interfaces
Digital Signal Processing Real-time filtering, data compression, algorithm implementation
Communications Systems Network interfaces, data encryption, packet processing
Embedded Systems Custom peripheral interfaces, system controllers, glue logic
Military/Aerospace Ruggedized control systems, avionics, radar processing
Computing Platforms Coprocessors, hardware acceleration, custom interfaces

Design Implementation Advantages

Replaces Traditional Logic: The XC3195A-3PG175C effectively replaces TTL, MSI, and other PLD logic, consolidating multiple discrete components into a single programmable device.

System Integration: Integrates complete subsystems into a compact package, eliminating the need for multiple PCBs and reducing system complexity.

Cost-Effective Development: Avoids the non-recurring engineering (NRE) costs, time delays, and risks associated with conventional masked gate arrays.

Performance Characteristics

Speed and Timing Performance

Performance Metric Specification Application Benefit
Toggle Rate Up to 270 MHz High-speed sequential logic operation
Logic Delay 3 ns (minimum) Fast combinatorial logic paths
System Clock >85 MHz Real-time processing capability
Clock Distribution Low-skew networks Synchronous design reliability

Power Consumption Profile

The XC3195A-3PG175C features optimized power characteristics:

  • Low Quiescent Power: Minimal standby current consumption
  • Efficient Active Power: Optimized for operational efficiency
  • CMOS Technology: Inherent low-power design advantages

Package and Mounting Information

Physical Package Specifications

Package Parameter Specification
Package Style PPGA (Plastic Pin Grid Array)
Pin Count 175 Pins
Mounting Type Through-Hole
Body Dimensions Standard PPGA footprint
Lead Pitch Standard 0.1″ (2.54mm) grid
Thermal Performance Enhanced heat dissipation

Package Benefits

  • Robust Mechanical Stability: Pin grid array provides excellent PCB attachment strength
  • Easy Prototyping: Compatible with standard IC sockets for development
  • Thermal Management: Enhanced heat dissipation through package design
  • High Reliability: Proven package technology for industrial applications

Design Tools and Development Support

Compatible Development Software

The XC3195A-3PG175C is supported by industry-standard Xilinx development tools:

  • XACT Development System: Provides schematic capture and auto place-and-route functionality
  • ISE Design Suite: Legacy tool support for XC3000 series devices
  • Design Entry: Multiple options including schematic capture and HDL synthesis
  • Verification Tools: Logic simulation, timing analysis, and in-circuit emulation

Programming and Configuration

Feature Capability
Reprogrammability Unlimited reconfiguration cycles
Configuration Time Fast in-system programming
Design Iteration Easy logic changes without hardware modification
Configuration Storage On-chip SRAM-based configuration memory

Quality and Reliability Standards

Manufacturing Quality Assurance

  • 100% Factory Testing: All devices thoroughly tested before shipment
  • Quality Control: Stringent manufacturing processes ensure consistency
  • Reliability Testing: Extensive qualification testing performed
  • Industry Standards Compliance: Meets international safety and quality standards

Operational Reliability Features

Reliability Aspect Specification
Operating Temperature Industrial temperature range
MTBF Rating High mean time between failures
ESD Protection Built-in electrostatic discharge protection
Latch-up Immunity CMOS latch-up resistant design

Competitive Advantages

Why Choose XC3195A-3PG175C

  1. Proven Technology Platform: Based on mature, field-tested FPGA architecture
  2. Flexible Design Capability: User-programmable logic adapts to specific requirements
  3. Cost-Effective Solution: Eliminates custom ASIC development costs and time
  4. Standard Product Availability: Ready for immediate volume production
  5. Extensive I/O Resources: 120 configurable pins support complex interfaces
  6. High Performance: 270 MHz toggle rates enable demanding applications
  7. Low Power Operation: CMOS technology minimizes power consumption

Ordering and Availability Information

Part Number Breakdown

XC3195A-3PG175C

  • XC3195A: Device family and gate count identifier
  • 3: Speed grade (-3 = commercial/industrial grade)
  • PG175: Package type (Plastic Grid Array, 175 pins)
  • C: Temperature range (Commercial: 0°C to +70°C)

Package Options Comparison

Package Code Package Type Pin Count Application
PG175 Plastic Pin Grid Array 175 Standard industrial applications
PQ160 Plastic Quad Flat Pack 160 Space-constrained designs
PP175 Plastic Pin Grid Array 175 Alternative package option
PQ208 Plastic Quad Flat Pack 208 Enhanced I/O requirements

Integration and Implementation Guidelines

PCB Design Considerations

When designing with the XC3195A-3PG175C, engineers should consider:

  • Decoupling Capacitors: Proper power supply decoupling for noise reduction
  • Signal Integrity: Controlled impedance routing for high-speed signals
  • Ground Plane: Continuous ground plane for EMI reduction
  • Clock Distribution: Careful clock routing to minimize skew
  • Thermal Management: Adequate airflow or heatsinking for thermal dissipation

Interface Compatibility

Interface Type Compatibility
Logic Levels TTL and CMOS compatible inputs
Input Thresholds User-selectable TTL or CMOS thresholds
Output Drive Configurable drive strength
3-State Capability Internal 3-state bus support

Frequently Asked Questions

Common Technical Queries

Q: What is the maximum operating frequency of the XC3195A-3PG175C?
A: The device supports toggle rates up to 270 MHz with system clock speeds exceeding 85 MHz, depending on design complexity and routing.

Q: Can the XC3195A-3PG175C be reprogrammed?
A: Yes, the FPGA offers unlimited reprogrammability, allowing easy design iterations and in-system logic changes without hardware modifications.

Q: What development tools are compatible?
A: The XC3195A-3PG175C is supported by Xilinx’s XACT development system and legacy ISE Design Suite, providing comprehensive design entry, simulation, and verification capabilities.

Q: What is the difference between speed grades?
A: Speed grade -3 indicates commercial/industrial grade performance with guaranteed timing specifications suitable for most applications. Lower numbers indicate faster performance grades.

Summary and Conclusion

The XC3195A-3PG175C represents a robust, high-performance FPGA solution for engineers requiring flexible, programmable logic capabilities in demanding applications. With 7,500 usable gates, 484 configurable logic cells, and toggle rates up to 270 MHz, this device delivers exceptional performance for telecommunications, industrial control, digital signal processing, and embedded systems development.

As part of the trusted Xilinx FPGA family, the XC3195A-3PG175C combines proven technology with modern performance characteristics, offering unlimited reprogrammability, extensive I/O resources, and comprehensive development tool support. The 175-pin PPGA package provides robust mechanical stability and excellent thermal performance for reliable operation in industrial environments.

Whether you’re replacing legacy TTL logic, integrating complex subsystems, or developing custom digital solutions, the XC3195A-3PG175C delivers the flexibility, performance, and reliability required for successful FPGA-based designs.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.