Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC3195-5PQ160I: High-Performance FPGA for Industrial Control Applications

Product Details

Product Overview: XC3195-5PQ160I Field Programmable Gate Array

The XC3195-5PQ160I represents a mature and reliable solution in the XC3000 family of Field Programmable Gate Arrays manufactured by Xilinx (now part of AMD). This industrial-grade FPGA delivers robust performance for legacy system maintenance, aerospace applications, and industrial control systems requiring proven technology. Currently manufactured and distributed by Rochester Electronics, this component ensures continued availability for mission-critical applications.

As a member of the XC3100 series, the XC3195-5PQ160I offers 7,500 usable gates organized into 484 logic cells, providing engineers with substantial programmable logic resources for complex digital designs. The device operates reliably across industrial temperature ranges, making it an ideal choice for demanding environments where performance consistency is paramount.

Technical Specifications and Key Features

Core Architecture and Performance

Specification Value
Logic Cells 484 configurable cells
Usable Gates 7,500 gates
Maximum Frequency 227 MHz
Operating Voltage 5V ±5%
Package Type 160-Pin PQFP (Plastic Quad Flat Pack)
Temperature Grade Industrial (-40°C to +100°C)
Process Technology CMOS Logic Cell Array (LCA)

Advanced FPGA Architecture

The XC3195-5PQ160I employs Xilinx’s proven Logic Cell Array architecture, featuring three essential configurable elements that work in harmony:

Configurable Logic Blocks (CLBs) – The core array consists of programmable logic blocks that can implement complex combinatorial and sequential logic functions. Each CLB contains flip-flops, lookup tables, and multiplexers for maximum design flexibility.

Input/Output Blocks (IOBs) – The peripheral IOB ring provides flexible interfacing capabilities with bidirectional buffers, programmable pull-up/pull-down resistors, and configurable voltage levels for seamless integration with various logic families.

Interconnect Resources – A sophisticated programmable interconnection matrix enables efficient routing between CLBs and IOBs, optimizing signal integrity and minimizing propagation delays.

Package Information and Physical Characteristics

160-Pin PQFP Package Details

Parameter Specification
Package Style PQFP (Plastic Quad Flat Pack)
Total Pin Count 160 pins
Pin Pitch 0.65mm
Body Dimensions 28mm x 28mm
Package Height 3.4mm typical
Lead Frame Material Copper alloy
Moisture Sensitivity Level MSL 3

The compact PQFP-160 package offers an excellent balance between I/O density and PCB footprint, making it suitable for space-constrained applications. The fine-pitch design requires appropriate PCB manufacturing capabilities and soldering techniques for reliable assembly.

Applications and Use Cases

Industrial Control Systems

The XC3195-5PQ160I excels in industrial automation environments where programmable logic control, motor drive systems, and process monitoring require customizable logic implementation. Its 5V operation ensures compatibility with legacy industrial equipment.

Legacy System Maintenance

For aerospace, defense, and industrial sectors maintaining long-lifecycle products, this FPGA provides form-fit-function replacement capabilities. Rochester Electronics’ authorized manufacturing ensures supply continuity for systems requiring decades of support.

Communications Equipment

The device’s adequate logic resources and I/O flexibility make it suitable for protocol conversion, data formatting, and interface bridging in telecommunications infrastructure where field-programmable solutions offer maintenance advantages.

Test and Measurement Instrumentation

Engineers designing custom test equipment benefit from the XC3195-5PQ160I’s reconfigurability, allowing instruments to be updated for new test protocols without hardware redesign.

Programming and Development Tools

Design Software Compatibility

The XC3195-5PQ160I is supported by Xilinx’s XACT development system, which provides comprehensive tools for FPGA design entry, simulation, and implementation:

  • Schematic Capture – Graphical design entry for logic implementation
  • Auto Place-and-Route – Automated optimization of logic placement and signal routing
  • Timing Simulation – Pre-implementation timing analysis
  • In-Circuit Emulation – Real-time debugging capabilities

Modern designs can also utilize Xilinx ISE (Integrated Software Environment) for compatibility with contemporary development workflows, though Vivado Design Suite does not support this legacy device family.

Programming Methods

Configuration options for the XC3195-5PQ160I include:

  • Serial PROM-based configuration
  • Parallel byte-wide loading
  • Master/slave daisy-chain programming
  • JTAG boundary-scan programming for in-system updates

Reliability and Quality Standards

Industrial Temperature Rating

The “I” designation in XC3195-5PQ160I indicates industrial temperature grade qualification, guaranteeing operation from -40°C to +100°C. This extended range ensures reliable performance in harsh environments including outdoor installations, automotive systems, and industrial furnaces.

Quality Assurance

Rochester Electronics manufactures this device under stringent quality controls, maintaining original Xilinx specifications. Each production lot undergoes comprehensive testing including:

  • Parametric testing across voltage and temperature extremes
  • Functional pattern verification
  • Burn-in screening for enhanced reliability
  • ESD protection validation

Comparison with Modern Xilinx FPGA Solutions

While the XC3195-5PQ160I serves critical roles in legacy applications, understanding its position relative to contemporary FPGAs helps engineers make informed decisions:

Legacy vs Modern Architectures

Feature XC3195-5PQ160I Modern FPGAs
Logic Density 7.5K gates Up to 10M+ logic cells
Core Voltage 5V 0.9V – 1.2V
Power Efficiency Legacy CMOS Advanced FinFET
DSP Blocks Not available Dedicated DSP slices
Block RAM Limited Multiple Mb on-chip
SerDes Interfaces Not available Multi-Gbps transceivers

When to Choose XC3195-5PQ160I

Select this FPGA for:

  • Maintaining existing designs with proven reliability
  • 5V system integration requirements
  • Cost-sensitive applications not requiring advanced features
  • Long-term availability needs through authorized legacy manufacturing

Ordering Information and Availability

Part Number Breakdown

XC3195-5PQ160I decodes as follows:

  • XC3195 – Device family and logic capacity
  • 5 – Speed grade (-5 indicating moderate performance)
  • PQ160 – Package type (160-pin Plastic Quad)
  • I – Industrial temperature range

Procurement Considerations

Rochester Electronics serves as the authorized manufacturer providing genuine XC3195-5PQ160I devices with:

  • Full traceability to original Xilinx specifications
  • Long-term supply agreements for lifecycle management
  • Technical support for legacy designs
  • Certificate of Conformance documentation

Design Best Practices and Recommendations

Thermal Management

Despite operating at 5V, proper thermal design ensures long-term reliability:

  • Calculate worst-case power dissipation based on logic utilization
  • Provide adequate copper pour for heat spreading
  • Consider forced air cooling for continuously operating systems
  • Monitor junction temperature during qualification testing

Power Supply Design

The XC3195-5PQ160I requires stable 5V power with appropriate decoupling:

  • Place 0.1μF ceramic capacitors at each power pin pair
  • Include 10μF bulk capacitance per device
  • Design power distribution with low impedance paths
  • Implement power sequencing if multiple voltage domains exist

Signal Integrity Considerations

High-frequency designs should address:

  • Controlled impedance routing for critical signals
  • Proper termination of long traces
  • Ground plane continuity beneath the device
  • EMI shielding for radiated emissions compliance

Environmental and Compliance Information

RoHS and REACH Compliance

Rochester Electronics manufactures the XC3195-5PQ160I in compliance with environmental regulations including RoHS directives for restricted substances and REACH registration requirements. Documentation is available upon request for regulatory compliance verification.

ESD Sensitivity

The device exhibits HBM (Human Body Model) ESD protection to 2kV minimum, requiring standard ESD handling precautions during assembly and testing operations.

Technical Support and Resources

Engineers working with the XC3195-5PQ160I can access:

  • Legacy datasheets and application notes from Xilinx archives
  • Rochester Electronics technical support team
  • Online FPGA development communities
  • Third-party design service providers specializing in legacy FPGA support

Conclusion: Trusted Performance for Critical Applications

The XC3195-5PQ160I Field Programmable Gate Array continues serving essential roles across industrial, aerospace, and legacy system applications. Its proven architecture, industrial temperature rating, and guaranteed long-term availability through Rochester Electronics make it the logical choice for maintaining existing designs and developing new systems requiring traditional 5V FPGA capabilities.

For engineers seeking reliable programmable logic with extensive field history and authorized manufacturing support, the XC3195-5PQ160I delivers time-tested performance. Whether maintaining decades-old systems or designing new equipment compatible with legacy infrastructure, this FPGA provides the programmable logic solution backed by comprehensive technical support and quality assurance.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.