Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC3190A-5PG175C FPGA: Comprehensive Technical Guide and Specifications

Product Details

Overview of XC3190A-5PG175C Field-Programmable Gate Array

The XC3190A-5PG175C is a high-performance Field-Programmable Gate Array (FPGA) from the XC3000A series, designed for complex digital logic applications requiring flexibility and reliability. This programmable logic device delivers exceptional processing capabilities with 3000 usable gates and advanced configuration options, making it ideal for industrial control systems, telecommunications equipment, and custom digital design projects.

Key Features and Technical Specifications

Core Performance Parameters

The XC3190A-5PG175C FPGA provides robust functionality for demanding applications:

Specification Value
Part Number XC3190A-5PG175C
Logic Elements 3000 Usable Gates
Package Type 175-Pin PGA (Pin Grid Array)
Speed Grade -5 (Standard Performance)
Operating Temperature Commercial (0°C to +70°C)
Supply Voltage 5V
Technology CMOS

Package Configuration Details

Parameter Description
Pin Count 175 Pins
Package Style PGA (Pin Grid Array)
Mounting Type Through-Hole
Body Dimensions Square Ceramic Package
Lead Spacing Standard 0.1″ (2.54mm) Grid

Applications and Use Cases for XC3190A-5PG175C

Industrial and Commercial Applications

The XC3190A-5PG175C excels in various implementation scenarios:

  • Industrial Control Systems: Programmable logic controllers (PLCs) and automation systems
  • Communications Equipment: Protocol converters and interface bridges
  • Test and Measurement: Custom instrumentation and signal processing
  • Embedded Systems: Glue logic and system integration
  • Legacy System Upgrades: Replacing obsolete logic components

Design Flexibility Benefits

This Xilinx FPGA offers exceptional versatility for system designers seeking reconfigurable hardware solutions. The device supports various design methodologies including schematic capture, VHDL, and Verilog HDL programming, enabling rapid prototyping and iterative development cycles.

Technical Architecture and Design Capabilities

Logic Block Configuration

Feature Specification
Configurable Logic Blocks (CLBs) Multiple CLB array
I/O Blocks Programmable input/output cells
Routing Resources Hierarchical interconnect matrix
Configuration Memory SRAM-based
Programming Cycles Unlimited reprogramming

Memory and Storage Features

The XC3190A-5PG175C incorporates distributed RAM within configurable logic blocks, supporting:

  • Synchronous and asynchronous operation modes
  • Variable depth memory configurations
  • Dual-port RAM functionality
  • ROM emulation capabilities

Electrical Characteristics and Performance

Power Specifications

Parameter Typical Maximum Units
Supply Voltage (Vcc) 5.0 5.25 V
Core Current 150 200 mA
I/O Current Variable 100 mA per pin
Total Power Consumption 750 1000 mW

Timing and Speed Characteristics

The -5 speed grade designation indicates standard performance timing:

  • Propagation Delay: 10-15 ns typical
  • Setup Time: 5 ns typical
  • Clock-to-Output: 12 ns maximum
  • Maximum Toggle Frequency: 50 MHz typical

Design Tools and Development Support

Software Compatibility

The XC3190A-5PG175C is compatible with industry-standard FPGA development tools:

  • Foundation Series design software
  • Alliance Series development environment
  • Third-party synthesis tools supporting XC3000A architecture
  • JTAG boundary-scan programming interface

Programming and Configuration

Method Description
Serial Mode Bitstream loading via serial PROM
Master Mode Self-configuration from external memory
Slave Mode Host processor configuration
JTAG IEEE 1149.1 boundary-scan support

Quality and Reliability Standards

Environmental and Operational Requirements

The XC3190A-5PG175C meets stringent quality benchmarks:

  • ESD Protection: Human Body Model (HBM) qualified
  • Latch-up Immunity: JEDEC standard compliant
  • Moisture Sensitivity Level: MSL 3
  • RoHS Compliance: Check specific batch documentation
  • Lifecycle Status: Mature product, check availability

Comparison with Related FPGA Devices

XC3000A Series Family Overview

Model Logic Gates Package Options Speed Grades
XC3020A 2000 68-pin PLCC -4, -5, -6
XC3030A 3000 84-pin PLCC -4, -5, -6
XC3190A 3000 175-pin PGA -4, -5, -6
XC3195A 5000 175-pin PGA -4, -5, -6

Installation and Integration Guidelines

PCB Layout Recommendations

For optimal XC3190A-5PG175C performance:

  1. Decoupling Capacitors: Place 0.1µF ceramic capacitors adjacent to each Vcc pin
  2. Power Distribution: Implement dedicated power and ground planes
  3. Signal Integrity: Maintain controlled impedance for high-speed signals
  4. Thermal Management: Ensure adequate airflow for commercial temperature operation
  5. Configuration Circuits: Follow manufacturer guidelines for programming interfaces

Socket and Mounting Options

Socket Type Pin Count Compatibility
PGA Socket 175-pin Direct replacement capable
ZIF Socket 175-pin Development and testing
Direct Solder N/A Production deployment

Procurement and Ordering Information

Standard Package Marking

The XC3190A-5PG175C device marking includes:

  • Manufacturer logo
  • Device part number
  • Speed grade designation
  • Date code and lot traceability
  • Country of origin

Lead Time and Availability Considerations

As a mature product from the XC3000A family, availability may be subject to:

  • Extended lead times for volume orders
  • Authorized distributor stock levels
  • Potential obsolescence notices
  • Alternative sourcing through franchise distributors

Frequently Asked Questions About XC3190A-5PG175C

What is the difference between XC3190A-5PG175C and XC3190-3PP175C?

The primary differences lie in speed grade (-5 vs -3) and package designation. The -5 speed grade offers standard performance timing, while -3 provides faster operation. Package codes indicate specific thermal and mechanical characteristics.

Can XC3190A-5PG175C be programmed multiple times?

Yes, the SRAM-based configuration architecture allows unlimited reprogramming cycles, making it ideal for iterative design development and field updates.

What development tools are required for XC3190A-5PG175C design?

Compatible tools include Xilinx Foundation Series software, ISE development environment (legacy versions), and various third-party synthesis tools supporting the XC3000A architecture.

Is XC3190A-5PG175C suitable for new designs?

While functionally capable, designers should consider newer FPGA families for new projects due to improved density, performance, and power efficiency in modern devices. This device serves well for legacy system maintenance and specific applications requiring 5V operation.

Conclusion: XC3190A-5PG175C FPGA Selection Guide

The XC3190A-5PG175C represents a proven FPGA solution for applications requiring moderate logic density, 5V operation, and through-hole packaging. Its 3000-gate capacity, combined with the versatile 175-pin PGA package, provides adequate resources for industrial control, communications interfaces, and custom logic implementations. Design engineers should evaluate current availability, compare with modern alternatives, and consider lifecycle management when incorporating this device into new projects.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.