Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC3064A-7PQ160C: High-Performance Field Programmable Gate Array for Advanced Digital Design Applications

Product Details

Product Overview: AMD XC3064A-7PQ160C FPGA

The XC3064A-7PQ160C is a high-performance Field Programmable Gate Array (FPGA) from AMD (formerly Xilinx), designed for engineers and developers seeking flexible, reprogrammable digital logic solutions. This advanced programmable logic device belongs to the renowned XC3000A series, offering enhanced interconnect resources and superior performance characteristics for complex digital design applications.

What is the XC3064A-7PQ160C?

The XC3064A-7PQ160C represents a sophisticated FPGA solution featuring 224 Configurable Logic Blocks (CLBs) and approximately 4,000 usable gates. This Xilinx FPGA delivers exceptional flexibility for telecommunications, industrial control systems, consumer electronics, and prototype development projects requiring reconfigurable hardware logic.

Technical Specifications and Key Features

Core FPGA Specifications

Specification Details
Part Number XC3064A-7PQ160C
Manufacturer AMD (Xilinx)
Product Family XC3000A/L Series
Logic Elements 224 Configurable Logic Blocks (CLBs)
Equivalent Gate Count ~4,000 gates
Total Memory 46,064 bits
Maximum I/O Pins 120 user I/O
Operating Frequency Up to 113 MHz
Technology CMOS
Supply Voltage 5V ±5%

Package and Environmental Specifications

Parameter Value
Package Type 160-Pin BQFP (Plastic Quad Flat Pack)
Package Code PQ160
Mounting Type Surface Mount Technology (SMT)
Operating Temperature Range 0°C to +70°C (Commercial Grade)
Speed Grade -7 (Standard performance)
RoHS Compliance RoHS Compliant
Moisture Sensitivity Level MSL 3
Lead Type Gull Wing

Advanced Architecture and Design Capabilities

Configurable Logic Block Architecture

The XC3064A FPGA employs a proven architecture consisting of three fundamental configurable elements working together seamlessly:

1. Configurable Logic Blocks (CLBs): The device features 224 CLBs arranged in a regular array, each containing combinational logic, sequential elements, and local routing resources. These blocks enable implementation of complex Boolean functions, registers, and state machines.

2. Input/Output Blocks (IOBs): Positioned around the device perimeter, the IOBs provide flexible interfacing with external components. Each IOB supports programmable input/output configurations including TTL, CMOS, and other standard logic levels.

3. Programmable Interconnect Resources: Enhanced interconnect architecture provides flexible routing between CLBs and IOBs, supporting efficient signal distribution throughout the device while minimizing propagation delays.

Programmability and Configuration

Feature Description
Configuration Method SRAM-based configuration
Reprogrammability Unlimited in-circuit reprogramming cycles
Configuration Time Milliseconds (typical)
Configuration Modes Master Serial, Slave Serial, Master Parallel, Slave Parallel, Peripheral
Bitstream Compression Supported for faster configuration
Partial Reconfiguration Not supported (full reconfiguration required)

Performance Characteristics and Timing

Speed and Timing Parameters

The -7 speed grade designation indicates standard performance characteristics optimized for most commercial applications:

Timing Parameter Typical Value
Maximum Toggle Rate 113 MHz
CLB Propagation Delay 7 ns (maximum)
Pin-to-Pin Delay Speed grade dependent
Clock-to-Output Delay 8-12 ns typical
Setup Time 5 ns typical
Hold Time 1 ns typical

Power Consumption

Operating Mode Typical Current Max Current
Static (No Toggling) 10-30 mA 50 mA
Dynamic (50% Toggle) 150-250 mA 400 mA
Sleep/Standby Mode Not available N/A

Application Areas and Use Cases

Primary Application Domains

Telecommunications and Networking The XC3064A-7PQ160C excels in telecommunications applications requiring protocol conversion, signal processing, and interface bridging. Its 113 MHz performance capability supports standard communication protocols while offering the flexibility to adapt to evolving standards.

Industrial Control Systems For industrial automation and control applications, this FPGA provides reliable logic implementation for PLCs, motion controllers, and sensor interface circuits. The commercial temperature range suits most industrial environments.

Prototyping and Development Design engineers leverage the unlimited reprogrammability for rapid prototyping, allowing multiple design iterations without hardware changes. This accelerates time-to-market while reducing development costs.

Consumer Electronics The device finds applications in consumer products requiring custom logic functions, such as display controllers, interface adapters, and embedded system applications where ASIC costs are prohibitive.

Educational and Research Academic institutions utilize the XC3064A series for teaching digital design principles, providing students hands-on experience with reconfigurable logic technology.

Design Tools and Development Support

Software Development Environment

Tool Compatibility
Primary Design Suite Xilinx ISE (Integrated Software Environment)
Schematic Capture Supported with ISE Foundation
HDL Support VHDL, Verilog
Simulation Tools ModelSim, ISim (ISE Simulator)
Synthesis Tools XST (Xilinx Synthesis Technology)
Place and Route Automatic with manual optimization options
Timing Analysis Static timing analyzer included
Programming Tools iMPACT, Parallel Cable III/IV, Platform Cable USB

Design Entry Methods

Schematic Capture: Traditional schematic entry provides visual design representation, ideal for smaller designs and educational purposes.

Hardware Description Languages: Professional designers typically employ VHDL or Verilog HDL for complex designs, enabling better design management, reusability, and verification.

IP Core Integration: Compatible with Xilinx LogiCORE IP library, allowing designers to integrate pre-verified functional blocks including math functions, memory controllers, and communication interfaces.

Competitive Advantages and Benefits

Why Choose the XC3064A-7PQ160C?

Proven Reliability: The XC3000A series has established an excellent track record in production environments worldwide, with millions of deployed units demonstrating long-term reliability.

Cost-Effective Solution: For medium-complexity applications, this FPGA offers an optimal balance between functionality and cost, particularly for production volumes where ASIC development is uneconomical.

Flexible Reprogrammability: Unlike fixed-function ASICs, the XC3064A allows post-deployment updates, enabling bug fixes, feature enhancements, and functionality changes without hardware modifications.

Standard Package Options: The 160-pin BQFP package provides sufficient I/O capability while maintaining manageable PCB routing complexity, suitable for both prototype and production designs.

Extensive Documentation: Comprehensive datasheets, application notes, and reference designs accelerate development and reduce technical risk.

Comparison with Alternative Devices

XC3000A Family Comparison

Device CLBs Gates Max I/O Package Pins
XC3042A 112 ~2,000 96 132
XC3064A 224 ~4,000 120 160
XC3090A 320 ~6,000 144 175
XC30100A 400 ~8,000 168 191

Differentiation from Modern FPGAs

While contemporary FPGA families offer higher gate counts, embedded memory blocks, DSP slices, and lower power consumption, the XC3064A-7PQ160C maintains relevance for applications requiring:

  • Legacy design compatibility
  • 5V supply voltage operation
  • Simplified architecture for straightforward implementations
  • Cost-sensitive applications with moderate complexity requirements
  • Mature, stable product specifications

Ordering Information and Packaging Options

Part Number Breakdown

XC3064A-7PQ160C

  • XC3064A: Device family and capacity (224 CLBs)
  • -7: Speed grade (standard performance)
  • PQ160: Package type (160-pin Plastic Quad Flat Pack)
  • C: Commercial temperature range (0°C to +70°C)

Available Package Variations

Package Code Type Pin Count Dimensions
PC84 Plastic Leaded Chip Carrier 84 84-pin PLCC
PG132 Pin Grid Array 132 Ceramic PGA
PQ160 Plastic Quad Flat Pack 160 28mm × 28mm
TQ144 Thin Quad Flat Pack 144 20mm × 20mm

Packaging for Distribution

Packaging Method Typical Quantity
Tube 35-40 units per tube
Tape and Reel 500-1000 units per reel
Tray 100-200 units per tray

Design Considerations and Best Practices

PCB Layout Guidelines

Power Distribution: Implement separate power planes for VCC and GND with adequate decoupling capacitors (0.1µF and 10µF) placed near each power pin group.

Signal Integrity: Maintain controlled impedance for high-speed signals, with trace lengths matched for critical timing paths. Keep clock distribution traces short with minimal loading.

Thermal Management: While the XC3064A typically doesn’t require active cooling, ensure adequate PCB copper area for heat dissipation in thermally constrained environments.

Configuration Interface: Provide reliable connections for configuration pins, with pull-up/pull-down resistors as specified in the datasheet to ensure proper mode selection.

Design Optimization Strategies

Resource Utilization: Target 70-80% CLB utilization for optimal place-and-route results, leaving margin for design changes and timing optimization.

Clock Management: Use global clock buffers for primary clocks to minimize skew and ensure proper timing closure across the device.

Timing Constraints: Define comprehensive timing constraints in the design tool to guide place-and-route optimization and verify timing requirements are met.

Power Optimization: Implement clock gating for unused logic blocks to reduce dynamic power consumption in battery-powered or thermally sensitive applications.

Quality and Compliance

Manufacturing and Testing

All XC3064A-7PQ160C devices undergo comprehensive factory testing to ensure functionality and reliability:

  • 100% Production Testing: Every device is functionally tested before shipment
  • Burn-in Testing: Available upon request for high-reliability applications
  • Quality Assurance: Manufactured in ISO-certified facilities with stringent quality control

Environmental and Regulatory Compliance

Standard Status
RoHS Directive Compliant (Lead-free)
REACH Compliant
Conflict Minerals DRC Conflict Free
WEEE Compliant
Moisture Sensitivity MSL Level 3 per J-STD-020

Technical Support and Resources

Available Documentation

Datasheet: Complete electrical specifications, timing parameters, and package information

User Guide: Comprehensive architectural description and design methodology

Application Notes: Implementation examples for common design scenarios

IBIS Models: For signal integrity simulation

Reference Designs: Proven design examples to accelerate development

Community and Support

Access extensive support resources through AMD/Xilinx forums, technical support channels, and third-party FPGA communities. Design engineers worldwide share knowledge, solutions, and best practices for XC3000 series devices.

Conclusion: Is the XC3064A-7PQ160C Right for Your Project?

The XC3064A-7PQ160C FPGA represents a reliable, cost-effective solution for medium-complexity digital designs requiring programmable logic flexibility. Its proven architecture, comprehensive development tool support, and extensive package options make it suitable for telecommunications, industrial control, consumer electronics, and educational applications.

For design engineers working with legacy systems, prototyping new concepts, or implementing custom logic functions where ASIC development is impractical, the XC3064A delivers the functionality and flexibility needed while maintaining economic viability.

Key Takeaways

  • 224 Configurable Logic Blocks providing ~4,000 usable gates
  • 113 MHz maximum operating frequency suitable for most commercial applications
  • 160-pin BQFP package with 120 user I/O pins
  • Unlimited reprogrammability enabling iterative design refinement
  • Compatible with industry-standard Xilinx ISE development tools
  • RoHS compliant with commercial temperature range operation
  • Cost-effective alternative to ASIC development for moderate production volumes

Whether you’re modernizing existing designs, creating new embedded systems, or teaching digital design principles, the XC3064A-7PQ160C offers the balance of capability, flexibility, and support needed for successful project completion.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.