Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC3042-100PP132C: High-Performance Xilinx FPGA for Advanced Digital Design

Product Details

Overview of XC3042-100PP132C Field Programmable Gate Array

The XC3042-100PP132C is a professional-grade Field Programmable Gate Array (FPGA) manufactured by Xilinx (now part of AMD), belonging to the industry-proven XC3000 series family. This 132-pin PPGA (Plastic Pin Grid Array) device delivers exceptional performance for custom VLSI design applications, offering designers a flexible, reprogrammable solution for complex digital logic implementations.

As a member of the XC3000 family, the XC3042-100PP132C represents mature FPGA technology with a proven track record in industrial, commercial, and embedded system applications. With 3,000 usable gates and 144 configurable logic cells operating at 100MHz, this FPGA provides an ideal balance between logic capacity, speed, and cost-effectiveness.

Key Technical Specifications

Core Performance Parameters

Specification Value
Part Number XC3042-100PP132C
Manufacturer Xilinx (AMD)
Product Family XC3000 Series FPGAs
Logic Cells 144 CLBs (Configurable Logic Blocks)
Usable Gates 3,000 gates
Maximum Frequency 100 MHz
Supply Voltage 5V
Package Type 132-Pin PPGA (Plastic Pin Grid Array)
Speed Grade -100 (10ns)
Operating Temperature Commercial: 0°C to +70°C

Package and Physical Characteristics

Parameter Description
Package Style PPGA (Plastic Pin Grid Array)
Pin Count 132 pins
Mounting Type Through-hole
Package Dimensions Standard 132-pin PGA footprint
I/O Pins Available Up to 118 user I/O pins
Weight Lightweight plastic construction

Architecture and Design Features

Configurable Logic Block (CLB) Architecture

The XC3042-100PP132C features a sophisticated Logic Cell Array (LCA) architecture composed of three primary configurable elements:

  • 144 Configurable Logic Blocks (CLBs): Each CLB contains combinatorial logic and flip-flops for implementing complex sequential and combinatorial functions
  • I/O Blocks (IOBs): Perimeter programmable I/O blocks providing flexible interface capabilities
  • Interconnect Resources: Comprehensive routing architecture enabling efficient signal distribution throughout the device

Advanced FPGA Capabilities

Feature Benefit
CMOS Static Memory Technology Low power consumption with high reliability
In-System Reprogrammability Unlimited design iterations without hardware changes
Fast Configuration Approximately 290 clock cycles (~195-580 μs)
Internal 3-State Buses Efficient resource sharing and complex data routing
On-Chip Oscillator Built-in crystal oscillator amplifier for clock generation
Flexible I/O Standards TTL or CMOS input threshold compatibility

Application Areas and Use Cases

Industrial and Commercial Applications

The XC3042-100PP132C excels in diverse application scenarios:

  1. Digital Signal Processing (DSP) – Implementing custom filters, modulators, and signal conditioning circuits
  2. Control Systems – Motor controllers, PID controllers, and industrial automation logic
  3. Communication Interfaces – Protocol converters, UART, SPI, I2C implementations
  4. Test Equipment – Pattern generators, logic analyzers, and measurement instruments
  5. Prototyping – Rapid hardware prototyping for ASIC validation
  6. Legacy System Maintenance – Replacement for obsolete TTL, MSI, and PLD components
  7. Embedded Computing – Glue logic, peripheral interfaces, and system integration

Design Advantages

The Xilinx FPGA architecture provides significant advantages for engineers:

  • Replaces Multiple ICs: Integrates TTL, MSI, and other discrete logic components into a single programmable device
  • No NRE Costs: Eliminates non-recurring engineering expenses associated with custom ASIC development
  • Rapid Time-to-Market: Immediate prototyping and production without mask fabrication delays
  • Risk Reduction: Field-upgradeable design allows post-deployment modifications

Performance Characteristics

Timing and Speed Specifications

Performance Metric Specification
Logic Delay 9-10 ns typical
Toggle Rate Up to 100 MHz
System Clock Speed >80 MHz achievable
Configuration Time 195-580 microseconds
Pin-to-Pin Delay Dependent on routing (typically 15-25ns)

Power Consumption

Power Parameter Value
Static Power 0.07 mW per MHz (typical)
Dynamic Power 0.50 mW per MHz (typical)
Standby Current <10 mA
Active Current Varies with design complexity (50-200mA typical)

Development and Programming

Design Tools and Software

The XC3042-100PP132C is supported by comprehensive development tools:

  • Xilinx ISE Design Suite: Legacy but fully functional design environment
  • XACT Development System: Original tool suite for schematic capture and place-and-route
  • Third-Party Tools: Compatible with various HDL synthesis tools (VHDL, Verilog)
  • Simulation Support: Logic and timing simulation capabilities for design verification

Programming Methods

Configuration Mode Description
Master Serial Mode Device autonomously configures from external memory
Slave Serial Mode External controller provides configuration data
Boundary Scan (JTAG) IEEE 1149.1 compatible programming and testing
Peripheral Mode Configuration through microprocessor interface

Quality and Reliability

Manufacturing Standards

  • CMOS Process Technology: Sub-micron manufacturing for optimal performance and reliability
  • Quality Assurance: Manufactured to industry-leading standards with comprehensive testing
  • Long-Term Availability: While classified as mature technology, components remain available through authorized distributors
  • RoHS Compliance: Environmental compliance for modern manufacturing requirements

Operational Reliability

Reliability Parameter Specification
MTBF >1,000,000 hours
Configuration Retention >20 years at 25°C
Program/Erase Cycles Unlimited reprogramming capability
ESD Protection Human Body Model compliant

Pin Configuration and Package Information

132-Pin PPGA Package Details

The PP132C package designation indicates:

  • PP: Plastic Pin Grid Array
  • 132: Total pin count
  • C: Commercial temperature grade

Pin Categories

Pin Type Quantity Function
User I/O Up to 118 pins Configurable input/output
Power (VCC) Multiple pins +5V supply connections
Ground (GND) Multiple pins Ground reference
Configuration 4-6 pins DONE, PROG, CLK, DIN, DOUT

Comparison with Related Products

XC3042 Package Variants

Part Number Package Pin Count Key Difference
XC3042-100PP132C PPGA 132 This product – Plastic PGA
XC3042-100PG132C CPGA 132 Ceramic PGA variant
XC3042-100PQ100C PQFP 100 Quad Flat Pack, fewer I/O
XC3042-100PC84C PLCC 84 Smaller package, reduced I/O
XC3042-100TQ100C TQFP 100 Thin Quad Flat Pack

Ordering Information and Availability

Part Number Breakdown

XC3042-100PP132C

  • XC3042: Device family and gate count (3000 gates, 42 = 4200 gate equivalent)
  • -100: Speed grade (-100 = 10ns, commercial grade)
  • PP: Package type (Plastic Pin Grid Array)
  • 132: Pin count
  • C: Commercial temperature range (0°C to +70°C)

Temperature Grade Options

Grade Code Temperature Range Application
C (Commercial) 0°C to +70°C Standard commercial applications
I (Industrial) -40°C to +85°C Industrial environments
M (Military) -55°C to +125°C Military and aerospace

Design Considerations and Best Practices

PCB Design Guidelines

  1. Power Distribution: Use proper power plane design with adequate decoupling capacitors (0.1µF ceramic near each power pin)
  2. Signal Integrity: Maintain controlled impedance for high-speed signals
  3. Thermal Management: Ensure adequate airflow; device typically requires no heatsink for normal operation
  4. Pin Assignment: Utilize the device’s flexible I/O for optimal routing
  5. Configuration Circuit: Include proper pull-up/pull-down resistors on configuration pins

Common Design Tips

  • Resource Utilization: Target 70-80% CLB utilization for optimal performance
  • Clock Distribution: Use dedicated clock nets for global timing
  • I/O Standards: Match voltage levels carefully when interfacing with other devices
  • Configuration Strategy: Choose appropriate configuration mode based on system requirements
  • Backup Design: Maintain configuration bitstream in non-volatile memory for power-on initialization

Frequently Asked Questions

Q: Is the XC3042-100PP132C still in production? The XC3000 series is considered mature/legacy technology. While Xilinx no longer actively manufactures new units, substantial inventory exists through authorized distributors and specialized suppliers.

Q: What is the difference between PP132C and PG132C packages? PP132C uses a plastic pin grid array construction, while PG132C uses ceramic. The plastic version is more cost-effective for commercial applications; ceramic offers superior thermal performance and hermetic sealing for demanding environments.

Q: Can I use modern development tools with this FPGA? Yes, the ISE Design Suite (versions 14.7 and earlier) fully supports the XC3000 series. While Vivado does not support legacy devices, ISE remains available for download from Xilinx.

Q: What are suitable replacement or upgrade options? For new designs, consider Spartan series FPGAs (Spartan-3, Spartan-6, or Spartan-7) which offer significantly more resources, lower power consumption, and modern I/O standards while maintaining compatibility with standard FPGA design flows.

Technical Support and Documentation

Available Resources

  • Datasheet: Complete electrical and timing specifications
  • User Guide: Comprehensive architecture and design information
  • Application Notes: Design examples and best practices
  • Development Tools: ISE Design Suite documentation
  • Community Support: Online forums and technical communities

Summary: Why Choose XC3042-100PP132C

The XC3042-100PP132C represents a proven FPGA solution offering:

Reliable Performance: Industry-tested architecture with millions of deployed units
Cost-Effective Design: Mature technology at competitive pricing
Flexible Development: Unlimited reprogrammability for design iterations
Wide Compatibility: Standard 5V logic interface compatible with existing systems
Comprehensive Support: Extensive documentation and legacy tool availability

Whether you’re maintaining legacy equipment, prototyping new designs, or requiring a cost-optimized programmable logic solution, the XC3042-100PP132C delivers proven FPGA capabilities in a robust 132-pin package.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.