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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

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XC2S600E-6FGG456C: High-Performance Spartan-IIE FPGA for Industrial Applications

Product Details

The XC2S600E-6FGG456C is a robust field-programmable gate array (FPGA) from AMD’s Spartan-IIE family, engineered to deliver exceptional performance for cost-sensitive digital design applications. This 456-pin FBGA device combines 600,000 system gates with advanced programmable logic capabilities, making it an ideal solution for telecommunications, industrial automation, consumer electronics, and embedded system development.

Overview of XC2S600E-6FGG456C FPGA

The XC2S600E-6FGG456C represents AMD’s commitment to providing affordable, high-density programmable logic solutions. Built on proven 0.15-micron technology, this FPGA delivers reliable performance while maintaining low power consumption and competitive pricing for volume production.

Key Features and Benefits

This Xilinx FPGA offers comprehensive functionality for complex digital designs, with architecture optimized for rapid prototyping and production deployment.

Technical Specifications

Core Architecture Parameters

Specification Value
System Gates 600,000 gates
Logic Cells 15,552 cells
Configurable Logic Blocks (CLBs) 3,456 CLBs
Maximum Operating Frequency 357 MHz
Process Technology 0.15 µm (micron)
Operating Voltage 1.71V ~ 1.89V

Memory Resources

Memory Type Capacity
Total RAM Bits 294,912 bits
Block RAM Up to 288 Kbits
Distributed RAM Up to 221,184 bits
RAM Configuration 16 bits/LUT distributed RAM
Block RAM Type Configurable 4K-bit true dual-port

I/O and Package Specifications

Parameter Specification
User I/O Pins 329 I/O
Package Type 456-Pin FBGA (Fine-Pitch Ball Grid Array)
Package Dimensions 23mm x 23mm
Mounting Type Surface Mount
Operating Temperature Range 0°C to +85°C (TJ – Junction Temperature)
Packaging Format Tray

Advanced FPGA Features

SelectRAM Hierarchical Memory System

The XC2S600E-6FGG456C incorporates AMD’s SelectRAM technology, providing flexible memory architecture with both distributed and block RAM configurations. This hierarchical approach enables efficient memory utilization across various application requirements.

Delay-Locked Loops (DLLs)

Equipped with four on-chip Delay-Locked Loops, the device ensures precise clock management and distribution. DLLs eliminate clock distribution delays and skew, providing reliable synchronous system operation at high frequencies.

I/O Standards Support

The FPGA supports 19 selectable I/O standards, offering exceptional interface flexibility. This compatibility enables seamless integration with various system components and legacy interfaces without additional external circuitry.

Performance Characteristics

Speed Grade Analysis

Speed Grade Maximum Frequency Application Profile
-6 Speed Grade 357 MHz Standard commercial applications
Temperature Performance Commercial (0°C to 85°C) Industrial-grade reliability
Interconnect Type Fast, predictable routing Consistent timing closure

Application Domains

Industrial Control Systems

The XC2S600E-6FGG456C excels in industrial automation applications, providing reliable control logic for manufacturing equipment, process control systems, and robotic controllers. Its 329 I/O pins accommodate extensive sensor and actuator interfaces.

Telecommunications Infrastructure

With 357 MHz operating frequency and substantial logic resources, this FPGA handles complex signal processing tasks in telecommunications equipment, including protocol conversion, data switching, and network interface applications.

Consumer Electronics

Cost-effective design makes the XC2S600E-6FGG456C suitable for high-volume consumer applications such as digital displays, audio/video processing equipment, and smart home devices.

Embedded System Development

The device serves as an excellent platform for embedded system prototyping and deployment, offering sufficient logic capacity for processor interfaces, peripheral controllers, and custom accelerator implementations.

Design Advantages Over ASICs

Development Flexibility

Unlike mask-programmed ASICs, the XC2S600E-6FGG456C offers unlimited in-system reprogrammability. Design modifications can be implemented through software updates without hardware changes, significantly reducing development risk and time-to-market.

Cost-Effective Solution

The FPGA eliminates high initial NRE (Non-Recurring Engineering) costs associated with ASIC development. This makes it economically viable for low-to-medium volume production runs and rapidly evolving product requirements.

Rapid Prototyping

Fast design iteration cycles enable quick verification and testing. The predictable interconnect architecture ensures that timing requirements remain consistent across design revisions.

Development Tool Compatibility

The XC2S600E-6FGG456C is supported by AMD’s comprehensive FPGA development ecosystem, including ISE Design Suite for legacy projects and integration pathways for modern tool chains. This ensures long-term design support and migration options.

Programming and Configuration

Configuration Options

The device supports multiple configuration modes, including:

  • Master Serial mode for autonomous configuration
  • Slave Serial mode for system-controlled programming
  • Boundary Scan (JTAG) for development and debugging
  • SelectMAP parallel configuration for rapid loading

In-System Programmability

The FPGA’s in-system programming capability enables field updates and custom configuration management, essential for deployed systems requiring firmware updates or feature enhancements.

Quality and Reliability

Manufacturing Standards

Manufactured using advanced 0.15-micron semiconductor processes, the XC2S600E-6FGG456C meets stringent quality standards for commercial and industrial applications. The device undergoes comprehensive testing to ensure performance across the full operating temperature range.

Thermal Management

The 456-FBGA package provides efficient thermal dissipation characteristics, with the 23mm x 23mm form factor offering optimal balance between board space utilization and thermal performance.

Comparison Table: XC2S600E Variants

Part Number Speed Grade Package I/O Count Temperature Range Application
XC2S600E-6FGG456C -6 (357 MHz) 456-FBGA 329 Commercial (0-85°C) General purpose
XC2S600E-7FGG456C -7 (400 MHz) 456-FBGA 329 Commercial (0-85°C) High-performance
XC2S600E-6FGG456I -6 (357 MHz) 456-FBGA 329 Industrial (-40-100°C) Harsh environments
XC2S600E-6FGG676C -6 (357 MHz) 676-FBGA Higher I/O Commercial (0-85°C) I/O intensive

Design Considerations

Power Supply Requirements

The device operates on a nominal 1.8V core supply (1.71V to 1.89V range), requiring appropriate voltage regulation and power distribution network design. Multiple power domains support various I/O voltage standards.

PCB Layout Guidelines

The fine-pitch BGA package requires careful PCB design attention, including controlled impedance routing, proper power plane distribution, and adequate thermal vias for heat dissipation.

Clock Resource Planning

With four DLLs available, designers should plan clock distribution strategies early in the design process to optimize timing performance and minimize clock skew.

Frequently Asked Questions

What Makes the XC2S600E-6FGG456C Suitable for Cost-Sensitive Applications?

The Spartan-IIE family is specifically architected to balance performance with affordability. The 0.15-micron process technology and streamlined feature set derived from the Virtex-E architecture enable competitive pricing while maintaining robust functionality.

How Does the -6 Speed Grade Compare to Other Options?

The -6 speed grade provides 357 MHz maximum frequency, suitable for most commercial applications. For designs requiring higher performance, the -7 speed grade variant offers 400 MHz operation with otherwise identical specifications.

What Development Tools Are Required?

AMD’s ISE Design Suite provides comprehensive development support, including synthesis, implementation, and timing analysis tools. The software supports industry-standard HDL languages (VHDL and Verilog) and includes simulation capabilities.

Can This FPGA Be Used in Industrial Temperature Applications?

The XC2S600E-6FGG456C is specified for commercial temperature range (0°C to 85°C). For industrial temperature applications (-40°C to 100°C), consider the -6FGG456I variant, which offers identical functionality with extended temperature qualification.

Summary

The XC2S600E-6FGG456C delivers compelling value for engineers seeking a balance of logic capacity, performance, and cost-effectiveness. With 600,000 system gates, 329 I/O pins, and 357 MHz operation, this FPGA addresses diverse application requirements from industrial control to telecommunications infrastructure. Its proven Spartan-IIE architecture, flexible configuration options, and comprehensive development tool support make it a reliable choice for both new designs and legacy system maintenance.

For engineers evaluating FPGA solutions, the XC2S600E-6FGG456C represents a mature, well-supported platform with extensive documentation and a proven track record in production deployments worldwide.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.