Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S600E-7FG456Q: High-Performance Spartan-IIE FPGA for Advanced Digital Design

Product Details

Product Overview

The XC2S600E-7FG456Q represents a powerful and cost-effective Field Programmable Gate Array (FPGA) solution from AMD (formerly Xilinx). This advanced Spartan-IIE family device delivers exceptional performance with 600,000 system gates, making it ideal for high-volume applications requiring fast programmable logic solutions. As a premier Xilinx FPGA device, the XC2S600E-7FG456Q combines versatile functionality with industry-leading reliability for demanding digital design projects.

Key Technical Specifications

Core FPGA Features

Specification Value
Family Spartan-IIE
System Gates 600,000 gates
Logic Cells 15,552 cells
Speed Grade -7 (High Performance)
Package Type 456-Pin Fine-Pitch BGA (FPBGA)
Technology Node 0.15μm process
Operating Voltage 1.71V – 1.89V (Core)
I/O Pins 329 user I/O

Memory Architecture

Memory Type Capacity
Block RAM Up to 288 Kbits
Distributed RAM Up to 221,184 bits
RAM Configuration 16 bits per LUT distributed RAM, 4K-bit true dual-port block RAM

Performance Specifications

Parameter Specification
Maximum Frequency 357 MHz
Operating Temperature -40°C to +125°C (TJ)
Mounting Type Surface Mount
RoHS Compliance Available in Pb-free options

Advanced FPGA Architecture

Configurable Logic Blocks (CLBs)

The XC2S600E-7FG456Q features a sophisticated architecture based on the proven Virtex-E platform. Each Configurable Logic Block contains four Logic Cells organized in two similar slices, enabling efficient implementation of complex digital functions. The hierarchical design supports versatile routing channels that ensure fast and predictable interconnect performance across successive design iterations.

Memory Flexibility

This FPGA device offers dual memory hierarchy for maximum design flexibility. Distributed RAM utilizes Look-Up Tables (LUTs) for small, distributed storage needs, while true dual-port Block RAM provides larger memory blocks ideal for buffering, FIFO implementations, and data storage applications.

Clock Management

The device incorporates four Delay-Locked Loops (DLLs) that provide precise clock distribution and deskew capabilities, essential for high-speed digital designs requiring tight timing control and synchronization.

I/O Capabilities and Interface Standards

Programmable I/O Features

Feature Description
I/O Standards 19 selectable standards including LVTTL, LVCMOS, SSTL, HSTL
I/O Banking Independent voltage control per I/O bank
Slew Rate Control Programmable output slew rates
Input Hysteresis Available on all inputs
Pull-up/Pull-down Configurable weak keepers

Each Input/Output Block (IOB) features independent registers that can function as D-type flip-flops or level-sensitive latches, providing flexibility for interfacing with various external components and systems.

Configuration Options

Flexible Programming Modes

The XC2S600E-7FG456Q supports multiple configuration methods for diverse application requirements:

Configuration Modes:

  • Master Serial Mode (from external PROM)
  • Slave Serial Mode
  • Slave Parallel Mode
  • Boundary Scan (JTAG) Mode

The device offers unlimited reprogrammability, allowing for field upgrades and design modifications without hardware replacement. This flexibility makes it superior to traditional mask-programmed ASICs while avoiding initial costs, lengthy development cycles, and inherent risks.

Platform Flash Integration

AMD offers compatible Platform Flash in-system programmable configuration PROMs that provide cost-effective, reliable configuration storage solutions for the XC2S600E-7FG456Q.

Application Areas

Target Industries and Use Cases

Industrial Automation:

  • Process control systems
  • Factory automation
  • Robotics control interfaces
  • Motion control applications

Communications:

  • Protocol bridging
  • Data packet processing
  • Network interface controllers
  • Telecommunications equipment

Medical Electronics:

  • Diagnostic equipment
  • Medical imaging systems
  • Patient monitoring devices
  • Laboratory instrumentation

Consumer Electronics:

  • High-definition video processing
  • Audio signal processing
  • Gaming platforms
  • Smart home controllers

Automotive:

  • Advanced driver assistance systems (ADAS)
  • Infotainment systems
  • Engine control units
  • Dashboard displays

Design Advantages

FPGA vs ASIC Benefits

Cost Effectiveness:

  • No NRE (Non-Recurring Engineering) charges
  • Reduced time-to-market
  • Lower risk investment for product development
  • Volume production economies

Design Flexibility:

  • Field-upgradeable firmware
  • Bug fixes post-deployment
  • Feature enhancements without hardware changes
  • Rapid prototyping capabilities

Performance:

  • Predictable timing across design iterations
  • Fast routing architecture
  • Optimized interconnect delays
  • High-speed clock distribution

Package Information

456-FBGA Package Details

Package Characteristic Specification
Pin Count 456 pins
Package Type Fine-Pitch Ball Grid Array
Pitch 1.0mm ball pitch
Package Size Compact footprint for space-constrained designs
Thermal Performance Optimized for heat dissipation

The FBGA package provides excellent electrical performance with minimal inductance and superior signal integrity, making it ideal for high-speed digital applications.

Quality and Reliability

Manufacturing Standards

The XC2S600E-7FG456Q is manufactured using advanced 0.15-micron CMOS technology, ensuring reliable operation across the full commercial and industrial temperature range. The device undergoes rigorous testing to meet AMD’s quality standards and complies with international electronics manufacturing requirements.

Obsolescence Considerations

While this product has been designated as obsolete by AMD (per XCN12026), existing inventory remains available through authorized distributors. Engineers should consider newer FPGA families for new designs while the XC2S600E-7FG456Q continues to serve legacy applications and replacement requirements.

Development Tools and Support

Design Software

Xilinx ISE Design Suite:

  • Comprehensive synthesis and implementation tools
  • Timing analysis and verification
  • Bitstream generation
  • ChipScope Pro debugging

Third-Party Tools:

  • Synopsys Synplify Pro
  • Mentor Graphics Precision Synthesis
  • Aldec Active-HDL
  • ModelSim simulation

Programming Languages

  • VHDL (VHSIC Hardware Description Language)
  • Verilog HDL
  • SystemVerilog
  • Schematic entry

Ordering Information and Part Number Breakdown

Part Number Decode: XC2S600E-7FG456Q

  • XC2S = Spartan-IIE Family
  • 600E = 600K gates, Extended features
  • -7 = Speed grade (fastest commercial grade)
  • FG456 = 456-pin Fine-pitch BGA package
  • Q = Quality grade (standard commercial)

Technical Comparison Table

Speed Grade Performance Comparison

Speed Grade Maximum Frequency Typical Application
-5 ~290 MHz Cost-sensitive designs
-6 ~325 MHz Standard performance
-7 ~357 MHz High-performance applications

Power Consumption Characteristics

Supply Voltage Requirements

Supply Rail Voltage Range Purpose
VCCINT 1.71V – 1.89V Core logic power
VCCO 1.2V – 3.3V I/O banks power (per bank)
VCCAUX 2.375V – 2.625V Auxiliary circuits

Power consumption varies based on design complexity, clock frequency, I/O activity, and logic utilization. Designers should use AMD’s XPower tool for accurate power estimation.

Storage and Handling

Environmental Requirements

  • Storage temperature: -55°C to +150°C
  • Moisture sensitivity level: As marked on package
  • ESD protection: Handle with proper ESD precautions
  • Shelf life: Per manufacturer specifications

Conclusion

The XC2S600E-7FG456Q Spartan-IIE FPGA delivers an optimal balance of performance, flexibility, and cost-effectiveness for digital design projects. With its robust architecture, comprehensive I/O capabilities, and extensive memory resources, this device enables engineers to implement sophisticated digital systems with confidence. Whether upgrading legacy designs or supporting existing products, the XC2S600E-7FG456Q continues to provide reliable FPGA functionality for demanding applications.

For engineers seeking a proven FPGA solution with established performance credentials and broad industry acceptance, the XC2S600E-7FG456Q represents a strategic component choice that combines technical excellence with practical design advantages.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.