Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S600E-7FG456C: High-Performance FPGA for Advanced Digital Applications

Product Details

The XC2S600E-7FG456C is a powerful field-programmable gate array from AMD Xilinx’s renowned Spartan-IIE family, engineered to deliver exceptional performance for demanding digital logic applications. This programmable logic device combines flexibility, reliability, and robust processing capabilities in a compact 456-pin package, making it ideal for engineers seeking versatile solutions across telecommunications, industrial automation, and aerospace industries.

Overview of XC2S600E-7FG456C FPGA

The XC2S600E-7FG456C represents Xilinx’s commitment to providing cost-effective, high-performance programmable logic solutions. As part of the Spartan-IIE series, this FPGA offers unlimited reprogramming cycles, enabling design iterations without hardware replacement—a significant advantage over traditional ASICs.

Key Technical Specifications

Specification Details
Part Number XC2S600E-7FG456C
Manufacturer AMD Xilinx (formerly Xilinx Inc.)
Product Family Spartan-IIE FPGA
System Gates 600,000 gates
Speed Grade -7 (160 MHz maximum frequency)
Package Type 456-pin Fine-pitch Ball Grid Array (FBGA/FG456)
I/O Pins 456 user-programmable I/Os
Power Supply 1.8V VCCINT core voltage
Block RAM Up to 288 Kbits
Distributed RAM Up to 221,184 bits

Architecture and Performance Features

Advanced Configurable Logic Blocks

The XC2S600E-7FG456C features a sophisticated architecture built around Configurable Logic Blocks (CLBs) surrounded by programmable Input/Output Blocks (IOBs). This design enables engineers to implement complex digital circuits with exceptional flexibility.

Core Architecture Components:

Component Specification
CLB Structure 4 Logic Cells per CLB, organized in 2 slices
Delay-Locked Loops (DLLs) 4 DLLs for clock management
Block RAM Columns 6 columns for XC2S600E variant
I/O Standards 19 selectable standards supported
Routing Channels Hierarchical versatile routing architecture

Speed Grade and Timing Performance

The -7 speed grade designation indicates this FPGA can operate at maximum frequencies up to 160 MHz, providing sufficient performance for most industrial and commercial applications. The predictable interconnect ensures successive design iterations consistently meet timing requirements.

Memory Resources and Storage

Block RAM Configuration

Memory Type Capacity Configuration
Fast Block RAM Up to 288 Kbits total Dual-port configuration available
Distributed RAM 221,184 bits Flexible LUT-based implementation
Configuration Memory Static memory cells Unlimited reprogramming cycles

The substantial block RAM capacity makes the XC2S600E-7FG456C particularly suitable for applications requiring on-chip data buffering, FIFO implementations, and lookup tables.

Package Information: FG456C Details

Physical Characteristics

Package Parameter Specification
Package Type Fine-pitch Ball Grid Array (FBGA)
Pin Count 456 pins
Package Code FG456C
Mounting Type Surface mount technology
Thermal Management Enhanced thermal dissipation design

The FG456C package provides an optimal balance between I/O density and thermal performance, enabling efficient PCB layout while maintaining robust signal integrity.

Configuration and Programming Options

The XC2S600E-7FG456C supports multiple configuration modes to accommodate various system requirements:

Configuration Modes:

Mode Description Application
Master Serial FPGA controls configuration from external PROM Standalone systems
Slave Serial External controller loads configuration data Embedded applications
Slave Parallel Parallel data loading for faster configuration High-speed systems
Boundary Scan (JTAG) Programming via IEEE 1149.1 interface Development and testing

Platform Flash Integration

Xilinx offers compatible Platform Flash in-system programmable configuration PROMs, providing low-cost, reliable configuration storage solutions. This enables field upgrades without hardware modifications.

Application Areas and Use Cases

Primary Application Domains

The XC2S600E-7FG456C excels in diverse applications requiring programmable logic:

Industry Applications:

Industry Typical Applications
Telecommunications Signal processing, protocol conversion, network interfaces
Industrial Automation Motion control, sensor interfaces, PLC implementations
Aerospace & Defense Avionics systems, radar processing, secure communications
Automotive Electronics Advanced driver assistance, infotainment systems, control units
Consumer Electronics Video/audio processing, display controllers, interface bridging
Medical Devices Imaging systems, diagnostic equipment, monitoring devices

Design Prototyping and Development

Beyond production applications, this FPGA serves as an excellent platform for prototyping and testing digital logic designs before committing to ASIC development, significantly reducing development risk and cost.

Technical Advantages Over ASICs

Cost and Development Benefits

Advantage FPGA Benefit ASIC Limitation
Initial Investment Low upfront costs High NRE charges
Development Time Rapid prototyping and deployment Lengthy fabrication cycles
Design Flexibility Field-upgradeable firmware Fixed functionality
Risk Management Iterative design refinement Single-shot production risk
Volume Flexibility Economical for various volumes Only cost-effective at high volumes

Power Management and Electrical Characteristics

Voltage Requirements

Power Rail Voltage Purpose
VCCINT 1.8V Core logic supply
VCCO 2.5V or 3.3V I/O bank supplies (configurable)
VCCAUX 2.5V Auxiliary circuits (DLLs, configuration)

I/O Standards Compatibility

The XC2S600E-7FG456C supports 19 different I/O standards, including LVTTL, LVCMOS, SSTL, HSTL, and differential standards, ensuring compatibility with diverse system interfaces.

Quality and Reliability Standards

Product Certifications

  • RoHS Compliant: Lead-free packaging options available
  • Industrial Temperature Range: Extended operating temperature variants
  • Quality Assurance: Manufactured to ISO/IATF standards
  • Reliability Testing: Comprehensive qualification per JEDEC standards

Integration with Xilinx Development Tools

The XC2S600E-7FG456C integrates seamlessly with Xilinx’s comprehensive development ecosystem:

  • Vivado Design Suite: Modern FPGA design environment
  • ISE WebPACK: Free development tools for Spartan devices
  • IP Core Libraries: Pre-verified functional blocks
  • Simulation Tools: ModelSim integration for verification

For comprehensive resources on Xilinx FPGA development and implementation, designers can access extensive documentation, application notes, and reference designs.

Procurement and Availability

Product Variants and Ordering Information

Part Number Speed Grade Package Status
XC2S600E-7FG456C -7 (160 MHz) FG456 Available
XC2S600E-6FG456C -6 (faster) FG456 Available
XC2S600E-7FG676C -7 (160 MHz) FG676 Available

Quality Guarantee

Authorized distributors typically provide:

  • 365-day warranty on new, original components
  • Anti-static packaging with ESD protection
  • Traceable documentation including datasheets and test reports
  • Global shipping via DHL, FedEx, UPS with tracking

Design Considerations and Best Practices

Thermal Management

Proper thermal design is essential for reliable operation:

  • Ensure adequate PCB copper pour for heat dissipation
  • Consider airflow requirements in enclosure design
  • Monitor junction temperature during operation
  • Use thermal simulation tools during PCB layout

Signal Integrity Recommendations

  • Implement controlled impedance traces for high-speed signals
  • Maintain proper ground plane continuity
  • Use appropriate termination for I/O standards
  • Follow Xilinx PCB design guidelines for optimal performance

Comparison with Spartan-IIE Family Members

Device System Gates Block RAM Max I/Os Typical Use Case
XC2S50E 50,000 32 Kbits 182 Small embedded systems
XC2S100E 100,000 40 Kbits 202 Basic signal processing
XC2S150E 150,000 72 Kbits 265 Medium complexity designs
XC2S200E 200,000 112 Kbits 265 Network interfaces
XC2S300E 300,000 216 Kbits 329 Advanced controllers
XC2S400E 400,000 216 Kbits 410 High-performance applications
XC2S600E 600,000 288 Kbits 456 Complex system implementations

Migration Path and Future-Proofing

While the Spartan-IIE family is considered a mature product line, its proven architecture ensures long-term availability and support. For next-generation designs, engineers can migrate to modern Xilinx/AMD FPGA families while leveraging existing design knowledge and IP cores.

Technical Support and Resources

Documentation Access

  • Datasheet DS077: Complete electrical and timing specifications
  • User Guides: Comprehensive architecture and implementation details
  • Application Notes: Industry-specific design guidelines
  • Reference Designs: Proven implementation examples

Development Community

The extensive Xilinx user community provides valuable resources including forums, design examples, and troubleshooting assistance, accelerating development timelines and reducing technical risks.

Conclusion: Why Choose XC2S600E-7FG456C

The XC2S600E-7FG456C delivers an optimal combination of logic density, memory resources, and I/O capabilities for mid-range FPGA applications. Its -7 speed grade provides reliable performance at 160 MHz, while the 456-pin FBGA package offers excellent I/O density in a compact footprint.

Key reasons to select this FPGA:

✓ Proven Spartan-IIE architecture with extensive field deployment
✓ 600,000 system gates for complex logic implementations
✓ 288 Kbits of block RAM for data-intensive applications
✓ Cost-effective alternative to ASIC development
✓ Unlimited reprogrammability for design iterations
✓ Comprehensive development tool support
✓ Wide availability from authorized distributors

Whether you’re developing telecommunications equipment, industrial control systems, or aerospace applications, the XC2S600E-7FG456C provides the performance, flexibility, and reliability required for successful product development.

For procurement inquiries, technical specifications, or application support, consult authorized AMD Xilinx distributors who can provide genuine components with full warranty coverage and technical documentation.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.