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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XC2S600E-6FGG456C: High-Performance FPGA Spartan-IIE Family | Complete Specification Guide

Product Details

Overview of XC2S600E-6FGG456C Field Programmable Gate Array

The XC2S600E-6FGG456C is a high-performance field-programmable gate array (FPGA) from AMD Xilinx’s renowned Spartan-IIE family. This versatile programmable logic device delivers exceptional flexibility and processing power for demanding embedded applications across telecommunications, aerospace, automotive, and industrial automation sectors.

Manufactured using advanced 0.15μm technology, this FPGA combines 600,000 system gates with robust I/O capabilities in a compact 456-pin FBGA package, making it an ideal solution for complex digital circuit designs requiring reliable performance and configurability.

Technical Specifications at a Glance

Specification Details
Part Number XC2S600E-6FGG456C
Manufacturer AMD Xilinx (formerly Xilinx Inc.)
Product Family Spartan-IIE FPGA
System Gates 600,000 gates
Logic Cells 15,552 cells
Package Type 456-pin FBGA (Fine-pitch Ball Grid Array)
Package Dimensions 23mm x 23mm
Total I/O Pins 329 user I/Os (up to 648 maximum)
Operating Voltage 1.8V (1.71V – 1.89V)
Speed Grade -6 (6ns delay)
Maximum Frequency 357 MHz internal clock
Block RAM 2.5 Mb fast block RAM (36 kB total)
RAM Size 294,912 bits
Technology Node 0.15μm CMOS process
Operating Temperature 0°C to 85°C (TJ – Commercial Grade)
Mounting Type Surface Mount
RoHS Compliant Yes

Key Features and Performance Capabilities

Advanced Logic Architecture

The XC2S600E-6FGG456C features a sophisticated architecture with 15,552 configurable logic cells and 600,000 system gates, providing ample resources for implementing complex digital designs. The device incorporates 3,456 logic elements that can be programmed to execute various logic operations, making it suitable for applications ranging from simple control systems to complex signal processing tasks.

High-Speed Performance

With a maximum internal clock frequency of 357 MHz and a speed grade of -6, this Xilinx FPGA delivers exceptional processing speed for time-critical applications. The 6-nanosecond delay specification ensures minimal latency in signal propagation, crucial for real-time processing requirements.

Flexible I/O Configuration

The device offers 329 dedicated user I/O pins with expansion capability up to 648 I/Os, providing extensive connectivity options for interfacing with external components, sensors, communication modules, and other system peripherals. This flexibility makes the XC2S600E-6FGG456C ideal for multi-interface applications.

Embedded Memory Resources

Featuring 2.5 Mb of fast block RAM (36 kB organized memory), the FPGA provides sufficient on-chip memory for data buffering, lookup tables, and temporary storage without requiring external memory components in many applications. The 294,912-bit total RAM configuration enables efficient data management within the device.

Package Information and Physical Characteristics

Package Parameter Specification
Package Code 456-FBGA / 456-BBGA
Body Size 23mm x 23mm footprint
Pin Count 456 pins (ball grid array)
Pitch Fine-pitch for high-density routing
Mounting Surface Mount Technology (SMT)
Package Material Industry-standard BGA construction
Thermal Performance Commercial temperature range

The compact 456-FBGA package provides an excellent balance between I/O density and PCB routing convenience, making it suitable for space-constrained designs while maintaining signal integrity.

Application Areas and Use Cases

Telecommunications and Networking

The XC2S600E-6FGG456C excels in telecommunications infrastructure, supporting protocol conversion, data packet processing, and network interface implementations with its high-speed capabilities and abundant logic resources.

Industrial Automation and Control

Perfect for programmable logic controllers (PLCs), motor control systems, and industrial process automation, this FPGA offers the reliability and configurability needed in harsh industrial environments.

Automotive Electronics

Automotive applications benefit from the device’s commercial temperature range and robust design, suitable for engine control units, advanced driver-assistance systems (ADAS), and in-vehicle networking.

Aerospace and Defense

The high reliability and radiation-tolerant design characteristics make this FPGA appropriate for aerospace applications requiring mission-critical performance and long-term dependability.

Medical Equipment

Medical device manufacturers leverage this FPGA for diagnostic equipment, imaging systems, and patient monitoring devices that demand precise signal processing and real-time data analysis.

Power Supply Requirements

Power Parameter Value
Core Voltage (VCCINT) 1.8V nominal
Voltage Range 1.71V – 1.89V
I/O Voltage (VCCIO) Configurable per bank
Power Consumption Application-dependent

The 1.8V low-voltage operation contributes to reduced power consumption, making the XC2S600E-6FGG456C suitable for battery-powered and energy-efficient applications.

Development and Programming Support

Design Tools Compatibility

This FPGA is fully supported by AMD Xilinx’s development ecosystem, including:

  • ISE Design Suite – Traditional design flow for Spartan-IIE devices
  • VHDL and Verilog – Industry-standard hardware description languages
  • IP Core Libraries – Pre-verified functional blocks
  • Simulation Tools – Comprehensive verification capabilities

Programming and Configuration

The device supports multiple configuration modes including JTAG, serial, and parallel programming interfaces, providing flexibility in system architecture and field updates.

Quality and Reliability Standards

Quality Metric Details
RoHS Compliance Lead-free, environmentally friendly
Manufacturing Standard ISO certified production
Testing 100% factory tested
Warranty Typically 1 year from authorized distributors
Lifecycle Extended availability through distribution

Comparison with Related Xilinx FPGA Models

Part Number Gates Package Speed Grade Key Difference
XC2S600E-6FGG456C 600K 456-FBGA -6 Reference model
XC2S400E-6FGG456C 400K 456-FBGA -6 Fewer logic resources
XC2S600E-6FG676C 600K 676-FBGA -6 Larger package, more I/O
XC2S600E-6FTG256C 600K 256-FTBGA -6 Smaller footprint
XC2S300E-6FG456C 300K 456-FBGA -6 Lower gate count

Procurement and Availability

The XC2S600E-6FGG456C is available through authorized distributors worldwide, typically shipped in anti-static trays for protection during transport. Stock availability varies by distributor, with lead times ranging from immediate availability to several weeks depending on order quantity.

Typical Ordering Information

  • Minimum Order Quantity: 1 piece (varies by distributor)
  • Packaging: Anti-static tray packaging
  • Shipping: Global express options available
  • Documentation: Datasheet, application notes, and reference designs available

Why Choose XC2S600E-6FGG456C?

Proven Technology Platform

The Spartan-IIE family has established itself as a reliable workhorse in the FPGA industry, with millions of devices deployed across critical applications worldwide.

Cost-Effective Performance

This FPGA strikes an optimal balance between functionality and cost, offering substantial logic capacity and speed without the premium pricing of higher-end FPGA families.

Design Flexibility

The extensive I/O count, generous block RAM, and abundant logic resources enable designers to implement diverse functionality within a single device, reducing bill-of-materials cost and board space.

Long-Term Support

AMD Xilinx maintains comprehensive technical support and documentation for the Spartan-IIE family, ensuring long product lifecycles and design continuity.

Technical Support and Resources

For detailed technical specifications, reference designs, and application support for the XC2S600E-6FGG456C, consult the official AMD Xilinx documentation or contact authorized distributors. Pin diagrams, timing specifications, and PCB layout guidelines are available in the comprehensive product datasheet.

Engineers can access extensive online resources including:

  • Complete datasheet with AC/DC characteristics
  • IBIS models for signal integrity analysis
  • Reference designs and example projects
  • Community forums and technical support channels
  • Application notes for common use cases

Conclusion

The XC2S600E-6FGG456C FPGA represents a mature, reliable solution for demanding embedded applications requiring programmable logic capabilities. With its combination of 600,000 gates, high-speed performance, extensive I/O options, and proven Spartan-IIE architecture, this device continues to serve engineers across multiple industries seeking dependable FPGA performance in a cost-effective package.

Whether you’re developing telecommunications equipment, industrial control systems, automotive electronics, or aerospace applications, the XC2S600E-6FGG456C provides the flexibility, performance, and reliability needed for successful product deployment.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.