Product Overview: AMD Xilinx XC2S600E-6FG456I FPGA
The XC2S600E-6FG456I is a powerful Field-Programmable Gate Array (FPGA) from AMD Xilinx’s renowned Spartan-IIE family. This industrial-grade programmable logic device delivers exceptional performance with 600,000 system gates and 15,552 logic cells, making it an ideal solution for demanding embedded systems, telecommunications infrastructure, and digital signal processing applications.
Built on advanced 0.15-micron technology, this Xilinx FPGA combines high-speed operation with low power consumption in a compact 456-pin Fine-pitch Ball Grid Array (FBGA) package, offering engineers a cost-effective alternative to traditional ASIC designs.
Key Technical Specifications
| Specification |
Details |
| Part Number |
XC2S600E-6FG456I |
| Manufacturer |
AMD Xilinx (formerly Xilinx Inc.) |
| Product Family |
Spartan-IIE FPGA |
| System Gates |
600,000 gates |
| Logic Cells |
15,552 cells |
| Block RAM |
2.5 Mb (288 Kbits total) |
| Distributed RAM |
Up to 221,184 bits |
| Maximum Frequency |
357 MHz internal clock |
| Operating Voltage |
1.8V core (VCCINT) |
| Package Type |
456-pin FBGA (Fine-pitch Ball Grid Array) |
| Technology Node |
0.15µm CMOS process |
| Temperature Grade |
Industrial (-40°C to +100°C) |
| Speed Grade |
-6 (standard performance) |
FPGA Architecture and Performance Features
Logic Resources
The XC2S600E-6FG456I features a robust architecture based on Xilinx’s proven Virtex-E technology, optimized for cost-sensitive applications. Each Configurable Logic Block (CLB) contains four Logic Cells (LCs) organized in two slices, providing flexible implementation of complex digital functions.
Memory Capabilities:
- Block RAM: Six columns of dual-port block RAM totaling 2.5 Mb
- Distributed RAM: 16 bits per Look-Up Table (LUT)
- RAM Configuration: Configurable as 4K-bit true dual-port blocks
- Memory Flexibility: Supports both synchronous and asynchronous operations
Input/Output Specifications
| I/O Feature |
Specification |
| User I/O Pins |
Up to 329 pins (package dependent) |
| I/O Standards |
19 selectable standards including LVTTL, LVCMOS, GTL, SSTL, HSTL |
| Voltage Support |
1.5V to 3.3V I/O banks |
| Differential Pairs |
Support for LVDS, RSDS, mini-LVDS |
| Hot Swap |
Hot-swap and hot-insertion capable |
| I/O Banking |
Multiple independent I/O voltage banks |
Clock Management System
The XC2S600E-6FG456I integrates advanced clock management resources:
- DLL (Delay-Locked Loops): Four integrated DLLs for precise clock distribution
- Clock Frequency: Maximum internal frequency of 357 MHz
- Clock Networks: Dedicated low-skew global clock distribution
- Clock Multiplication/Division: Programmable frequency synthesis
- Phase Shifting: Adjustable phase relationships between clocks
Programming and Configuration Options
Configuration Modes
The Spartan-IIE FPGA supports multiple configuration interfaces:
- Master Serial Mode: External serial PROM with automatic configuration
- Slave Serial Mode: Host processor or microcontroller driven
- Slave Parallel Mode: 8-bit parallel configuration interface
- Boundary Scan (JTAG): IEEE 1149.1 compliant configuration and debugging
- SelectMAP: Fast parallel configuration for rapid reconfiguration
Programming Features
| Feature |
Description |
| Configuration Memory |
Static RAM-based (SRAM) |
| Reprogramming Cycles |
Unlimited in-system reprogrammability |
| Configuration Time |
Typically milliseconds (mode dependent) |
| Bitstream Security |
Readback protection available |
| PROM Support |
Compatible with Platform Flash PROMs |
Application Areas and Use Cases
Industrial Control Systems
The XC2S600E-6FG456I excels in industrial automation applications:
- Motor control and drive systems
- Programmable Logic Controllers (PLCs)
- Process monitoring and control
- Factory automation interfaces
- Machine vision processing
Telecommunications Infrastructure
Ideal for networking and communication equipment:
- Protocol conversion and bridging
- Digital signal processing for baseband processing
- Channel encoding/decoding
- Network packet processing
- Wireless infrastructure equipment
Medical Instrumentation
High-reliability applications in healthcare:
- Medical imaging equipment
- Patient monitoring systems
- Diagnostic instrument control
- Laboratory automation
- Portable medical devices
Automotive Electronics
Suitable for automotive-grade applications:
- Advanced driver assistance systems (ADAS)
- Infotainment system controllers
- Engine control units
- Body electronics modules
- Sensor fusion processing
Design Tools and Development Support
Compatible Development Software
| Tool |
Purpose |
| ISE Design Suite |
Primary design entry, synthesis, and implementation |
| Vivado (Legacy Support) |
Modern tool suite with backward compatibility |
| ModelSim/Questa |
HDL simulation and verification |
| ChipScope Pro |
In-system debugging and analysis |
| EDK (Embedded Development Kit) |
Embedded processor system design |
HDL Language Support
- VHDL: Full IEEE 1076 standard compliance
- Verilog: IEEE 1364 standard support
- SystemVerilog: Synthesis subset supported
- Schematic Entry: Graphical design entry option
Package Information: 456-Pin FBGA
Physical Dimensions
| Parameter |
Specification |
| Package Type |
FBGA456 (Fine-pitch Ball Grid Array) |
| Body Size |
23mm x 23mm nominal |
| Ball Pitch |
1.0mm |
| Total Balls |
456 |
| Package Height |
~2.23mm (max) |
| Thermal Resistance |
θJA: ~35°C/W (with airflow) |
PCB Design Considerations
When designing with the XC2S600E-6FG456I FBGA package:
- Recommended PCB stack-up: 6-8 layers for optimal signal integrity
- Via-in-pad technology recommended for dense routing
- Power plane partitioning for separate VCCINT and VCCO domains
- Thermal vias for enhanced heat dissipation
- Minimum trace width/spacing: 4/4 mil for standard routing
Power Supply Requirements
Voltage Rails and Current
| Rail |
Voltage |
Typical Current |
Purpose |
| VCCINT |
1.8V ±5% |
500-800mA |
Core logic power |
| VCCO |
1.5V-3.3V |
200-500mA |
I/O banks (selectable) |
| VCCAUX |
2.5V/3.3V |
50-100mA |
Auxiliary circuits |
Power Consumption
- Static Power: ~200-400mW (design dependent)
- Dynamic Power: Varies with design utilization and switching frequency
- Sleep/Standby: Low-power modes available
- Typical Total: 1-3W in most applications
Quality and Reliability
Manufacturing Standards
- RoHS compliant (lead-free options available)
- JEDEC moisture sensitivity level: MSL 3
- Operating temperature range: -40°C to +100°C (industrial grade)
- Storage temperature: -65°C to +150°C
- ESD protection: HBM Class 1C (>1000V)
Longevity and Lifecycle
Important Note: The XC2S600E family has been designated as not recommended for new designs by AMD Xilinx. Designers should consider newer Spartan-6 or Spartan-7 alternatives for new projects. However, existing designs can continue production with available inventory.
Comparison Table: XC2S600E Variants
| Part Number |
Speed Grade |
Temperature |
Package |
I/O Count |
| XC2S600E-6FG456I |
-6 |
Industrial |
FBGA-456 |
329 |
| XC2S600E-6FG456C |
-6 |
Commercial |
FBGA-456 |
329 |
| XC2S600E-7FG456I |
-7 |
Industrial |
FBGA-456 |
329 |
| XC2S600E-6FG676I |
-6 |
Industrial |
FBGA-676 |
408 |
Getting Started: Development Workflow
Step 1: Design Entry
Create your digital logic design using VHDL, Verilog, or schematic entry tools within ISE Design Suite.
Step 2: Synthesis and Implementation
Synthesize your HDL code into gate-level netlists, then implement (map, place, and route) onto the XC2S600E architecture.
Step 3: Timing Analysis
Verify timing constraints are met using static timing analysis tools. The -6 speed grade provides balanced performance for most applications.
Step 4: Configuration File Generation
Generate the .bit configuration bitstream file for programming the FPGA.
Step 5: Programming and Debugging
Use JTAG interface for initial programming and debugging. Configure via serial PROM for production deployment.
Common Applications Circuit Examples
Digital Signal Processing
- FIR/IIR filter implementations
- FFT/IFFT processors
- Correlation engines
- Adaptive filtering
Interface Bridging
- PCI to UART/SPI conversion
- Ethernet MAC implementations
- USB peripheral controllers
- CAN bus interfaces
Protocol Processing
- Custom communication protocols
- Data encryption/decryption
- Error correction coding
- Frame synchronization
Frequently Asked Questions
Q: Is the XC2S600E-6FG456I suitable for aerospace applications? A: While the industrial temperature grade (-I suffix) can operate in harsh environments, for aerospace applications requiring extended temperature ranges or radiation tolerance, consult AMD Xilinx’s aerospace-grade product lines.
Q: What is the difference between -6 and -7 speed grades? A: The speed grade indicates timing performance. The -6 grade is standard performance, while -7 offers faster propagation delays. Choose based on your timing requirements and budget.
Q: Can I migrate designs from Spartan-IIE to newer families? A: Yes, most designs can be migrated to Spartan-6 or Spartan-7 families with minimal modifications. Consult Xilinx migration guides for specific guidance.
Q: What development boards support this FPGA? A: Several third-party vendors offered Spartan-IIE development boards. Contact distributors for availability of evaluation platforms.
Alternative and Replacement Options
Recommended Upgrades
For new designs, consider these modern alternatives:
- Spartan-6 LX75: Similar gate count, lower power, more features
- Spartan-7 XC7S50: Modern 7-series architecture, enhanced performance
- Artix-7 XC7A50T: Higher performance with lower power consumption
Pin-Compatible Alternatives
- XC2S600E-7FG456I (faster speed grade)
- XC2S400E-6FG456I (lower capacity, same package)
Ordering Information
Part Number Breakdown
XC2S600E-6FG456I
- XC: Xilinx commercial FPGA
- 2S: Spartan-II family
- 600E: 600K gates, Enhanced version
- -6: Speed grade 6
- FG456: Fine-pitch BGA, 456 pins
- I: Industrial temperature grade
Availability
Check with authorized AMD Xilinx distributors for current stock levels. As this is a mature product, verify lead times before committing to production schedules.
Technical Support Resources
- AMD Xilinx Documentation: Official datasheets and reference manuals
- Community Forums: User-to-user technical discussions
- FAE Support: Contact local Field Application Engineers
- Design Services: Third-party FPGA design consultants available
Conclusion: Why Choose the XC2S600E-6FG456I
The XC2S600E-6FG456I Spartan-IIE FPGA represents proven, reliable programmable logic technology ideal for cost-sensitive applications requiring moderate logic density and performance. Its 600,000-gate capacity, comprehensive I/O support, and flexible configuration options make it suitable for diverse industrial, telecommunications, and embedded applications.
While newer FPGA families offer enhanced features and lower power consumption, the XC2S600E continues to serve existing designs effectively. Its unlimited reprogrammability, extensive development tool support, and robust industrial temperature rating ensure reliable operation in demanding environments.
For engineers seeking a balance of performance, cost, and proven reliability, the XC2S600E-6FG456I remains a solid choice for legacy designs and cost-optimized applications where cutting-edge performance is not required.