Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S50E-6TQG144I: Industrial-Grade Spartan-IIE FPGA for Demanding Applications

Product Details

Overview of XC2S50E-6TQG144I FPGA

The XC2S50E-6TQG144I is a high-performance field-programmable gate array (FPGA) from the renowned Spartan-IIE family, manufactured by AMD Xilinx. This industrial-grade programmable logic device delivers exceptional reliability and performance for mission-critical applications requiring extended temperature operation. With 50,000 system gates and 1,728 logic cells, this Xilinx FPGA provides the perfect balance of functionality, cost-effectiveness, and robust operation for industrial control systems, automotive electronics, and embedded applications.

Key Technical Specifications

Core Performance Features

Specification Value
Device Family Spartan-IIE 1.8V FPGA
System Gates 50,000 gates
Logic Cells 1,728 cells
Configurable Logic Blocks (CLBs) 384 CLBs (16 x 24 array)
Maximum Operating Frequency 357 MHz
Process Technology 0.15μm CMOS
Speed Grade -6 (Standard Performance)

Memory Architecture

Memory Type Capacity Description
Block RAM 32 Kbits Dual-port synchronous memory for buffering and storage
Distributed RAM 24,576 bits LUT-based flexible memory implementation
Total Available RAM Up to 288K bits family-wide Configurable memory resources

Input/Output Capabilities

I/O Feature Specification
User I/O Pins 102 I/O
Total Pin Count 144 pins
Supported I/O Standards 19 selectable standards (LVTTL, LVCMOS, HSTL, SSTL, LVDS)
Differential I/O Pairs 32 pairs maximum
Package Type 144-TQFP (Thin Quad Flat Pack)
Package Dimensions 20mm x 20mm

Industrial Temperature Grade Advantages

Extended Operating Temperature Range

The “I” suffix in the XC2S50E-6TQG144I designation indicates Industrial Temperature Grade qualification:

Temperature Grade Operating Range Applications
Industrial (I-Grade) -40°C to +100°C (Junction Temperature) Harsh industrial environments, automotive systems, outdoor equipment
Commercial (C-Grade) 0°C to +85°C (Junction Temperature) Standard commercial applications, consumer electronics

This extended temperature capability makes the XC2S50E-6TQG144I ideal for:

  • Automotive electronics and engine control modules
  • Industrial automation systems in factory environments
  • Outdoor equipment exposed to extreme weather conditions
  • Medical devices requiring reliable operation across temperature ranges
  • Aerospace and defense applications with stringent requirements

Advanced Clock Management Features

Delay-Locked Loops (DLLs)

The XC2S50E-6TQG144I incorporates four integrated DLLs that provide:

  • Precise clock deskewing and distribution
  • Frequency synthesis and multiplication
  • Phase-shifted clock generation
  • Reduced clock-to-output delays
  • Enhanced system timing performance

Power Supply Requirements

Power Parameter Specification
Core Voltage 1.8V (1.71V – 1.89V range)
I/O Voltage Multiple standards supported (1.5V to 3.3V)
Mounting Type Surface Mount Technology (SMT)

Configuration and Programming

Flexible Configuration Options

  • SRAM-based configuration for unlimited reprogrammability
  • In-system reconfiguration without hardware replacement
  • Multiple configuration modes supported
  • Field-upgradable firmware for design iterations
  • JTAG boundary-scan for testing and debugging

Application Areas for XC2S50E-6TQG144I

Industrial Control Systems

The robust design and extended temperature range make this FPGA perfect for:

  • Motor control and drive systems
  • PLC (Programmable Logic Controller) implementations
  • Process control interfaces
  • Industrial Ethernet gateways
  • Sensor interface modules

Automotive Electronics

Automotive designers choose the XC2S50E-6TQG144I for:

  • Instrument cluster displays and controls
  • Infotainment system logic
  • Electronic control units (ECUs)
  • Body control modules
  • ADAS (Advanced Driver Assistance Systems) components

Communication Systems

Telecommunications applications benefit from:

  • Protocol conversion and bridging
  • Serial communication interfaces
  • Network switching logic
  • Data buffering and packet processing
  • Wireless base station control

Medical Equipment

Healthcare technology applications include:

  • Patient monitoring systems
  • Diagnostic equipment control
  • Medical imaging processing
  • Laboratory instrumentation
  • Portable medical devices

Design Development Resources

Software Tools Compatibility

The XC2S50E-6TQG144I is supported by:

  • Xilinx ISE Design Suite for design entry and implementation
  • Vivado Design Suite (with legacy device support)
  • IP Core libraries for rapid development
  • Simulation tools for verification
  • Constraint files and timing analyzers

Package and Mounting Information

144-TQFP Package Details

Package Characteristic Specification
Package Style Thin Quad Flat Pack (TQFP)
Lead Form Gull wing leads
Pin Pitch 0.5mm
Body Size 20mm x 20mm
Mounting Surface mount
PCB Footprint Standard JEDEC footprint

Thermal Characteristics

  • Efficient heat dissipation design
  • Compatible with standard heatsink solutions
  • Thermal via recommendations available
  • Power consumption optimization features

Comparison with Alternative Devices

Spartan-IIE Family Members

Device Logic Cells System Gates CLBs User I/O Block RAM
XC2S50E 1,728 50,000 384 182 32 Kbits
XC2S100E 2,700 100,000 600 202 40 Kbits
XC2S150E 3,888 150,000 864 265 48 Kbits
XC2S200E 5,292 200,000 1,176 289 56 Kbits

Reliability and Quality Standards

Manufacturing Excellence

  • ISO 9001 certified production facilities
  • Automotive-grade quality (IATF 16949 compliant facilities)
  • Comprehensive testing procedures
  • Long-term availability planning
  • Traceability for critical applications

Ordering Information and Part Number Breakdown

Understanding the Part Number: XC2S50E-6TQG144I

  • XC2S = Spartan-IIE family designation
  • 50E = 50,000 system gate density
  • -6 = Speed grade (standard performance)
  • TQG = Thin Quad Flat Pack, Green (RoHS compliant)
  • 144 = Pin count
  • I = Industrial temperature grade (-40°C to +100°C)

Design Considerations and Best Practices

Successful Implementation Tips

  1. Power Supply Design: Implement proper decoupling capacitors near FPGA power pins
  2. Clock Distribution: Utilize global clock networks for optimal timing performance
  3. Thermal Management: Consider ambient temperature and power dissipation in thermal design
  4. I/O Planning: Map high-speed signals to appropriate I/O banks
  5. Configuration: Select appropriate configuration mode for your application

Signal Integrity Recommendations

  • Follow Xilinx PCB layout guidelines
  • Implement proper ground planes
  • Control impedance for high-speed signals
  • Minimize stub lengths on critical nets
  • Use appropriate termination for I/O standards

Competitive Advantages of XC2S50E-6TQG144I

Why Choose This FPGA?

  1. Proven Architecture: Based on mature, reliable Spartan-IIE technology
  2. Cost-Effective Solution: Optimal price-to-performance ratio
  3. Industrial Reliability: Extended temperature operation for harsh environments
  4. Design Flexibility: SRAM-based unlimited reprogrammability
  5. Rich Feature Set: Integrated memory, DLLs, and multiple I/O standards
  6. Extensive Support: Comprehensive documentation and design tools

Legacy and Obsolescence Considerations

Product Lifecycle Status

While the Spartan-IIE family is considered a legacy product line, the XC2S50E-6TQG144I remains available through:

  • Authorized distributors with stock availability
  • Aftermarket suppliers for long-term support
  • Last-time-buy programs for critical applications
  • Alternative device recommendations for new designs

Future-Proof Design Strategies

For new projects, consider:

  • Evaluating newer Spartan-7 or Artix-7 families for enhanced performance
  • Maintaining design portability for potential migration
  • Documenting critical design requirements
  • Planning for long-term component availability

Technical Support and Documentation

Available Resources

  • Complete datasheets with electrical specifications
  • Application notes for specific implementations
  • Reference designs and example code
  • PCB layout guidelines
  • Thermal design calculations
  • Configuration file formats

Conclusion: XC2S50E-6TQG144I Value Proposition

The XC2S50E-6TQG144I represents an excellent choice for engineers requiring a reliable, industrial-grade FPGA solution. Its combination of adequate logic resources, extended temperature operation, flexible I/O capabilities, and proven architecture makes it ideal for demanding applications in industrial, automotive, and embedded systems. Whether you’re designing control systems, communication interfaces, or custom digital logic implementations, this Spartan-IIE FPGA delivers the performance and reliability your project demands.

For designers working with industrial automation, automotive electronics, or any application requiring operation in challenging thermal environments, the XC2S50E-6TQG144I offers the perfect balance of capability, reliability, and cost-effectiveness. Its comprehensive feature set, including block RAM, distributed memory, DLLs, and support for 19 I/O standards, ensures compatibility with a wide range of interface requirements.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.