Product Overview: XC2S50E-6FT256I FPGA Solution
The XC2S50E-6FT256I is a Spartan-IIE family FPGA featuring 50,000 gates and 1,728 logic cells with a maximum operating frequency of 357MHz. Manufactured using advanced 0.15-micron technology, this field-programmable gate array delivers exceptional performance for embedded systems, digital signal processing, and industrial control applications.
Originally developed by Xilinx (now AMD), the XC2S50E-6FT256I represents second-generation ASIC replacement technology that combines high density, low power consumption, and cost-effective programmability in a compact 256-pin FTBGA package.
Key Features and Benefits
Advanced Architecture Design
The XC2S50E-6FT256I incorporates streamlined features based on Virtex-E FPGA architecture with unlimited in-system reprogrammability, allowing designers to update and modify hardware configurations without physical component replacement. This programmable logic device eliminates the high initial costs and lengthy development cycles associated with traditional mask-programmed ASICs.
Superior Performance Specifications
- Logic Density: 50,000 system gates with 1,728 configurable logic cells
- Operating Frequency: Up to 357MHz for high-speed applications
- I/O Capability: 182 user-programmable I/O pins for flexible connectivity
- Manufacturing Process: Cost-effective 0.15-micron CMOS technology
- Package Configuration: 256-pin Fine-Pitch Ball Grid Array (FTBGA)
Memory Architecture Features
The device includes SelectRAM hierarchical memory with 16 bits per LUT distributed RAM and configurable 4K-bit true dual-port block RAM. The total RAM capacity of 4KB (32,768 bits) provides sufficient on-chip memory for embedded applications requiring data buffering and temporary storage.
Technical Specifications Comparison
| Specification |
Value |
Unit |
| Logic Elements |
1,728 |
Cells |
| System Gates |
50,000 |
Gates |
| Maximum Frequency |
357 |
MHz |
| Total RAM Bits |
32,768 |
Bits |
| Number of I/O |
182 |
Pins |
| LABs/CLBs |
384 |
Blocks |
| Supply Voltage |
1.71 – 1.89 |
V |
| Core Voltage |
1.8 |
V |
| Operating Temperature |
-40 to +100 |
°C (TJ) |
| Package Type |
256-FTBGA |
– |
| Package Dimensions |
17 x 17 |
mm |
| Mounting Type |
Surface Mount |
– |
| Technology Node |
0.15 |
μm |
Electrical Characteristics
Power Supply Requirements
| Parameter |
Minimum |
Typical |
Maximum |
Unit |
| Core Voltage (VCCINT) |
1.71 |
1.8 |
1.89 |
V |
| I/O Voltage (VCCO) |
Varies by standard |
– |
3.3 |
V |
| Operating Temperature |
-40 |
25 |
100 |
°C |
Performance Metrics
The XC2S50E-6FT256I designation indicates a speed grade of -6, representing industrial-grade performance with reliable operation across the full industrial temperature range. This makes it suitable for applications requiring robust performance in challenging environmental conditions.
Application Areas and Use Cases
Industrial Automation Systems
The XC2S50E-6FT256I excels in industrial control applications where real-time processing and flexible I/O configurations are essential. The chip is capable of processing large amounts of data quickly and accurately, making it ideal for high-performance applications.
Digital Signal Processing
With its high-speed operation and configurable logic blocks, this FPGA supports advanced DSP algorithms for:
- Digital filtering and signal conditioning
- Real-time data acquisition systems
- Communications protocol implementation
- Motor control applications
Embedded System Development
The device provides an excellent platform for prototyping and production embedded systems, offering flexibility that traditional microcontrollers cannot match. Engineers can implement custom peripheral interfaces, specialized processing engines, and complex state machines.
Communication Interfaces
Supporting 19 selectable I/O standards, the XC2S50E-6FT256I enables seamless integration with various communication protocols including LVTTL, LVCMOS, PCI, and differential signaling standards.
Package Configuration Details
| Package Attribute |
Specification |
| Package Type |
FTBGA (Fine-pitch Ball Grid Array) |
| Total Pin Count |
256 pins |
| Body Size |
17mm x 17mm |
| Pitch |
1.0mm |
| User I/O Pins |
182 |
| Ground Pins |
Multiple |
| Power Pins |
Multiple |
| Mounting |
Surface Mount Technology (SMT) |
The compact FTBGA package offers excellent thermal performance and signal integrity while minimizing board space requirements for dense electronic assemblies.
Configuration and Programming
Configuration Memory
The XC2S50E-6FT256I supports multiple configuration modes:
- Master Serial mode with internal oscillator
- Slave Serial mode for processor-based configuration
- Slave Parallel mode for high-speed configuration
- JTAG boundary-scan configuration and debugging
Development Tool Support
Design and implementation require Hardware Description Language (HDL) programming using industry-standard tools:
- Xilinx ISE Design Suite (legacy support)
- Vivado Design Suite (for newer workflows)
- Third-party synthesis tools compatible with Xilinx FPGAs
For comprehensive FPGA solutions and technical resources, explore our complete Xilinx FPGA product portfolio featuring the latest programmable logic devices and development platforms.
Design Considerations
Thermal Management
The XC2S50E-6FT256I features low power consumption and improved heat dissipation, making it suitable for energy-efficient systems. Proper thermal design ensures reliable operation across the industrial temperature range of -40°C to +100°C junction temperature.
Power Distribution Network
Implementing a robust power distribution network with adequate decoupling capacitors near each power pin ensures stable operation. Separate power planes for core voltage (VCCINT) and I/O voltage (VCCO) minimize noise coupling between different voltage domains.
Signal Integrity
The 256-pin FTBGA package requires careful PCB layout to maintain signal integrity. Key considerations include:
- Controlled impedance routing for high-speed signals
- Minimized trace lengths for critical paths
- Appropriate via structures for BGA escape routing
- Ground plane continuity for return current paths
Comparison with Similar Devices
| Device Model |
Logic Cells |
Gates |
I/O |
Package |
Speed Grade |
| XC2S50E-6FT256I |
1,728 |
50K |
182 |
256-FTBGA |
-6 (Industrial) |
| XC2S100E |
2,700 |
100K |
202 |
Various |
-6/-7 |
| XC2S150E |
3,840 |
150K |
265 |
Various |
-6/-7 |
| XC2S200E |
5,292 |
200K |
283 |
Various |
-6/-7 |
Procurement and Availability
Quality Assurance
When sourcing the XC2S50E-6FT256I, ensure components meet original manufacturer specifications. Authentic parts should include:
- Original manufacturer packaging and labeling
- Date code and lot traceability
- RoHS compliance documentation (where applicable)
- Complete technical documentation and datasheets
Storage and Handling
Follow standard ESD precautions when handling FPGA devices. Store components in moisture-barrier bags with appropriate humidity control until ready for assembly. The FTBGA package is moisture-sensitive and requires proper baking procedures before reflow soldering.
Environmental Compliance
The XC2S50E-6FT256I is manufactured to meet international environmental standards. Depending on the ordering code suffix, devices may be available with lead-free (RoHS-compliant) terminations. Verify specific compliance requirements with your supplier for your target market.
Advantages of FPGA Technology
Versus Traditional ASICs
- No NRE Costs: Eliminate expensive mask sets and fabrication setup fees
- Faster Time-to-Market: Immediate prototyping without fabrication delays
- Design Flexibility: Modify hardware functionality through reprogramming
- Lower Risk: Correct design errors without respin costs
Versus Microcontrollers
- Parallel Processing: Execute multiple operations simultaneously
- Custom Interfaces: Implement any digital protocol or timing
- Deterministic Performance: Guaranteed response times for critical operations
- Scalability: Easily upgrade to higher-density FPGAs in the same family
Getting Started with XC2S50E-6FT256I
Essential Development Steps
- Design Entry: Create your design using VHDL or Verilog HDL
- Synthesis: Convert HDL code to gate-level netlist
- Implementation: Place and route the design within FPGA resources
- Timing Analysis: Verify design meets timing requirements
- Configuration: Program the device through supported configuration mode
Recommended Resources
- Spartan-IIE Family Data Sheet (DS077)
- FPGA Configuration User Guide
- Constraints File Templates
- Reference Design Examples
- Application Notes for specific implementations
Technical Support and Documentation
Complete technical documentation including detailed pinout diagrams, timing specifications, and application guidance is available from authorized distributors. Engineers should consult the official Spartan-IIE datasheet for comprehensive design information.
Conclusion
The XC2S50E-6FT256I delivers an optimal balance of performance, features, and cost-effectiveness for mid-range FPGA applications. Its industrial-grade reliability, comprehensive I/O support, and flexible architecture make it suitable for diverse applications from industrial automation to embedded computing. With proven Xilinx technology and extensive development tool support, the XC2S50E-6FT256I provides a solid foundation for innovative digital designs.
