Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S50-5FG256I: AMD Xilinx Spartan-II FPGA with 50K System Gates

Product Details

The XC2S50-5FG256I is a high-performance Field Programmable Gate Array (FPGA) from AMD Xilinx’s renowned Spartan-II family. This industrial-grade programmable logic device delivers exceptional flexibility and reliability for demanding embedded applications. With 50,000 system gates, 1,728 logic cells, and 176 user I/Os in a compact 256-FBGA package, the XC2S50-5FG256I provides engineers with a cost-effective solution for complex digital designs.


XC2S50-5FG256I Technical Specifications

Parameter Specification
Manufacturer AMD Xilinx
Product Family Spartan-II
Part Number XC2S50-5FG256I
System Gates 50,000
Logic Cells 1,728
CLB Array 16 × 24 (384 CLBs)
Maximum User I/O 176
Distributed RAM 24,576 bits
Block RAM 32K bits
Maximum Frequency 263 MHz
Supply Voltage 2.375V ~ 2.625V (2.5V nominal)
Operating Temperature -40°C to +85°C (Industrial)
Package Type 256-FBGA (17mm × 17mm)
Process Technology 0.18μm CMOS
Speed Grade -5
Mounting Type Surface Mount

XC2S50-5FG256I Key Features and Benefits

High-Density Programmable Logic Architecture

The XC2S50-5FG256I features a robust CLB (Configurable Logic Block) array organized in a 16×24 matrix, providing 384 total CLBs. Each CLB contains four logic cells with look-up tables (LUTs), flip-flops, and dedicated carry logic for efficient arithmetic operations. This architecture enables designers to implement complex digital functions while maintaining optimal resource utilization.

Flexible Memory Resources

This Spartan-II FPGA integrates both distributed and block RAM capabilities. The 24,576 bits of distributed RAM allow for small, fast memory implementations close to logic resources. Additionally, 32K bits of dual-port block RAM support larger memory requirements for data buffering, FIFO implementations, and lookup table applications.

Industrial Temperature Range Operation

The “I” suffix in XC2S50-5FG256I designates industrial-grade operation from -40°C to +85°C. This extended temperature range makes the device suitable for harsh environment applications including industrial automation, outdoor equipment, and automotive systems where temperature extremes are common.

Comprehensive I/O Standards Support

The XC2S50-5FG256I supports multiple I/O standards to ensure seamless interface compatibility:

  • LVCMOS (3.3V, 2.5V, 1.8V)
  • LVTTL
  • PCI 33MHz and 66MHz compliant
  • SSTL2 and SSTL3 (DDR memory interfaces)
  • HSTL Class I, III, and IV
  • GTL and GTL+
  • AGP-2X

XC2S50-5FG256I Part Number Decoder

Understanding the XC2S50-5FG256I part number helps engineers select the correct variant:

Code Segment Meaning
XC2S Xilinx Spartan-II family
50 50,000 system gates
-5 Speed grade 5 (standard speed)
FG Fine-pitch Ball Grid Array
256 256 balls/pins
I Industrial temperature range (-40°C to +85°C)

XC2S50-5FG256I Configuration Options

The XC2S50-5FG256I supports multiple configuration modes for maximum design flexibility:

Master Serial Mode

The FPGA reads configuration data from an external serial PROM automatically upon power-up. This mode is ideal for standalone applications requiring autonomous boot capability.

Slave Serial Mode

An external processor or controller provides configuration data serially. This mode enables system-level configuration management and in-system updates.

Slave Parallel Mode

Configuration data is loaded through an 8-bit parallel interface for faster programming. This mode reduces configuration time for time-critical applications.

JTAG Boundary Scan Mode

IEEE 1149.1 compliant boundary scan enables configuration, debugging, and testing through a standard 4-wire interface. This mode supports in-system programming and board-level testing.


XC2S50-5FG256I Applications

The XC2S50-5FG256I FPGA serves diverse application requirements across multiple industries:

Telecommunications and Networking

Protocol conversion, packet processing, and interface bridging applications benefit from the device’s flexible logic resources and high-speed I/O capabilities.

Industrial Automation

Motor control, sensor interfaces, and PLC implementations leverage the industrial temperature rating and reliable operation characteristics.

Consumer Electronics

Digital video processing, audio interfaces, and display controllers utilize the integrated memory and programmable logic resources.

Medical Equipment

Portable diagnostic devices and patient monitoring systems take advantage of low power consumption and compact packaging.

Automotive Systems

Infotainment interfaces, body electronics, and ADAS preprocessing applications benefit from industrial-grade reliability.


XC2S50-5FG256I Development and Design Tools

Engineers working with the XC2S50-5FG256I can utilize Xilinx ISE Design Suite for complete FPGA development. The toolchain includes:

  • HDL synthesis (Verilog and VHDL support)
  • Schematic capture and design entry
  • Implementation tools for place and route
  • Timing analysis and simulation
  • Configuration file generation
  • JTAG programming support

XC2S50-5FG256I Package Information

The 256-FBGA package features a 17mm × 17mm body size with 1.0mm ball pitch. This fine-pitch ball grid array provides excellent signal integrity and thermal performance while maintaining a compact PCB footprint. The package supports both standard and lead-free (RoHS compliant) options.

Package Thermal Characteristics

The FBGA-256 package offers favorable thermal characteristics for industrial applications. Proper PCB design with adequate copper area ensures reliable operation across the full temperature range. Multiple ground and power pins distributed throughout the package provide low-inductance connections for stable operation.


Why Choose the XC2S50-5FG256I Spartan-II FPGA

The XC2S50-5FG256I represents an optimal balance of performance, features, and cost for mid-range FPGA applications. Key advantages include:

  1. Proven Architecture – The Spartan-II family has established reliability across millions of deployed systems
  2. Cost-Effective Solution – Competitive pricing for volume production applications
  3. Industrial Reliability – Extended temperature operation for demanding environments
  4. Flexible I/O – Wide voltage and standard support simplifies system integration
  5. Comprehensive Toolchain – Mature development tools reduce design cycle time

Order XC2S50-5FG256I Today

The XC2S50-5FG256I is available for immediate shipment with competitive pricing and volume discounts. Browse our complete selection of Xilinx FPGA products to find the ideal programmable logic solution for your next design project.


XC2S50-5FG256I Related Part Numbers

Part Number Temperature Package Speed
XC2S50-5FG256C Commercial (0°C to +70°C) 256-FBGA -5
XC2S50-5FG256I Industrial (-40°C to +85°C) 256-FBGA -5
XC2S50-5FGG256C Commercial (Pb-free) 256-FBGA -5
XC2S50-5FGG256I Industrial (Pb-free) 256-FBGA -5
XC2S50-5TQG144I Industrial 144-TQFP -5
XC2S50-5PQ208I Industrial 208-PQFP -5

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.