Overview of XC2S400E-6FG456I FPGA
The XC2S400E-6FG456I is a powerful Field-Programmable Gate Array (FPGA) from AMD Xilinx’s Spartan-IIE 1.8V FPGA Family, designed to deliver exceptional performance for industrial automation, embedded systems, and digital signal processing applications. This industrial-grade FPGA combines 400,000 system gates with advanced features, making it an ideal ASIC replacement solution for cost-sensitive, high-volume applications.
Key Features and Benefits
Core Performance Specifications
The XC2S400E-6FG456I stands out in the competitive FPGA market with its robust feature set:
- Logic Capacity: 10,800 logic cells (400,000 system gates)
- Speed Grade: -6 performance grade delivering reliable operation
- Operating Voltage: 1.8V core voltage for reduced power consumption
- Temperature Range: Industrial grade (-40°C to +100°C) ensuring operation in harsh environments
- Package Type: 456-pin Fine-Pitch Ball Grid Array (FBGA)
Advanced Memory Architecture
The XC2S400E-6FG456I features a hierarchical SelectRAM memory system that provides flexibility for various design requirements:
Block RAM Configuration
- Total block RAM: Up to 288 Kbits
- Configurable 4K-bit true dual-port block RAM
- Multiple block RAM modules for parallel data processing
- Ideal for buffer storage, FIFO implementations, and data caching
Distributed RAM Capabilities
- Distributed RAM: Up to 221,184 bits
- 16 bits per Look-Up Table (LUT) distributed RAM
- Enables efficient small memory implementations
- Perfect for control logic and state machines
Technical Specifications Table
| Specification |
Value |
| Part Number |
XC2S400E-6FG456I |
| Manufacturer |
AMD Xilinx |
| FPGA Family |
Spartan-IIE |
| Logic Elements |
10,800 cells |
| System Gates |
400,000 |
| Block RAM |
288 Kbits |
| Distributed RAM |
221,184 bits |
| Package Type |
456-pin FBGA |
| Technology Node |
0.15 micron |
| Core Voltage |
1.8V |
| Temperature Grade |
Industrial (-40°C to +100°C) |
| Speed Grade |
-6 |
| DLLs |
4 Delay-Locked Loops |
I/O and Interface Features
Flexible I/O Standards Support
The XC2S400E-6FG456I supports 19 selectable I/O standards, providing exceptional flexibility for interfacing with various components:
| I/O Standard Type |
Common Standards Supported |
| LVTTL/LVCMOS |
3.3V, 2.5V, 1.8V, 1.5V |
| Differential |
LVDS, LVPECL |
| PCI Compatible |
PCI 33MHz/66MHz |
| Bus Interface |
GTL+, HSTL, SSTL |
Clock Management System
Four Delay-Locked Loops (DLLs) provide advanced clock management capabilities:
- Clock de-skew and phase shifting
- Frequency synthesis and multiplication
- Clock mirroring for improved timing
- Reduced clock distribution delay
- Enhanced system timing performance beyond 200 MHz
Package Dimensions and Pin Configuration
FG456 Package Details
| Package Parameter |
Specification |
| Package Format |
Fine-Pitch Ball Grid Array (FBGA) |
| Total Pins |
456 pins |
| User I/O Pins |
Up to 333 I/Os available |
| Package Dimensions |
23mm x 23mm (approximate) |
| Ball Pitch |
Fine pitch for high-density PCB routing |
| RoHS Compliant |
Yes (Pb-free option) |
Application Use Cases
Industrial Automation and Control
The XC2S400E-6FG456I excels in industrial environments requiring:
- Motor control systems
- PLC (Programmable Logic Controller) implementations
- Industrial networking protocols
- Real-time sensor data processing
- Machine vision preprocessing
Digital Signal Processing
Ideal for DSP applications including:
- Digital filtering and signal conditioning
- Audio/video processing
- Communication protocol handling
- Data compression and encryption
- Real-time data acquisition systems
Embedded System Integration
Perfect for embedded applications such as:
- Custom processor implementations
- Peripheral interface controllers
- Protocol converters
- System-on-Chip (SoC) prototyping
- Legacy system modernization
Comparison with Similar FPGA Models
| Model |
Logic Cells |
Block RAM |
Package |
Speed Grade |
| XC2S400E-6FG456I |
10,800 |
288 Kbits |
456-pin FBGA |
-6 (Industrial) |
| XC2S300E-6FG456I |
7,168 |
216 Kbits |
456-pin FBGA |
-6 (Industrial) |
| XC2S600E-6FG456I |
15,552 |
432 Kbits |
456-pin FBGA |
-6 (Industrial) |
| XC2S400E-7FG456C |
10,800 |
288 Kbits |
456-pin FBGA |
-7 (Commercial) |
Design and Development Tools
Supported Design Software
The XC2S400E-6FG456I is compatible with industry-standard FPGA design tools:
- Xilinx ISE Design Suite: Traditional development environment
- Xilinx Vivado (for migration support): Modern synthesis and implementation
- VHDL and Verilog HDL: Full language support
- Schematic Entry: Block diagram design capabilities
Programming and Configuration Options
Multiple configuration modes provide deployment flexibility:
- Master Serial Mode: Using configuration PROMs
- Slave Serial Mode: Microcontroller-driven programming
- Slave Parallel Mode: Fast configuration for production
- JTAG Boundary Scan: In-circuit programming and debugging
Why Choose XC2S400E-6FG456I Over ASIC Solutions?
Cost-Effective Development
Compared to traditional Application-Specific Integrated Circuits (ASICs), the XC2S400E-6FG456I offers:
Advantages Over ASICs
- Zero NRE (Non-Recurring Engineering) costs
- No minimum order quantities required
- Rapid prototyping and time-to-market
- Field-upgradable design capability
- Risk mitigation for design changes
Unlimited Reprogrammability
The SRAM-based architecture enables:
- Infinite reconfiguration cycles
- Field updates without hardware replacement
- Design iteration without fabrication delays
- Version control and bug fixes post-deployment
- Future-proof product lifecycle
Power Consumption and Thermal Considerations
Optimized Power Profile
| Power Parameter |
Typical Value |
| Core Voltage (VCCINT) |
1.8V ± 5% |
| I/O Voltage (VCCO) |
1.5V to 3.3V (standard dependent) |
| Quiescent Power |
Low static power consumption |
| Dynamic Power |
Dependent on design utilization |
Thermal Management
The industrial temperature grade (-40°C to +100°C) requires proper thermal design:
- Adequate PCB copper planes for heat dissipation
- Optional heatsink for high-utilization designs
- Thermal monitoring for mission-critical applications
- Junction temperature within specified limits
Reliability and Quality Standards
Industrial-Grade Quality
The “I” suffix indicates Industrial temperature range qualification:
- Extended temperature operation
- Enhanced screening and testing
- Long-term reliability for harsh environments
- Compliance with industrial standards
Lead-Free and Environmental Compliance
- RoHS compliant for environmental sustainability
- Pb-free packaging options available
- Halogen-free variants for specific requirements
- REACH regulation compliance
Getting Started with XC2S400E-6FG456I
Recommended Development Boards
For evaluation and prototyping, consider:
- Xilinx Spartan-IIE development boards
- Third-party evaluation platforms
- Custom PCB design with reference schematics
- Breadboard-compatible adapter boards
Essential Resources
To begin your FPGA development journey:
- Download the Xilinx ISE WebPACK (free version)
- Review the Spartan-IIE family datasheet
- Study reference designs and application notes
- Join online FPGA development communities
- Access Xilinx FPGA resources for comprehensive guidance
Supply Chain and Availability
Authorized Distribution Channels
The XC2S400E-6FG456I is available through:
- Authorized electronic component distributors
- Direct from AMD Xilinx for volume orders
- Franchised distribution partners worldwide
- Online electronics marketplaces
Lifecycle Status
Important Note: The Spartan-IIE family has reached mature product status. For new designs, consider:
- Checking current production status with AMD Xilinx
- Evaluating newer FPGA families for long-term availability
- Maintaining adequate inventory for legacy product support
- Planning migration strategies for future products
Frequently Asked Questions
What is the difference between XC2S400E-6FG456I and XC2S400E-6FG456C?
The suffix indicates temperature range: “I” denotes Industrial grade (-40°C to +100°C), while “C” indicates Commercial grade (0°C to +85°C). Industrial-grade devices undergo additional testing for extreme temperature operation.
Can I replace an ASIC with the XC2S400E-6FG456I?
Yes, the Spartan-IIE family was specifically designed as an ASIC replacement solution, offering comparable performance with added flexibility and lower development costs for medium to high-volume production.
What is the maximum operating frequency?
System performance exceeds 200 MHz depending on design complexity, routing, and specific timing paths. The -6 speed grade provides reliable operation with predictable timing characteristics.
Is the XC2S400E-6FG456I suitable for automotive applications?
While the industrial temperature range supports harsh environments, automotive-specific qualification requires special screening. Consult AMD Xilinx for automotive-grade variants and certifications.
Conclusion
The XC2S400E-6FG456I represents an excellent balance of performance, features, and cost-effectiveness for industrial FPGA applications. With 400,000 system gates, extensive memory resources, flexible I/O standards, and robust industrial-grade reliability, this Spartan-IIE FPGA delivers proven technology for demanding applications.
Whether you’re replacing legacy ASICs, developing new embedded systems, or implementing complex digital signal processing, the XC2S400E-6FG456I provides the programmable logic resources and flexibility needed for successful product development. Its mature ecosystem, comprehensive tool support, and proven track record make it a reliable choice for industrial automation, control systems, and specialized computing applications.
For detailed technical specifications, design resources, and purchasing information, visit authorized distributors or explore comprehensive Xilinx FPGA documentation and support materials.
