Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S400E-6FG456C: Complete FPGA Solution for Embedded Systems

Product Details

Overview of XC2S400E-6FG456C Field-Programmable Gate Array

The XC2S400E-6FG456C is a high-performance field-programmable gate array (FPGA) from AMD’s Spartan-IIE family, engineered to deliver exceptional programmable logic capabilities for industrial automation, communication systems, and embedded computing applications. This versatile FPGA chip combines robust performance with cost-effective design flexibility, making it ideal for high-volume production environments.

Key Technical Specifications

Core FPGA Performance Features

Specification Value
System Gates 400,000 gates
Logic Cells 10,800 cells
Maximum Frequency 357 MHz
Process Technology 0.15µm CMOS
Operating Voltage 1.8V core / 3.3V I/O
Package Type 456-Pin FBGA (Fine-Pitch Ball Grid Array)
Package Code FG456
Speed Grade -6 (commercial temperature range)

Memory and Storage Capabilities

Memory Feature Specification
Block RAM Columns 4 columns
Total RAM Capacity Up to 4.6 Mb
Distributed RAM Available through CLBs
Configuration Memory SRAM-based

Detailed Product Features

Advanced Architecture Design

The XC2S400E-6FG456C leverages AMD Xilinx’s proven Spartan-IIE architecture, incorporating:

  • Configurable Logic Blocks (CLBs): High-density programmable logic elements arranged in a flexible array structure
  • Input/Output Blocks (IOBs): 456 user I/O pins supporting multiple voltage standards including 2.5V and 3.3V
  • Block RAM Resources: Four dedicated block RAM columns extending the full chip height for efficient memory implementation
  • General Routing Matrix (GRM): Advanced interconnect architecture enabling optimized signal routing
  • VersaRing Routing Technology: Enhanced routing flexibility supporting pin-swapping and pin-locking capabilities

Programmability and Configuration

This Xilinx FPGA supports multiple configuration modes:

  • Master Serial Mode with external PROM
  • Slave Serial Mode for controlled programming
  • Slave Parallel Mode for faster configuration
  • Boundary Scan (JTAG) for development and debugging
  • Platform Flash in-system programmable configuration support

Clock Management Features

Clock Feature Capability
DLL Resources Integrated Delay-Locked Loops
Global Clock Networks Multiple dedicated global buffers
Clock Mirroring DLL-based clock distribution
Clock Frequency Range DC to 357 MHz

Application Areas and Use Cases

Industrial Automation and Control Systems

The XC2S400E-6FG456C excels in industrial automation applications requiring real-time processing, including:

  • Programmable Logic Controllers (PLCs)
  • Motor control systems
  • Factory automation equipment
  • Process control interfaces
  • Industrial robotics controllers

Communication and Networking

Ideal for communication infrastructure:

  • Protocol conversion and bridging
  • Network packet processing
  • Serial interface controllers
  • Data acquisition systems
  • Signal processing applications

Embedded System Design

Perfect for embedded computing solutions:

  • Custom processor implementations
  • Hardware acceleration modules
  • Real-time data processing
  • Interface protocol implementation
  • System-on-Chip (SoC) prototyping

Package and Mechanical Specifications

FBGA Package Details

Package Characteristic Specification
Total Pin Count 456 pins
Package Type Fine-pitch Ball Grid Array
Body Size Standard FBGA footprint
Mounting Type Surface Mount Technology (SMT)
RoHS Compliance Lead-free options available

Power Supply Requirements

Voltage Specifications

Power Rail Voltage Range Typical Current
VCCINT (Core) 1.8V ±5% Application dependent
VCCO (I/O) 1.8V to 3.3V Bank-specific
VCCAUX (Auxiliary) 2.5V or 3.3V Low current

Design Tools and Software Support

The XC2S400E-6FG456C is fully supported by AMD Xilinx development tools:

  • ISE Design Suite: Complete FPGA design environment
  • ChipScope Pro: Integrated logic analyzer
  • CORE Generator: IP core integration tool
  • Impact: Configuration and programming utility
  • Timing Analyzer: Static timing analysis tools

Performance Optimization Tips

Maximizing FPGA Efficiency

To achieve optimal performance with the XC2S400E-6FG456C:

  1. Clock Domain Management: Properly isolate different clock domains using DLL resources
  2. Resource Utilization: Balance logic between CLBs and block RAM for efficient implementation
  3. Timing Closure: Utilize timing constraints early in the design process
  4. Power Distribution: Implement robust power supply decoupling networks
  5. Thermal Management: Ensure adequate cooling for high-utilization designs

Comparison with Related Devices

Spartan-IIE Family Positioning

Device System Gates Logic Cells Block RAM I/O Pins
XC2S50E 50,000 1,728 2 columns 182
XC2S150E 150,000 3,456 3 columns 265
XC2S400E 400,000 10,800 4 columns 456
XC2S600E 600,000 15,552 6 columns 514

Quality and Reliability

Product Lifecycle Status

Important Note: The XC2S400E-6FG456C is currently designated as obsolete/discontinued per AMD Xilinx change notice XCN12026. While existing inventory remains available through authorized distributors, this device is not recommended for new designs. Consider newer Spartan or Artix family devices for current projects.

Testing and Certification

  • Full electrical parameter testing
  • Temperature range qualification
  • 100% configuration verification
  • Industry-standard quality certifications
  • ISO 9001 compliant manufacturing

Purchase and Availability Information

Ordering Information

Full Part Number: XC2S400E-6FG456C

Where to source:

  • Authorized AMD Xilinx distributors
  • Electronic component brokers (verify authenticity)
  • Specialized FPGA suppliers

Package Marking

Standard device markings include:

  • Manufacturer logo (AMD/Xilinx)
  • Device part number
  • Speed grade designation
  • Production date code
  • Country of origin

Technical Support Resources

Documentation

  • Complete datasheet (DS077)
  • Application notes for Spartan-IIE family
  • PCB design guidelines
  • Configuration guides
  • Thermal management documentation

Design Assistance

Access comprehensive technical support through:

  • AMD Xilinx support forums
  • Technical application engineers
  • Design consultation services
  • Reference design examples
  • Training materials and webinars

Environmental and Compliance

Operating Conditions

Parameter Commercial Grade (-6)
Ambient Temperature 0°C to +85°C
Junction Temperature Up to +125°C
Storage Temperature -65°C to +150°C
Humidity 5% to 95% non-condensing

Frequently Asked Questions

What makes the XC2S400E-6FG456C suitable for industrial applications?

The device combines reliable SRAM-based configuration with robust I/O standards, industrial temperature operation, and proven Spartan architecture, making it ideal for demanding industrial environments requiring long-term availability and field-proven technology.

Can this FPGA be reprogrammed?

Yes, the XC2S400E-6FG456C features unlimited reprogrammability through SRAM-based configuration. The device can be reconfigured in the field using various programming methods including JTAG, serial, and parallel interfaces.

What development tools are required?

AMD Xilinx ISE Design Suite provides complete development support including HDL synthesis, implementation, simulation, and programming capabilities. The software includes all necessary tools for FPGA design, verification, and configuration.

Is this device suitable for new designs?

While the XC2S400E-6FG456C remains a capable FPGA, it has been designated as obsolete by AMD Xilinx. For new product developments, consider migrating to current-generation Spartan-7, Artix-7, or other actively supported FPGA families offering enhanced performance and long-term availability.

Conclusion

The XC2S400E-6FG456C represents a proven solution for embedded FPGA applications requiring moderate logic density, flexible I/O options, and cost-effective implementation. While classified as an obsolete product, existing designs benefit from its mature architecture, extensive documentation, and widespread industry adoption. Engineers should evaluate current Xilinx FPGA families for new projects while existing XC2S400E-6FG456C implementations continue to deliver reliable performance across numerous applications worldwide.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.