The XC2S300E-7FG456C is a high-performance field-programmable gate array (FPGA) from AMD Xilinx’s Spartan-IIE family, designed to deliver cost-effective programmable logic solutions for digital system designs. This comprehensive guide explores the specifications, features, applications, and benefits of this versatile FPGA component.
What is the XC2S300E-7FG456C FPGA?
The XC2S300E-7FG456C represents AMD Xilinx’s second-generation ASIC replacement technology, offering engineers a flexible and reprogrammable alternative to traditional application-specific integrated circuits. Built on advanced 0.15-micron process technology, this Xilinx FPGA delivers exceptional performance while maintaining low power consumption and competitive pricing.
Key Product Specifications
| Specification |
Details |
| Manufacturer |
AMD Xilinx (formerly Xilinx Inc.) |
| Part Number |
XC2S300E-7FG456C |
| FPGA Family |
Spartan-IIE 1.8V |
| Logic Cells |
6,912 cells |
| System Gates |
93,000 – 300,000 gates |
| Operating Voltage |
1.8V |
| Package Type |
456-Pin FBGA (Fine-Pitch Ball Grid Array) |
| Process Technology |
0.15 micron (150nm) |
| Speed Grade |
-7 (400 MHz performance) |
| RoHS Status |
Not RoHS Compliant |
XC2S300E-7FG456C Technical Features
Core Architecture and Logic Resources
The XC2S300E-7FG456C features a robust architecture derived from the proven Virtex-E FPGA platform, streamlined for cost-effective implementation:
- 6,912 configurable logic cells providing versatile digital logic implementation
- 32 x 48 CLB array offering systematic logic organization
- 329 maximum user I/O pins (including four global clock/user input pins)
- 120 flip-flops per CLB enabling complex sequential logic designs
- Unlimited in-system reprogrammability for design flexibility
Memory Architecture and Capacity
| Memory Type |
Capacity |
Configuration |
| Block RAM |
64K bits (98,304 bits total) |
32 true dual-port blocks |
| Distributed RAM |
1,536 bits per CLB |
16 bits/LUT distributed RAM |
| Total Block RAM |
Configurable 4K-bit blocks |
True dual-port architecture |
Advanced System-Level Features
Delay-Locked Loops (DLLs)
- Four DLLs positioned at each corner of the die
- Precise clock management and distribution
- Reduced clock skew for improved timing performance
- Support for clock multiplication and division
I/O Standards Support
- 19 selectable I/O standards for design flexibility
- LVTTL, LVCMOS, PCI, GTL, and other industry-standard interfaces
- Programmable drive strength and slew rate control
- Support for both single-ended and differential signaling
Performance Specifications
Operating Characteristics
| Parameter |
Specification |
| Maximum Frequency |
400 MHz (speed grade -7) |
| Power Supply Voltage |
1.8V core voltage |
| Operating Temperature |
Commercial extended range |
| Package Configuration |
456-pin FBGA (21mm x 21mm) |
| Ball Pitch |
Fine-pitch ball grid array |
Speed Grade Comparison
The “-7” speed grade designation indicates this device’s performance tier within the Spartan-IIE family, offering faster clock frequencies and shorter propagation delays compared to -6 speed grade variants. This makes the XC2S300E-7FG456C ideal for applications requiring higher throughput and reduced latency.
Applications and Use Cases
Industrial and Commercial Applications
The XC2S300E-7FG456C excels in diverse application domains:
Communication Systems
- Protocol converters and bridges
- Digital signal processing implementations
- Network interface controllers
- Data encryption and compression engines
Industrial Control
- Motor control systems
- Programmable logic controllers (PLCs)
- Sensor interface and data acquisition
- Real-time monitoring and control systems
Embedded Systems
- Custom peripheral controllers
- System-on-chip prototyping
- Hardware acceleration modules
- Interface bridging solutions
Consumer Electronics
- Video processing and display controllers
- Audio processing systems
- Digital TV set-top boxes
- Gaming and entertainment devices
Advantages Over Traditional ASICs
Cost-Effectiveness
The XC2S300E-7FG456C eliminates significant expenses associated with mask-programmed ASICs:
- No NRE (Non-Recurring Engineering) costs for mask sets
- Reduced development time from months to weeks
- Lower minimum order quantities enabling smaller production runs
- Immediate availability without fabrication lead times
Design Flexibility and Upgradability
- Field-upgradable functionality without hardware replacement
- Iterative design refinement without silicon respins
- Risk mitigation through design validation before production
- Future-proof solutions adaptable to changing requirements
Development Advantages
- Fast prototyping cycles for rapid product development
- Predictable interconnect timing maintaining timing closure across iterations
- Comprehensive development tools including ISE Design Suite support
- Extensive IP core library accelerating time-to-market
Package and Pinout Information
FG456 Package Details
The Fine-pitch Ball Grid Array (FBGA) package offers several advantages:
| Package Feature |
Specification |
| Total Pins |
456 balls |
| Package Dimensions |
21mm x 21mm nominal |
| Ball Material |
Lead-free options available |
| Thermal Performance |
Optimized for heat dissipation |
| Assembly Compatibility |
Standard surface-mount reflow |
Pin Configuration
- 329 user I/O pins maximum configuration
- Four dedicated global clock inputs with low-skew distribution
- Ground and power balls strategically positioned for signal integrity
- JTAG boundary scan for programming and debugging
Development Tools and Software Support
Design Software Compatibility
The XC2S300E-7FG456C is supported by Xilinx ISE (Integrated Software Environment) Design Suite:
- Synthesis tools for HDL-to-netlist conversion
- Implementation tools for place-and-route optimization
- Timing analysis utilities for performance verification
- Programming utilities for device configuration
Programming and Configuration
- JTAG programming interface for development and production
- Master/slave serial configuration modes
- SelectMAP parallel configuration for faster programming
- MultiBoot capability supporting dual configuration images
Procurement and Availability
Lifecycle Status
Important Note: The XC2S300E-7FG456C is considered an obsolete product not recommended for new designs. However, it remains available through:
- Authorized distributors maintaining existing stock
- Independent component suppliers and brokers
- Electronic component sourcing platforms
- Aftermarket and surplus inventory channels
Alternative Solutions
For new design projects, consider these modern Xilinx FPGA families:
- Spartan-7 FPGAs – Direct successor with enhanced features
- Artix-7 FPGAs – Higher performance and lower power
- Spartan-3E Family – Similar architecture with improvements
- Kintex-7 FPGAs – Advanced applications requiring more resources
XC2S300E-7FG456C Design Considerations
Thermal Management
Proper thermal design ensures reliable operation:
- Monitor junction temperature during operation
- Implement adequate heatsinking for continuous operation
- Consider airflow requirements in enclosed systems
- Account for power dissipation in thermal calculations
Power Supply Design
Critical power supply requirements:
- 1.8V core voltage with tight regulation (±5%)
- Low-noise power distribution to minimize switching noise
- Decoupling capacitors placed close to power pins
- Adequate current capacity for worst-case switching scenarios
Signal Integrity Guidelines
- Implement proper termination for high-speed signals
- Minimize trace lengths for critical timing paths
- Use ground planes for impedance control
- Follow manufacturer layout guidelines for optimal performance
Technical Support and Documentation
Available Resources
- Product datasheet (DS077) containing complete specifications
- User guides covering architecture and design methodology
- Application notes demonstrating implementation techniques
- Reference designs accelerating development
Community and Support
Access technical assistance through:
- Official AMD Xilinx support forums
- Distributor technical support teams
- Independent FPGA design communities
- Third-party training and consulting services
Frequently Asked Questions
Q: Is the XC2S300E-7FG456C suitable for new designs? A: While functional and available, this device is obsolete and not recommended for new designs. Consider modern Spartan-7 or Artix-7 families for new projects.
Q: What is the difference between XC2S300E-7FG456C and XC2S300E-6FG456C? A: The “-7” speed grade offers faster maximum operating frequencies (400 MHz) compared to the “-6” variant (357 MHz), with correspondingly improved timing performance.
Q: Can I use ISE Design Suite with this FPGA? A: Yes, the XC2S300E-7FG456C is fully supported by Xilinx ISE Design Suite versions that include Spartan-IIE family support.
Q: What programming languages are supported? A: Standard HDL languages including VHDL and Verilog are supported for design entry, along with schematic capture methods.
Conclusion
The XC2S300E-7FG456C Spartan-IIE FPGA represents proven programmable logic technology suitable for legacy system support and specific applications where this device has been qualified. While newer FPGA families offer enhanced capabilities, the XC2S300E-7FG456C continues to serve existing designs requiring its specific feature set and proven reliability.
For engineers maintaining existing systems or requiring this specific component, understanding its capabilities, specifications, and design requirements ensures successful implementation and long-term reliability. When sourcing this device, work with reputable distributors to ensure authentic components and proper handling.
