Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S300E-6PQG208C: High-Performance Spartan-IIE FPGA for Industrial Applications

Product Details

Overview of XC2S300E-6PQG208C Field-Programmable Gate Array

The XC2S300E-6PQG208C is a high-performance Field-Programmable Gate Array from AMD Xilinx’s renowned Spartan-IIE family. This cost-effective FPGA solution delivers exceptional logic resources, making it ideal for embedded systems, industrial automation, telecommunications equipment, and digital signal processing applications. With 300,000 system gates and advanced architecture, this programmable logic device offers designers the flexibility to create custom digital circuits without the costs and lead times associated with traditional ASICs.

Key Specifications and Technical Features

Core Architecture Specifications

The XC2S300E-6PQG208C combines powerful processing capabilities with energy-efficient design:

Specification Value
Logic Gates 300,000 system gates
Logic Cells 6,912 cells
Maximum Frequency 357 MHz
Process Technology 0.15μm (150nm)
Operating Voltage 1.8V
Package Type 208-Pin PQFP (Plastic Quad Flat Pack)
Speed Grade -6 (commercial grade)
I/O Pins 146 user I/O

Memory Resources

Memory Type Capacity
Block RAM Up to 288 Kbits
Distributed RAM Up to 221,184 bits
Total RAM Resources 65,536 bits available

Advanced Features

  • 19 Selectable I/O Standards: Support for LVTTL, LVCMOS, PCI, GTL, SSTL, HSTL, and differential standards
  • 4 Delay-Locked Loops (DLLs): Precision clock management and distribution
  • Fast Interconnect Architecture: Predictable routing for consistent timing across design iterations
  • Configurable Logic Blocks (CLBs): Flexible logic implementation
  • Dedicated Carry Logic: Optimized for arithmetic operations

Applications and Use Cases

Industrial and Commercial Applications

The XC2S300E-6PQG208C Xilinx FPGA excels in diverse applications:

  • Communications Equipment: Network switches, routers, protocol converters
  • Broadband Access Systems: DSL modems, fiber optic interfaces
  • Enterprise Systems: Server management controllers, data acquisition
  • Data Center Computing: Hardware acceleration, network processing
  • Industrial Automation: Motor control, sensor interfaces, PLC replacement
  • Portable Electronics: Battery-powered devices requiring low power consumption
  • Consumer Electronics: Video processing, audio systems, display controllers

Technical Advantages Over ASIC Solutions

Design Flexibility and Cost Benefits

The XC2S300E-6PQG208C FPGA provides significant advantages compared to mask-programmed ASICs:

  1. Zero Initial NRE Costs: Eliminate expensive mask sets and tooling fees
  2. Rapid Development Cycles: Reduce time-to-market from months to weeks
  3. In-Field Upgradability: Update firmware and functionality without hardware replacement
  4. Lower Risk: Test and validate designs before committing to production
  5. Scalability: Migrate designs across Spartan-IIE family members as requirements evolve

Performance Characteristics

The -6 speed grade delivers:

  • System performance exceeding 200 MHz for many applications
  • Deterministic timing characteristics for real-time systems
  • Low power consumption suitable for battery-operated equipment
  • Robust operation across commercial temperature ranges

Package Information and Physical Characteristics

208-Pin PQFP Package Details

Parameter Specification
Package Type PQFP (Plastic Quad Flat Pack)
Total Pins 208
Package Dimensions 28mm x 28mm
Lead Pitch 0.5mm
RoHS Compliance Yes (Lead-free available)
MSL Rating Moisture Sensitive Level 3

Thermal and Environmental Specifications

Characteristic Value
Operating Temperature 0°C to +85°C (Commercial)
Junction Temperature Up to +125°C
Storage Temperature -65°C to +150°C
Package Thermal Resistance θJA: Contact manufacturer for specific values

Design Tools and Programming Support

Development Environment

Engineers can leverage comprehensive development tools for the XC2S300E-6PQG208C:

  • ISE Design Suite: Complete design entry, synthesis, and implementation
  • Vivado Design Suite: Advanced design tools for modern workflows (for compatible devices)
  • Hardware Description Languages: VHDL, Verilog HDL support
  • IP Cores: Pre-verified intellectual property blocks
  • Simulation Tools: ModelSim, ISim integration

Programming and Configuration

The FPGA supports multiple configuration methods:

  • JTAG boundary scan programming
  • Master and slave serial modes
  • SelectMAP parallel configuration
  • Configuration PROM support

Comparison with Other Spartan-IIE Family Members

Part Number Gates Logic Cells Block RAM I/O Pins
XC2S50E 50K 1,728 32 Kbits 86
XC2S100E 100K 2,700 40 Kbits 92
XC2S150E 150K 3,888 72 Kbits 86
XC2S300E 300K 6,912 288 Kbits 146
XC2S400E 400K 10,800 288 Kbits 182
XC2S600E 600K 15,552 288 Kbits 205

Power Consumption and Efficiency

Operating Power Characteristics

The XC2S300E-6PQG208C operates at 1.8V core voltage, offering:

  • Low static power consumption in standby mode
  • Dynamic power scaling based on design utilization
  • Power-efficient I/O buffers with selectable drive strengths
  • Clock gating capabilities for unused logic blocks

Quality and Reliability

Manufacturing Standards

  • ISO 9001 Certified manufacturing facilities
  • Automotive-grade options available for critical applications
  • Extended temperature range variants for harsh environments
  • Long-term availability commitment from AMD Xilinx

ESD Protection

  • Human Body Model (HBM): >2000V protection
  • Machine Model (MM): >200V protection
  • Charged Device Model (CDM): >500V protection

Ordering Information and Part Number Breakdown

Part Number Decoding

XC2S300E-6PQG208C

  • XC2S: Spartan-IIE family identifier
  • 300E: 300,000 gate device
  • 6: Speed grade (-6 commercial)
  • PQG: Package type (Plastic Quad Flat Pack)
  • 208: Pin count
  • C: Commercial temperature grade (0°C to +85°C)

Available Package Options

Package Code Description Pin Count
PQG208 Plastic Quad Flat Pack 208
FT256 Fine-Pitch BGA 256
FG456 Fine-Pitch BGA 456
TQ144 Thin Quad Flat Pack 144

Getting Started with XC2S300E-6PQG208C

Recommended Development Boards

While the XC2S300E-6PQG208C is an obsolete part not recommended for new designs, legacy support includes:

  • Custom PCB designs with proper decoupling
  • Prototype boards with JTAG programming headers
  • Evaluation platforms from third-party vendors

Design Considerations

  1. Power Supply Design: Provide clean 1.8V core voltage with adequate decoupling
  2. Clock Distribution: Utilize DLLs for optimal clock management
  3. I/O Planning: Match I/O standards to interfacing components
  4. Thermal Management: Ensure adequate airflow for high-utilization designs
  5. Configuration Strategy: Select appropriate programming mode for your application

Support and Documentation

Available Resources

  • Comprehensive datasheets with AC/DC specifications
  • Application notes for common design patterns
  • Reference designs and example projects
  • Technical support through AMD Xilinx channels
  • Active user community and forums

Obsolescence Notice and Alternatives

Product Lifecycle Status

The XC2S300E-6PQG208C is marked as obsolete and not recommended for new designs. Engineers developing new products should consider:

Recommended Migration Path

Alternative Series Benefits
Spartan-6 Lower power, higher performance
Spartan-7 Modern architecture, better tool support
Artix-7 Advanced features, DDR memory support

Frequently Asked Questions

What is the difference between XC2S300E-6PQG208C and XC2S300E-6PQG208I?

The “C” suffix indicates commercial temperature range (0°C to +85°C), while “I” denotes industrial temperature range (-40°C to +100°C). The industrial version offers extended temperature operation for harsh environments.

Can I replace an XC2S300E with a different Spartan-IIE density?

Migration within the Spartan-IIE family is possible but requires design verification. Pin compatibility varies by package type. Larger devices (XC2S400E, XC2S600E) offer upward migration paths with additional resources.

What programming cable do I need?

The XC2S300E-6PQG208C requires a JTAG-compatible programming cable such as Platform Cable USB, Xilinx Platform Cable II, or compatible third-party programmers supporting IEEE 1149.1 JTAG standard.

Is this FPGA suitable for aerospace applications?

While commercial-grade parts can be used in some aerospace applications, space-qualified or high-reliability variants should be specified for critical aerospace systems. Consult AMD Xilinx for aerospace-grade options.

Conclusion: Legacy FPGA with Proven Performance

The XC2S300E-6PQG208C represents proven FPGA technology from the Spartan-IIE generation. While obsolete for new designs, it continues serving legacy systems requiring maintenance and updates. For engineers supporting existing products, this device offers reliable performance with comprehensive documentation and established design methodologies.

For new projects, modern alternatives provide superior performance, lower power consumption, and extended feature sets while maintaining the programmable logic advantages that made the Spartan-IIE family successful.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.