Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S300E-6PQ208C: High-Performance Spartan-IIE FPGA for Industrial and Commercial Applications

Product Details

Product Overview: AMD Xilinx XC2S300E-6PQ208C Field Programmable Gate Array

The XC2S300E-6PQ208C is a versatile field programmable gate array (FPGA) from AMD Xilinx’s renowned Spartan-IIE family, designed to deliver exceptional performance for cost-sensitive applications. This programmable logic device combines 300,000 system gates with advanced features, making it an ideal solution for industrial automation, telecommunications, medical equipment, and automotive electronics.

As part of the second-generation ASIC replacement technology, the XC2S300E-6PQ208C offers unlimited in-system reprogrammability, allowing engineers to update designs without hardware replacement—a significant advantage over traditional ASICs.

Key Technical Specifications

Specification Details
Part Number XC2S300E-6PQ208C
Manufacturer AMD (formerly Xilinx)
Product Family Spartan-IIE 1.8V FPGA
System Gates 300,000 gates
Logic Cells 6,912 cells
Configurable Logic Blocks (CLBs) 1,536 CLBs
Maximum Frequency 357 MHz
Process Technology 0.15 μm CMOS
Operating Voltage 1.8V core voltage
Package Type 208-Pin PQFP (Plastic Quad Flat Pack)
I/O Pins 146 user I/O pins
Speed Grade -6 (commercial grade)
Operating Temperature 0°C to +85°C

Advanced Memory Architecture

Block RAM Capabilities

The XC2S300E-6PQ208C incorporates a hierarchical SelectRAM memory system that provides flexible storage options for diverse applications:

  • Distributed RAM: 16 bits per Look-Up Table (LUT), offering fast, localized memory access
  • Block RAM: Configurable 4K-bit true dual-port block RAM, ideal for buffer storage and data caching
  • Total Distributed RAM: Up to 221,184 bits across the device
  • Total Block RAM: Up to 288K bits of high-speed embedded memory

This dual-tier memory architecture enables designers to optimize performance by placing critical data close to processing logic while maintaining substantial storage capacity.

Performance Features and Benefits

High-Speed Operation

With a maximum operating frequency of 357 MHz, this Xilinx FPGA delivers the processing power required for demanding real-time applications. The fast, predictable interconnect ensures consistent timing across design iterations, reducing development time and improving reliability.

Flexible I/O Standards

The device supports 19 selectable I/O standards, providing exceptional interface flexibility:

  • LVTTL and LVCMOS voltage levels
  • SSTL and HSTL standards for high-speed memory interfaces
  • Differential signaling options (LVDS, LVPECL)
  • PCI-compatible I/O for direct bus interfacing

Delay-Locked Loops (DLLs)

Four integrated DLLs enable precise clock management and distribution throughout the FPGA, supporting:

  • Clock frequency synthesis and multiplication
  • Phase shifting for timing optimization
  • Clock de-skewing for synchronous system design
  • Jitter reduction for improved signal integrity

Application Areas and Use Cases

Industry Sector Typical Applications
Industrial Automation Programmable logic controllers (PLCs), motor control, process automation
Telecommunications Protocol conversion, signal processing, network interface cards
Medical Equipment Diagnostic imaging, patient monitoring systems, laboratory instrumentation
Automotive Electronics Engine control units, ADAS systems, infotainment platforms
Broadband Access DSL/Cable modems, optical network terminals, wireless base stations
Enterprise Systems Data routing, server management, storage controllers
Consumer Electronics Video processing, audio equipment, gaming peripherals

Design and Development Support

Compatible Development Tools

The XC2S300E-6PQ208C is fully supported by industry-standard design software:

  • Xilinx ISE Design Suite: Complete design environment for synthesis, implementation, and verification
  • Vivado Design Suite: Modern toolchain with enhanced productivity features
  • Third-party synthesis tools: Compatibility with major FPGA design platforms

Programming Options

Multiple configuration methods provide flexibility for different deployment scenarios:

  • JTAG boundary scan for development and debugging
  • Serial and parallel configuration modes
  • In-system programming (ISP) for field updates
  • Master and slave configuration topologies

Package Information and Physical Dimensions

208-Pin PQFP Package Details

Parameter Specification
Package Code PQ208C
Pin Count 208 pins
Package Type Plastic Quad Flat Pack (PQFP)
Body Size 28mm × 28mm (nominal)
Pin Pitch 0.5mm
Package Height Standard low-profile design
Mounting Surface mount technology (SMT)

The compact footprint and industry-standard package make the XC2S300E-6PQ208C suitable for space-constrained applications while maintaining excellent thermal performance.

Quality and Compliance

Manufacturing Standards

  • RoHS Compliance: Lead-free manufacturing process
  • Quality Assurance: Rigorous testing and verification procedures
  • Traceability: Full component tracking and documentation
  • Reliability: Industrial-grade quality with extended product lifecycle

Environmental Considerations

The device meets international environmental standards and is manufactured using sustainable processes that minimize environmental impact while maintaining the highest quality standards.

Advantages Over Alternative Solutions

FPGA vs. ASIC Comparison

Cost Advantages:

  • Zero NRE (Non-Recurring Engineering) costs
  • No expensive mask sets required
  • Lower minimum order quantities
  • Reduced inventory risk

Time-to-Market Benefits:

  • Rapid prototyping and iteration
  • No fabrication wait times
  • Immediate design modifications
  • Field-upgradeable functionality

Technical Flexibility:

  • Design changes post-deployment
  • Bug fixes without hardware replacement
  • Feature additions through software updates
  • Future-proof system architecture

Integration and System Design Considerations

Power Management

Efficient power consumption characteristics make the XC2S300E-6PQ208C suitable for battery-powered and thermally-constrained applications:

  • Core voltage: 1.8V ±5%
  • Low static power consumption
  • Dynamic power management features
  • Multiple power domains for optimization

Thermal Management

With 0.15μm CMOS technology, the device offers excellent thermal characteristics:

  • Commercial temperature range: 0°C to +85°C
  • Predictable thermal behavior
  • Standard heat sink compatibility
  • Proven reliability in demanding environments

Procurement and Availability

Ordering Information

When specifying the XC2S300E-6PQ208C for your project, ensure you reference the complete part number to guarantee correct device selection. The speed grade (-6) and package type (PQ208C) are critical for system compatibility.

Supply Chain Considerations

As a mature product in the Spartan-IIE family, availability should be verified with authorized distributors. While newer FPGA families offer enhanced features, the XC2S300E-6PQ208C remains a cost-effective solution for established designs and applications requiring proven technology.

Related Products and Alternatives

Within Spartan-IIE Family

Part Number Gates Logic Cells Package Options
XC2S50E 50,000 1,728 Multiple packages
XC2S100E 100,000 2,700 Various options
XC2S150E 150,000 3,456 Multiple formats
XC2S300E 300,000 6,912 208-PQFP
XC2S400E 400,000 10,800 Larger packages
XC2S600E 600,000 15,552 BGA options

Technical Support and Resources

Documentation

Comprehensive technical documentation is available for the XC2S300E-6PQ208C, including:

  • Detailed datasheet with complete electrical specifications
  • Application notes for common design scenarios
  • Reference designs and example projects
  • Package mechanical drawings
  • Thermal design guidelines

Design Resources

Engineers can access extensive support materials through AMD Xilinx’s technical portal, including training modules, webinars, and community forums for peer-to-peer assistance.

Conclusion: Why Choose the XC2S300E-6PQ208C

The XC2S300E-6PQ208C Spartan-IIE FPGA represents a proven solution for designers requiring reliable, cost-effective programmable logic with excellent performance characteristics. Its combination of 300,000 system gates, 357 MHz operation, flexible I/O standards, and comprehensive memory resources makes it suitable for a wide range of industrial and commercial applications.

Whether you’re developing industrial control systems, telecommunications equipment, or embedded computing solutions, this FPGA provides the performance, flexibility, and reliability needed for successful product deployment. The device’s mature technology, extensive development tool support, and competitive pricing make it an attractive option for both new designs and legacy system maintenance.

For applications requiring field-programmable logic with proven reliability and comprehensive feature sets, the XC2S300E-6PQ208C continues to deliver exceptional value in today’s competitive electronics market.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.