Overview of XC2S300E-6FTG256I FPGA
The XC2S300E-6FTG256I is a powerful field-programmable gate array (FPGA) from Xilinx’s renowned Spartan-IIE family, designed to deliver exceptional performance for cost-sensitive applications. This industrial-grade FPGA offers 300,000 system gates and features advanced programmable logic capabilities, making it an ideal choice for communications equipment, industrial control systems, and embedded applications.
As part of the Xilinx FPGA ecosystem, this device represents second-generation ASIC replacement technology with unlimited in-system reprogrammability, enabling design flexibility without the high costs and lengthy development cycles associated with traditional ASICs.
Key Specifications of XC2S300E-6FTG256I
Technical Specifications Table
| Specification |
Value |
| Part Number |
XC2S300E-6FTG256I |
| Manufacturer |
Xilinx (AMD) |
| Product Family |
Spartan-IIE 1.8V FPGA |
| Logic Cells |
6,912 Cells |
| System Gates |
93,000 – 300,000 Gates |
| Array Size |
32 x 48 CLBs |
| Maximum Frequency |
357 MHz |
| Package Type |
256-Pin FTBGA (Fine-Pitch Ball Grid Array) |
| Operating Temperature |
Industrial (-40°C to +100°C) |
| Speed Grade |
-6 |
| Technology |
0.15 μm (micron) CMOS |
| Core Voltage |
1.8V |
| RoHS Compliance |
Yes (Lead-free) |
Memory and I/O Specifications
| Feature |
Specification |
| Block RAM |
64 Kbits (configurable 4K-bit dual-port blocks) |
| Distributed RAM |
98,304 bits (16 bits per LUT) |
| User I/O Pins |
329 (includes 4 global clock inputs) |
| Maximum CLB Flip-Flops |
1,536 |
| DLL (Delay-Locked Loops) |
4 (one at each corner) |
| I/O Standards Supported |
19 selectable standards including LVDS, LVTTL |
Architecture and Features
Advanced FPGA Architecture
The XC2S300E-6FTG256I employs a streamlined architecture based on Xilinx’s proven Virtex-E technology, offering:
- Configurable Logic Blocks (CLBs): 1,536 CLBs arranged in a 32 x 48 array provide flexible logic implementation
- Input/Output Blocks (IOBs): 329 programmable I/O pins supporting multiple voltage standards
- SelectRAM Hierarchical Memory: Distributed and block RAM configurations for diverse memory requirements
- Delay-Locked Loops (DLLs): Four DLLs ensure precise clock management and signal timing
Performance Characteristics
| Performance Metric |
Specification |
| Maximum Clock Frequency |
357 MHz (speed grade -6) |
| System Performance |
Beyond 200 MHz continuous operation |
| Propagation Delay |
As low as 0.8 ns (pad to I output) |
| Power Consumption |
VCCO supply current: 2 mA (quiescent) |
| Core Current |
300 mA typical (XC2S300E) |
Applications and Use Cases
Primary Application Areas
The XC2S300E-6FTG256I excels in multiple industry sectors:
Communications Equipment
- High-speed serial communication protocols (PCI Express, Serial RapidIO)
- Gigabit Ethernet implementations
- Wireless infrastructure components
- Telecommunications switching systems
Industrial Control Systems
- Motor control applications
- Power management systems
- Automated manufacturing equipment
- Process control instrumentation
Video and Image Processing
- Real-time image filtering algorithms
- Video compression/decompression engines
- Edge detection and pattern recognition
- Enterprise projection systems
Embedded Systems
- Personal electronics devices
- Portable instrumentation
- Consumer electronics
- Medical equipment interfaces
Package Information: 256-Pin FTBGA
FTBGA Package Details
| Package Characteristic |
Description |
| Package Type |
FTBGA (Fine-Pitch Ball Grid Array) |
| Total Pins |
256 pins |
| Mounting Type |
Surface Mount Technology (SMT) |
| Thermal Performance |
Enhanced heat dissipation for industrial applications |
| Footprint |
Compact design optimized for space-constrained PCBs |
| Ball Pitch |
Fine-pitch configuration for high-density routing |
The 256-pin FTBGA package offers excellent thermal characteristics and electrical performance, making it suitable for high-reliability industrial applications where the XC2S300E-6FTG256I operates in demanding environmental conditions.
Programming and Configuration
Configuration Options
The XC2S300E-6FTG256I supports multiple configuration modes:
- Master Serial Mode: Configuration from external serial PROM
- Slave Serial Mode: Serial configuration from external controller
- Slave Parallel Mode: High-speed parallel loading
- Boundary Scan Mode: JTAG-based programming and testing
- Platform Flash: In-system programmable configuration PROMs
Development Tools
Compatible with industry-standard FPGA development environments:
- Xilinx ISE Design Suite (legacy support)
- Vivado Design Suite (for modern workflow integration)
- Third-party synthesis tools
- HDL support: VHDL, Verilog, SystemVerilog
Electrical Characteristics
Power Supply Requirements
| Power Parameter |
Specification |
| Core Voltage (VCCINT) |
1.8V ± 5% |
| I/O Voltage (VCCO) |
1.8V to 3.3V (standard-dependent) |
| Input Voltage Range |
0V to VCCO + 0.5V |
| Quiescent Current |
2 mA typical |
| Operating Current |
300 mA (XC2S300E typical) |
Environmental Specifications
| Environmental Factor |
Industrial Grade |
| Operating Temperature |
-40°C to +100°C |
| Storage Temperature |
-65°C to +150°C |
| Junction Temperature |
125°C maximum |
| ESD Protection |
Human Body Model compliant |
Advantages Over Traditional ASICs
FPGA Benefits
The XC2S300E-6FTG256I provides significant advantages compared to mask-programmed ASICs:
Cost Savings
- Eliminates expensive mask and NRE (non-recurring engineering) costs
- Reduces initial investment for low to medium volume production
- Accelerates time-to-market with immediate prototyping
Design Flexibility
- Unlimited reprogrammability enables field upgrades
- Design iterations without hardware replacement
- Bug fixes and feature enhancements post-deployment
- Customization for specific customer requirements
Development Efficiency
- Shorter development cycles compared to ASIC design
- Rapid prototyping and testing capabilities
- Iterative design refinement without fabrication delays
- Reduced risk in product development
Quality and Reliability
Manufacturing Standards
- RoHS Compliant: Lead-free construction meeting environmental regulations
- Industrial Temperature Range: -40°C to +100°C operation guaranteed
- Quality Certifications: Manufactured to Xilinx quality standards
- Long-term Availability: Industrial-grade components with extended lifecycle support
Testing and Validation
All XC2S300E-6FTG256I devices undergo rigorous testing:
- Comprehensive functional testing at multiple temperature points
- Speed grade verification and binning
- I/O standards compliance verification
- Package integrity and thermal testing
Pin Configuration and I/O Standards
Supported I/O Standards
The XC2S300E-6FTG256I supports 19 selectable I/O standards, including:
- LVTTL (Low Voltage TTL)
- LVCMOS (Low Voltage CMOS): 3.3V, 2.5V, 1.8V
- LVDS (Low Voltage Differential Signaling)
- GTL (Gunning Transceiver Logic)
- SSTL (Stub Series Terminated Logic)
- HSTL (High Speed Transceiver Logic)
- PCI 33/66 MHz
This flexibility enables seamless integration with various system architectures and voltage domains.
Design Considerations
Thermal Management
For optimal performance of the XC2S300E-6FTG256I:
- Ensure adequate PCB thermal vias beneath FTBGA package
- Implement appropriate heat sinking for high-utilization designs
- Monitor junction temperature during operation
- Consider airflow in system enclosure design
Power Supply Design
Best practices for power delivery:
- Use separate power planes for VCCINT (1.8V core) and VCCO (I/O)
- Implement adequate decoupling capacitors near device pins
- Design for low-impedance power distribution
- Include power sequencing circuitry if required
Signal Integrity
Recommendations for high-speed operation:
- Match impedance for high-speed signals
- Use differential pairs for LVDS applications
- Minimize stub lengths on critical nets
- Implement proper termination for I/O standards
Comparison with Related Devices
Spartan-IIE Family Comparison
| Device |
Logic Cells |
System Gates |
Block RAM |
User I/Os |
Package |
| XC2S50E |
1,728 |
50,000 |
16 Kbits |
182 |
Various |
| XC2S100E |
2,700 |
100,000 |
40 Kbits |
202 |
Various |
| XC2S150E |
3,888 |
150,000 |
72 Kbits |
265 |
Various |
| XC2S200E |
5,292 |
200,000 |
56 Kbits |
283 |
Various |
| XC2S300E |
6,912 |
300,000 |
64 Kbits |
329 |
256-FTBGA |
| XC2S400E |
10,800 |
400,000 |
160 Kbits |
410 |
Various |
| XC2S600E |
15,552 |
600,000 |
288 Kbits |
514 |
Various |
Ordering and Availability
Part Number Breakdown
XC2S300E-6FTG256I
- XC2S300E: Device family and gate count
- -6: Speed grade (performance tier)
- FT: Package type (Fine-pitch BGA)
- G: Lead-free/RoHS compliant
- 256: Number of pins
- I: Industrial temperature range (-40°C to +100°C)
Lifecycle Status
Important Note: The Spartan-IIE family has been marked as obsolete by Xilinx and is not recommended for new designs. However, the XC2S300E-6FTG256I remains available through authorized distributors for:
- Legacy system support and repair
- Production of existing designs
- Replacement in fielded equipment
- Limited new applications where alternatives are unsuitable
Recommended Alternatives
For new designs, consider these modern Xilinx FPGA families:
- Spartan-6: Enhanced performance with lower power consumption
- Spartan-7: Latest generation with superior features
- Artix-7: Advanced 28nm technology with DDR3 support
- Zynq-7000: SoC solutions with ARM processors
Frequently Asked Questions
What is the primary difference between speed grades?
The -6 speed grade indicates the device’s performance tier, with lower numbers representing faster maximum clock frequencies and shorter propagation delays. Speed grade -6 offers good performance for most industrial applications at competitive pricing.
Can the XC2S300E-6FTG256I be reprogrammed?
Yes, the device features unlimited in-system reprogrammability, allowing design updates and modifications without hardware replacement. This is a key advantage over traditional ASICs.
What development tools are required?
The XC2S300E-6FTG256I is supported by Xilinx ISE Design Suite (primary tool for Spartan-IIE) and can integrate with modern Vivado workflows. HDL synthesis tools and simulation environments are also compatible.
Is technical documentation available?
Complete datasheets, application notes, and reference designs are available through Xilinx/AMD documentation portals and authorized distributors.
What is the typical lead time for procurement?
Lead times vary by distributor and current inventory levels. Industrial-grade components like the XC2S300E-6FTG256I may have extended lead times due to lifecycle status. Contact authorized distributors for current availability.
Conclusion
The XC2S300E-6FTG256I represents a mature, reliable FPGA solution for industrial applications requiring 300,000 system gates of programmable logic. With its robust 256-pin FTBGA package, industrial temperature range operation, and comprehensive I/O support, this device continues to serve legacy systems and specialized applications where its proven architecture provides value.
While classified as obsolete for new designs, the XC2S300E-6FTG256I remains an important component for system maintenance, production continuity, and applications where migration to newer technologies is impractical. Engineers working with this device benefit from extensive documentation, established design practices, and continued availability through authorized distribution channels.
For organizations maintaining systems based on the Spartan-IIE architecture, the XC2S300E-6FTG256I delivers the reliability, performance, and flexibility that have made Xilinx FPGAs the industry standard for programmable logic solutions.
