Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S300E-6FTG256C: High-Performance Spartan-IIE FPGA for Embedded Applications

Product Details

Overview of XC2S300E-6FTG256C FPGA

The XC2S300E-6FTG256C is a powerful field-programmable gate array (FPGA) from AMD Xilinx’s renowned Spartan-IIE family. This versatile programmable logic device delivers exceptional performance with 300,000 system gates and 6,912 logic cells, making it an ideal choice for demanding embedded systems, digital signal processing, and communication applications. As a cost-effective alternative to application-specific integrated circuits (ASICs), this Xilinx FPGA provides designers with the flexibility of reprogrammability without the high initial costs and lengthy development cycles associated with custom silicon.

Key Technical Specifications

Core Architecture Features

Specification Value
Logic Cells 6,912
System Gates 300,000
Configurable Logic Blocks (CLBs) 1,536 (32 x 48 array)
Total RAM Bits 65,536
Distributed RAM 98,304 bits
Block RAM 64K bits
Maximum I/O Pins 182 user I/O
Total Pins 256-pin FTBGA

Performance Characteristics

Parameter Specification
Maximum Frequency 357 MHz
System Clock Rate Beyond 200 MHz
Speed Grade -6 (commercial grade)
Process Technology 0.15µm CMOS
Supply Voltage 1.71V ~ 1.89V (1.8V nominal)
Operating Temperature Range 0°C to 85°C (TJ)

Package Information

Package Detail Description
Package Type 256-FTBGA (Fine-Pitch Ball Grid Array)
Dimensions 17mm x 17mm
Mounting Type Surface Mount Technology (SMT)
RoHS Compliance Yes (Lead-free)
Moisture Sensitivity Level MSL 3
Packaging Tray

Advanced FPGA Features and Capabilities

Memory Architecture

The XC2S300E-6FTG256C incorporates a hierarchical memory system designed for maximum flexibility:

  • Distributed RAM: 98,304 bits organized as 16 bits per Look-Up Table (LUT), enabling efficient implementation of small memory arrays and shift registers
  • Block RAM: 64K bits of true dual-port synchronous RAM, configurable as single or dual-port memory blocks
  • RAM Configuration: Flexible configurations supporting various data widths and depths to meet diverse application requirements

Clock Management System

Advanced timing control is provided through four Delay-Locked Loops (DLLs), strategically positioned at each corner of the die:

  • Precise clock distribution and phase alignment
  • Reduction of clock skew and jitter
  • Support for clock multiplication and division
  • Enhanced system timing performance

I/O Capabilities

The FPGA supports 19 selectable I/O standards, providing excellent interface flexibility:

  • LVTTL, LVCMOS (3.3V, 2.5V, 1.8V, 1.5V)
  • SSTL2, SSTL3
  • GTL, GTL+
  • HSTL Class I, II, III, IV
  • And many more industry-standard interfaces

Application Areas

Industrial and Embedded Systems

The XC2S300E-6FTG256C excels in industrial automation and control applications:

  • Motor control systems
  • Programmable logic controllers (PLCs)
  • Industrial communication protocols
  • Process control and monitoring
  • Factory automation equipment

Communications Infrastructure

Ideal for various communication systems and networking equipment:

  • Broadband fixed-line access equipment
  • Data encryption and compression
  • Protocol conversion and bridging
  • Network packet processing
  • Telecommunications equipment

Consumer Electronics

Perfect for cost-sensitive consumer applications:

  • Automotive infotainment systems
  • Connected peripherals and printers
  • Personal electronics devices
  • Audio/video processing
  • Display controllers

Digital Signal Processing

The FPGA’s architecture supports intensive DSP applications:

  • Digital filtering and signal conditioning
  • Fast Fourier Transform (FFT) implementations
  • Image and video processing
  • Software-defined radio
  • Real-time data acquisition systems

Design and Development Advantages

ASIC Replacement Benefits

Choosing the XC2S300E-6FTG256C over traditional ASICs provides significant advantages:

  1. Zero NRE Costs: No mask charges or upfront tooling expenses
  2. Rapid Time-to-Market: Immediate implementation without fabrication delays
  3. Design Flexibility: In-system reprogrammability enables field upgrades
  4. Risk Mitigation: Design changes possible even after deployment
  5. Prototype-to-Production: Same device used throughout development cycle

Development Tool Support

Compatible with industry-standard Xilinx development tools:

  • Xilinx ISE Design Suite: Comprehensive design environment for Spartan-IIE devices
  • Vivado Design Suite: Modern development platform (for compatible workflows)
  • ChipScope Pro: Advanced debugging and verification
  • Platform Flash: In-system programmable configuration PROMs
  • Impact: Configuration and programming utility

Design Resources

Xilinx provides extensive support resources:

  • Detailed technical documentation and datasheets
  • Reference designs and application notes
  • IP cores and design libraries
  • Online community forums and technical support
  • Training materials and webinars

Configuration and Programming Options

Configuration Methods

The XC2S300E-6FTG256C supports multiple configuration modes:

  • Master Serial Mode: FPGA controls configuration sequence
  • Slave Serial Mode: External controller manages configuration
  • JTAG Boundary Scan: IEEE 1149.1 compliant for testing and programming
  • Platform Flash PROM: Non-volatile configuration storage

Programming Interfaces

Standard programming methods include:

  • JTAG-based programmers (Platform Cable USB, JTAG-HS)
  • In-System Programming (ISP) capability
  • ChipScope Pro for real-time debugging
  • Multi-FPGA chain programming support

Part Number Breakdown: XC2S300E-6FTG256C

Understanding the part number structure:

  • XC: Xilinx Commercial temperature range
  • 2S: Spartan-II family designation
  • 300E: 300K gate count, Enhanced version
  • -6: Speed grade (commercial grade, fastest option)
  • FT: Fine-Pitch BGA package family
  • G: RoHS-compliant, lead-free package
  • 256: 256-pin package
  • C: Commercial temperature grade (0°C to 85°C)

Competitive Advantages and Value Proposition

Performance Benefits

  • High-speed operation up to 357 MHz enables demanding applications
  • Low-power 0.15µm CMOS technology reduces energy consumption
  • Fast, predictable interconnect ensures timing closure across design iterations
  • Advanced architecture based on proven Virtex-E FPGA technology

Cost-Effectiveness

The Spartan-IIE family delivers exceptional value:

  • Industry-leading price-per-gate ratio
  • Reduced total cost of ownership compared to ASICs
  • Single-device solution eliminates multi-chip complexity
  • Long product lifecycle support from AMD Xilinx

Reliability and Quality

  • Industrial-grade temperature range operation
  • Comprehensive testing and quality assurance
  • RoHS-compliant, environmentally friendly
  • Proven reliability in high-volume production environments

Technical Considerations for System Designers

Power Management

Proper power supply design is critical:

  • Core voltage: 1.71V to 1.89V (1.8V nominal)
  • I/O voltage: Varies by selected I/O standard
  • Decoupling capacitors required on all power pins
  • Power sequencing considerations for reliable operation

Thermal Management

Operating within specified temperature ranges:

  • Junction temperature: 0°C to 85°C (commercial grade)
  • Thermal resistance varies by package and cooling method
  • Heat sink may be required for high-utilization designs
  • Power consumption estimation tools available in design software

PCB Design Guidelines

Critical layout considerations:

  • 17mm x 17mm BGA footprint requires precise PCB manufacturing
  • High-speed signal integrity considerations for I/O routing
  • Proper ground plane design for noise immunity
  • Power distribution network optimization
  • Impedance-controlled routing for high-speed interfaces

Comparison with Alternative FPGA Solutions

Within Spartan-IIE Family

Device Logic Cells System Gates Block RAM I/O Pins
XC2S50E 1,728 50K-150K 16K 182
XC2S100E 2,700 100K-200K 40K 202
XC2S150E 3,456 150K-200K 72K 265
XC2S300E 6,912 300K 64K 182
XC2S400E 10,800 400K 160K 410
XC2S600E 15,552 600K 288K 514

Migration Path

Design scalability within the family:

  • Pin-compatible options for easy design migration
  • Common architecture enables code reuse
  • Consistent development tools across all devices
  • Straightforward upgrade path as requirements grow

Obsolescence and Lifecycle Information

Important Note: The XC2S300E-6FTG256C is currently marked as obsolete by the manufacturer. However:

  • Inventory remains available through authorized distributors
  • Legacy system support and maintenance continue
  • Modern alternatives available in Spartan-7 or Artix-7 families
  • Contact suppliers for long-term availability planning
  • Consider design migration strategies for new projects

Quality Assurance and Authenticity

Sourcing Recommendations

When purchasing XC2S300E-6FTG256C devices:

  • Buy from authorized Xilinx distributors
  • Verify authentic packaging and markings
  • Request certificates of conformance
  • Beware of counterfeit components in the market
  • Store devices in anti-static packaging

Warranty and Support

Most authorized distributors offer:

  • Manufacturer’s warranty coverage
  • Technical support services
  • RMA procedures for defective units
  • Quality guarantee programs
  • Traceability documentation

Frequently Asked Questions (FAQ)

What is the difference between XC2S300E-6FTG256C and similar part numbers?

The speed grade (-6) indicates the fastest commercial-grade version. Alternative speed grades like -5 or -7 offer different performance-cost trade-offs.

Can this FPGA be reprogrammed in the field?

Yes, the XC2S300E-6FTG256C supports in-system reprogrammability through JTAG or serial configuration interfaces, allowing field upgrades without hardware replacement.

What development tools are required?

Xilinx ISE Design Suite is the primary development environment. Free WebPACK edition supports Spartan-IIE devices for basic designs.

Is this device suitable for new designs?

While technically capable, the obsolete status suggests considering newer alternatives like Spartan-7 for new projects. Existing designs can continue using available stock.

What is the typical lead time for ordering?

Lead times vary by distributor and stock availability. Check with authorized suppliers for current delivery schedules.

Conclusion: Why Choose XC2S300E-6FTG256C

The XC2S300E-6FTG256C represents a mature, proven FPGA solution that balances performance, features, and cost-effectiveness. With 300,000 system gates, 182 I/O pins, and advanced features like dual-port block RAM and DLL clock management, this device continues to serve legacy applications and cost-sensitive designs effectively.

While marked as obsolete, existing inventory provides ongoing support for maintenance and small-volume production. For new designs, consider modern equivalents while leveraging the extensive knowledge base and proven reliability of the Spartan-IIE architecture.

Whether you’re maintaining existing systems, developing cost-optimized solutions, or exploring FPGA technology, the XC2S300E-6FTG256C offers a compelling combination of capability and value in a compact, industry-standard package.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.