Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S300E-6FT256I: High-Performance Spartan-IIE FPGA Solution

Product Details

Overview of XC2S300E-6FT256I FPGA Technology

The XC2S300E-6FT256I represents a powerful field-programmable gate array solution from the renowned Spartan-IIE family. This programmable logic device delivers exceptional performance with 300,000 system gates and advanced features suitable for diverse digital design applications. Manufactured using cutting-edge 0.15-micron technology, this FPGA provides designers with a cost-effective alternative to traditional ASICs while maintaining high reliability and flexibility.

Key Technical Specifications

Core Performance Parameters

Specification Value
Logic Gates 300,000 system gates
Logic Cells 6,912 cells
Operating Frequency 357 MHz
Core Voltage 1.8V
Manufacturing Process 0.15μm technology
Package Type 256-Pin FTBGA
Operating Temperature Range -40°C to +100°C

Memory Architecture

Memory Type Capacity
Block RAM Up to 288 Kbits
Distributed RAM Up to 221,184 bits
SelectRAM 16 bits/LUT distributed RAM
Block RAM Configuration 4K-bit true dual-port

Advanced Features and Capabilities

System-Level Architecture

The XC2S300E-6FT256I incorporates advanced architectural features that distinguish it from conventional programmable logic devices:

Configurable Logic Blocks (CLBs): The device features multiple CLBs that enable flexible logic implementation with efficient resource utilization. Each CLB contains lookup tables, flip-flops, and multiplexers optimized for high-speed operation.

Delay-Locked Loops (DLLs): Four integrated DLLs provide precise clock management and distribution, ensuring signal integrity across complex designs. These DLLs minimize clock skew and enable precise timing control essential for high-performance applications.

I/O Standards Support: With support for 19 selectable I/O standards, this Xilinx FPGA offers exceptional interface flexibility. Compatible standards include LVTTL, LVCMOS, PCI, GTL, SSTL, and HSTL among others, facilitating seamless integration with diverse system architectures.

Industrial Applications

Communication Systems

The XC2S300E-6FT256I excels in communication infrastructure applications where high-speed data processing is critical:

  • Network Protocol Processing: Implements advanced protocols including PCI Express, Serial RapidIO, and Gigabit Ethernet
  • Broadband Access Equipment: Powers DSL modems, cable modems, and fiber optic communication systems
  • Wireless Base Stations: Handles baseband processing and signal routing in cellular infrastructure

Embedded Control Systems

This FPGA solution provides robust performance for industrial control applications:

  • Motor Control: Executes complex control algorithms for precision motor management
  • Power Management Systems: Implements switching control and power conversion logic
  • Industrial Automation: Controls manufacturing equipment and process automation systems

Digital Signal Processing

The device architecture supports computationally intensive DSP operations:

  • Video Processing: Performs real-time image filtering, compression, and enhancement
  • Audio Signal Processing: Implements digital filters, equalizers, and audio codecs
  • Data Acquisition: Processes sensor data with high-speed sampling and analysis

Design Advantages and Benefits

ASIC Replacement Technology

The XC2S300E-6FT256I offers compelling advantages over traditional mask-programmed ASICs:

Reduced Development Time: Eliminate lengthy fabrication cycles associated with ASIC development. Design iterations occur in software, dramatically accelerating time-to-market.

Lower Initial Costs: Avoid expensive NRE (Non-Recurring Engineering) charges and minimum order quantities required for ASIC production.

Field Upgradability: Unlike ASICs, this FPGA supports in-system reprogrammability, enabling firmware updates and feature enhancements without hardware replacement.

Risk Mitigation: Modify designs post-deployment to address bugs or implement new features, eliminating the financial risk of ASIC respins.

Predictable Interconnect Architecture

The Spartan-IIE architecture features deterministic routing that ensures:

  • Consistent timing across design iterations
  • Reliable meeting of timing constraints
  • Reduced timing closure efforts
  • Simplified static timing analysis

Package and Physical Characteristics

FTBGA-256 Package Details

Parameter Specification
Total Pins 256
Package Type Fine-Pitch Ball Grid Array (FTBGA)
Body Size Compact footprint for space-constrained designs
Mounting Type Surface Mount Technology (SMT)
RoHS Compliance Lead-free compatible

The fine-pitch ball grid array package provides excellent thermal performance and signal integrity while maintaining a compact board footprint suitable for high-density applications.

Speed Grade and Performance Classification

The “-6” speed grade designation indicates mid-range performance within the Spartan-IIE family. This grade balances:

  • Maximum operating frequency (357 MHz)
  • Power consumption efficiency
  • Cost-effectiveness
  • Thermal characteristics

The speed grade makes this device ideal for applications requiring substantial processing capability without the premium cost of the fastest speed grades.

Power Consumption and Thermal Management

Voltage Requirements

Power Rail Voltage Purpose
VCCINT 1.8V Core logic supply
VCCO 1.8V to 3.3V I/O banks supply
VCCAUX 2.5V or 3.3V Auxiliary circuits

Thermal Considerations

Operating within the industrial temperature range (-40°C to +100°C), the XC2S300E-6FT256I requires appropriate thermal management:

  • Heat sink attachment recommended for high-utilization applications
  • Adequate PCB copper planes for heat dissipation
  • Thermal vias beneath package for improved heat transfer
  • Airflow consideration in enclosed systems

Development Tool Compatibility

Xilinx ISE Design Suite

The XC2S300E-6FT256I integrates seamlessly with Xilinx ISE (Integrated Software Environment) design tools, providing:

  • Comprehensive synthesis and implementation flows
  • Advanced place-and-route algorithms
  • Static timing analysis
  • Power estimation tools
  • Hardware co-simulation capabilities

Programming and Configuration

Multiple configuration modes support diverse application requirements:

  • Master Serial mode
  • Slave Serial mode
  • Boundary Scan (JTAG)
  • SelectMAP mode

Configuration memory can be stored in external PROM, Flash, or provided by external processors, offering maximum flexibility.

Quality and Reliability Standards

Manufacturing Quality

Xilinx maintains rigorous quality control throughout the manufacturing process:

  • Comprehensive electrical testing
  • Temperature cycling validation
  • Humidity resistance verification
  • Electrostatic discharge (ESD) protection testing

Product Lifecycle

While currently classified in the mature product phase, the XC2S300E-6FT256I continues to receive manufacturing support with:

  • Consistent availability through authorized distributors
  • Technical documentation and application notes
  • Design support resources
  • Legacy system maintenance support

Comparison with Alternative Devices

Within Spartan-IIE Family

Device System Gates Logic Cells Block RAM
XC2S50E 50,000 1,728 32 Kbits
XC2S100E 100,000 3,456 64 Kbits
XC2S300E 300,000 6,912 288 Kbits
XC2S400E 400,000 9,216 288 Kbits
XC2S600E 600,000 15,552 288 Kbits

The XC2S300E provides an optimal balance of logic resources and cost for mid-range applications.

Procurement and Availability

Package Variants

The XC2S300E is available in multiple package options:

  • FT256 (256-pin FTBGA) – Featured device
  • PQ208 (208-pin PQFP)
  • FG456 (456-pin FBGA)

Stock Availability

The XC2S300E-6FT256I maintains availability through authorized electronic component distributors worldwide, with typical lead times varying based on order quantity and regional demand.

Design Considerations and Best Practices

Clock Domain Management

Successful implementations require careful attention to clock domain crossing:

  • Implement proper synchronization for signals crossing clock domains
  • Utilize DLLs for clock distribution and de-skewing
  • Apply timing constraints accurately in design tools
  • Verify timing closure for all critical paths

Resource Optimization

Maximize design efficiency through:

  • Strategic use of distributed versus block RAM
  • Logic replication for timing optimization
  • Register retiming for improved performance
  • Careful I/O pin assignment for signal integrity

Power Optimization Techniques

Reduce power consumption via:

  • Clock gating for unused logic blocks
  • Optimal I/O standard selection
  • Strategic placement of high-activity logic
  • Appropriate use of sleep modes when applicable

Technical Support and Documentation

Available Resources

Designers have access to comprehensive technical documentation:

  • Complete datasheet with AC/DC specifications
  • Application notes for common design patterns
  • Reference designs and example projects
  • Package mechanical drawings
  • PCB layout guidelines

Community and Support

Technical assistance available through:

  • Xilinx official support channels
  • Online design forums and communities
  • Application engineering consultation
  • Third-party IP core providers

Conclusion

The XC2S300E-6FT256I represents a mature, reliable FPGA solution combining substantial logic resources, flexible I/O capabilities, and cost-effective pricing. Its balanced feature set makes it suitable for communication systems, industrial control, signal processing, and embedded applications where programmability and performance are essential. With comprehensive development tool support and extensive documentation, this device enables efficient design implementation for both experienced FPGA engineers and those new to programmable logic.

Whether replacing legacy ASICs, prototyping new designs, or implementing production systems, the XC2S300E-6FT256I delivers the performance, flexibility, and reliability required for demanding digital design applications.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.