The XC2S200E-7FGG456C represents a powerful solution in AMD’s (formerly Xilinx) Spartan-IIE FPGA family, delivering 200,000 system gates of programmable logic in a compact 456-pin fine-pitch BGA package. This field-programmable gate array combines exceptional performance, flexibility, and cost-effectiveness for embedded systems, industrial automation, and digital signal processing applications.
What is the XC2S200E-7FGG456C FPGA?
The XC2S200E-7FGG456C is a cutting-edge programmable logic device from the Spartan-IIE 1.8V FPGA family, manufactured using advanced 0.15-micron CMOS technology. This device features 5,292 configurable logic cells with a 28 x 42 array architecture, providing up to 200,000 system gates of programmable logic capacity. As part of AMD’s legacy Xilinx FPGA portfolio, this component offers engineers a reliable, field-reprogrammable alternative to traditional ASICs with significantly reduced development time and cost.
Key Technical Specifications Overview
Understanding the XC2S200E-7FGG456C specifications is essential for proper system integration and design optimization:
| Specification |
Value |
Description |
| System Gates |
200,000 |
Total programmable logic capacity |
| Logic Cells |
5,292 |
Configurable logic blocks for digital design |
| CLB Array |
28 x 42 |
Organized matrix of configurable logic |
| User I/O Pins |
289 |
Available input/output connections |
| Block RAM |
56 Kbits |
Dedicated memory blocks |
| Distributed RAM |
75,264 bits |
RAM distributed throughout CLBs |
| DLLs |
4 |
Delay-Locked Loops for clock management |
| Operating Voltage |
1.8V |
Core supply voltage |
| Speed Grade |
-7 |
Performance rating (fastest available) |
| Package Type |
FGG456 |
456-pin Fine-Pitch BGA |
| Operating Temp |
Commercial |
0°C to +85°C temperature range |
Architecture and Core Features
Configurable Logic Block Architecture
The XC2S200E-7FGG456C employs a sophisticated CLB architecture that provides maximum design flexibility. Each configurable logic block contains multiple logic slices with Look-Up Tables (LUTs), flip-flops, and multiplexers, enabling implementation of complex combinational and sequential logic functions.
Memory Resources and Capabilities
Memory architecture plays a critical role in FPGA performance. This device integrates two types of memory resources:
Block RAM Configuration:
| Memory Type |
Capacity |
Configuration Options |
| Block SelectRAM |
56 Kbits total |
Configurable as single/dual-port RAM |
| Distributed RAM |
75,264 bits |
16 bits per LUT |
| Memory Blocks |
28 blocks |
Each 2 Kbits, true dual-port capable |
Clock Management and Timing
The XC2S200E-7FGG456C features four Delay-Locked Loops (DLLs) that provide advanced clock management capabilities, including:
- Clock deskewing and phase shifting
- Frequency synthesis and division
- Zero-delay clock distribution
- Programmable duty-cycle correction
Package Information: FGG456 Fine-Pitch BGA
The FGG456 package offers several advantages for high-density applications:
| Package Attribute |
Specification |
| Package Type |
Fine-Pitch Ball Grid Array |
| Pin Count |
456 balls |
| Body Size |
23mm x 23mm |
| Ball Pitch |
1.0mm |
| Profile |
Low-profile surface mount |
| Thermal Performance |
Enhanced heat dissipation |
| RoHS Compliance |
Available in lead-free option |
Performance Characteristics
Speed Grade -7 Performance
The “-7” speed grade designation indicates the fastest performance tier in the Spartan-IIE family, offering:
- Maximum system frequency up to 200+ MHz
- Optimized routing for timing-critical paths
- Reduced propagation delays
- Enhanced setup and hold time margins
Power Consumption Profile
Efficient power management is built into the XC2S200E-7FGG456C design:
| Power Parameter |
Typical Value |
Operating Conditions |
| Core Voltage |
1.8V |
±5% tolerance |
| I/O Voltage |
1.5V to 3.3V |
Multiple standards supported |
| Static Power |
Low |
Power-down modes available |
| Dynamic Power |
Variable |
Depends on toggle rate |
I/O Capabilities and Standards
Supported I/O Standards
The device supports 19 selectable I/O standards, providing exceptional interface flexibility:
Single-Ended Standards:
- LVTTL (Low-Voltage TTL)
- LVCMOS (1.5V, 1.8V, 2.5V, 3.3V)
- PCI (33MHz, 66MHz)
- GTL, GTL+
Differential Standards:
- LVDS (Low-Voltage Differential Signaling)
- RSDS (Reduced Swing Differential Signaling)
- BLVDS, Mini-LVDS
User I/O Distribution
With 289 total user I/O pins, the FGG456 package provides extensive connectivity:
| I/O Bank |
Available Pins |
Voltage Configuration |
| Bank 0-7 |
36-40 per bank |
Independently configurable |
| Global Clocks |
4 dedicated |
System-wide distribution |
| Differential Pairs |
Up to 144 |
For high-speed interfaces |
Applications and Use Cases
Industrial Control Systems
The XC2S200E-7FGG456C excels in industrial automation applications where real-time processing and reliability are paramount:
- Motor Control: PWM generation, encoder interfaces
- PLC Replacement: Programmable logic implementation
- Process Monitoring: Multi-channel data acquisition
- Safety Systems: Redundant logic for critical functions
Communication Infrastructure
High-speed I/O capabilities make this FPGA ideal for communications equipment:
- Protocol converters and bridges
- Data packet processing
- Interface multiplexing
- Signal conditioning and filtering
Digital Signal Processing
The combination of logic resources and memory enables sophisticated DSP functions:
- FIR/IIR filter implementation
- FFT processing
- Image processing algorithms
- Audio/video codec acceleration
Test and Measurement Equipment
Flexible I/O and programmability support diverse instrumentation needs:
- Logic analyzers
- Protocol analyzers
- Signal generators
- Data acquisition systems
Design Tools and Development Support
ISE Design Suite Compatibility
The XC2S200E-7FGG456C is supported by Xilinx ISE (Integrated Software Environment):
| Tool Feature |
Capability |
| Synthesis |
XST (Xilinx Synthesis Technology) |
| Implementation |
Place and Route optimization |
| Simulation |
ISim behavioral simulator |
| Programming |
iMPACT configuration tool |
| Constraints |
UCF (User Constraints File) |
Configuration Methods
Multiple configuration options provide deployment flexibility:
- Master Serial Mode: Using external PROM
- Slave Serial Mode: From external controller
- JTAG: For development and debugging
- Boundary Scan: IEEE 1149.1 compliant
Competitive Advantages Over ASICs
Cost-Effectiveness
The XC2S200E-7FGG456C serves as a superior alternative to mask-programmed ASICs, avoiding initial costs, lengthy development cycles, and inherent risks of conventional ASICs:
| Factor |
FPGA Advantage |
ASIC Challenge |
| NRE Costs |
Minimal |
$500K-$5M+ |
| Time to Market |
Weeks |
6-12+ months |
| Design Changes |
Immediate |
Requires respin |
| Volume Break-Even |
Flexible |
100K+ units |
| Risk |
Low |
High |
Field Upgradeability
FPGA programmability permits design upgrades in the field with no hardware replacement necessary, which is impossible with ASICs. This enables:
- Bug fixes post-deployment
- Feature additions
- Protocol updates
- Performance optimization
Environmental and Quality Specifications
Operating Conditions
| Parameter |
Minimum |
Maximum |
Units |
| Core Voltage |
1.71 |
1.89 |
V |
| I/O Voltage |
Varies by standard |
3.465 |
V |
| Operating Temp |
0 |
+85 |
°C |
| Junction Temp |
– |
+125 |
°C |
Reliability and Compliance
- RoHS Compliant: Lead-free package options available
- Quality Standards: Manufactured to automotive-grade processes
- MTBF: Extended mean time between failures
- ESD Protection: HBM and CDM tested
Ordering Information and Part Number Breakdown
Understanding the part number structure helps ensure correct device selection:
XC2S200E-7FGG456C
- XC2S: Spartan-IIE family designation
- 200E: 200,000 system gates, Enhanced features
- -7: Speed grade (fastest)
- FGG: Fine-pitch BGA package family
- 456: Pin count
- C: Commercial temperature range (0°C to +85°C)
Package Variants Available
| Package Code |
Pin Count |
Body Size |
Pitch |
| FG256 |
256 |
17mm x 17mm |
1.0mm |
| FT256 |
256 |
17mm x 17mm |
1.0mm |
| FGG456 |
456 |
23mm x 23mm |
1.0mm |
| PQ208 |
208 |
28mm x 28mm |
0.5mm |
PCB Design Considerations
Layout Guidelines
Proper PCB design ensures optimal XC2S200E-7FGG456C performance:
Power Delivery:
- Dedicated power planes for VCCINT (1.8V)
- Separate planes for VCCIO banks
- Decoupling capacitors: 0.1µF and 0.01µF near device
- Bulk capacitors: 10µF tantalum per power rail
Thermal Management:
- Thermal vias under BGA for heat dissipation
- Consider heatsink for high-utilization designs
- Maintain proper airflow in enclosure
Signal Integrity:
- Controlled impedance for high-speed signals
- Ground plane continuity
- Minimize stub lengths on critical nets
- Differential pair routing for LVDS
Migration and Scalability
Family Compatibility
The Spartan-IIE family provides easy migration paths:
| Device |
Logic Cells |
System Gates |
Block RAM |
| XC2S50E |
1,728 |
50,000 |
16 Kbits |
| XC2S100E |
2,700 |
100,000 |
40 Kbits |
| XC2S150E |
3,888 |
150,000 |
72 Kbits |
| XC2S200E |
5,292 |
200,000 |
56 Kbits |
| XC2S300E |
6,912 |
300,000 |
64 Kbits |
| XC2S400E |
10,800 |
400,000 |
160 Kbits |
| XC2S600E |
15,552 |
600,000 |
288 Kbits |
Pin Compatibility Matrix
For designs requiring future scalability, pin-compatible options exist within the FGG456 package:
- XC2S100E-FGG456C: Smaller capacity, same footprint
- XC2S150E-FGG456C: Mid-range option
- XC2S300E-FGG456C: Higher capacity upgrade path
Summary of Key Benefits
The XC2S200E-7FGG456C delivers compelling advantages for modern electronic designs:
✓ High Integration: 200,000 system gates in compact package
✓ Fast Performance: Speed grade -7 for demanding applications
✓ Flexible I/O: 289 pins supporting 19 interface standards
✓ Rich Memory: 56 Kbits block RAM plus distributed memory
✓ Low Power: 1.8V core technology for efficiency
✓ Cost-Effective: ASIC alternative without NRE costs
✓ Field-Upgradable: In-system reprogrammability
✓ Proven Technology: Mature, reliable platform
Conclusion
The XC2S200E-7FGG456C represents an optimal balance of performance, capacity, and cost for mid-range FPGA applications. Whether implementing industrial control systems, communication protocols, or digital signal processing functions, this device provides the resources, speed, and flexibility required for successful product development. Its mature toolchain, extensive documentation, and proven reliability make it an excellent choice for both new designs and upgrades to existing systems.
For engineers seeking a dependable, cost-effective programmable logic solution with substantial logic resources and comprehensive I/O capabilities, the XC2S200E-7FGG456C delivers exceptional value in the Xilinx FPGA product portfolio.
