Product Overview: AMD XC2S200E-7FG456C FPGA
The XC2S200E-7FG456C is a powerful Field-Programmable Gate Array (FPGA) from AMD’s renowned Spartan-IIE family, delivering exceptional performance for industrial automation, telecommunications, and embedded system applications. This 456-pin FBGA device combines 200,000 system gates with advanced programmable logic architecture, making it an ideal alternative to traditional ASICs for cost-sensitive designs.
As part of the industry-leading Xilinx FPGA product line, the XC2S200E-7FG456C offers designers unmatched flexibility, reliability, and value in a compact surface-mount package.
Key Features of XC2S200E-7FG456C
Core Performance Specifications
The XC2S200E-7FG456C delivers robust performance with carefully balanced specifications:
- Logic Cells: 5,292 configurable logic blocks (CLBs)
- System Gates: 71,000 to 200,000 equivalent gates
- Maximum Operating Frequency: 357 MHz
- I/O Pins: 289 user-configurable I/O pins
- Block RAM: 56 Kbits distributed RAM
- Speed Grade: -7 (commercial temperature range)
Advanced FPGA Architecture
This Spartan-IIE device features AMD’s proven programmable logic architecture:
- CLB Matrix: 28 x 42 configurable logic block array
- Total Distributed RAM: 75,264 bits
- Block SelectRAM: 1,176 blocks for efficient memory implementation
- Global Clock Inputs: 4 dedicated global clock/user input pins
- DLL Resources: 120 digital delay-locked loops
Technical Specifications Table
| Parameter |
Specification |
| Part Number |
XC2S200E-7FG456C |
| Manufacturer |
AMD (formerly Xilinx) |
| Product Family |
Spartan-IIE FPGA |
| Logic Cells |
5,292 CLBs |
| System Gates |
71,000 – 200,000 |
| User I/O Pins |
289 |
| Package Type |
456-FBGA (Fine-Pitch Ball Grid Array) |
| Speed Grade |
-7 |
| Operating Voltage |
1.8V core |
| Technology Node |
0.15µm CMOS |
| Operating Temperature |
0°C to +85°C (Commercial) |
| RoHS Compliance |
Yes (Lead-free) |
Package Information: 456-Pin FBGA
| Package Feature |
Details |
| Package Type |
Fine-Pitch Ball Grid Array (FBGA) |
| Pin Count |
456 pins |
| Mounting Type |
Surface Mount Technology (SMT) |
| Package Dimensions |
Industry-standard FBGA footprint |
| Pitch |
1.0mm ball pitch |
| Thermal Performance |
Enhanced thermal dissipation design |
XC2S200E-7FG456C Applications
Industrial Automation and Control Systems
The XC2S200E-7FG456C excels in demanding industrial environments:
- Programmable Logic Controllers (PLCs)
- Motor control and drive systems
- Industrial communication protocols
- Factory automation interfaces
- Real-time monitoring systems
Telecommunications Equipment
Ideal for telecommunications infrastructure:
- Digital signal processing applications
- Protocol conversion and bridging
- Network switching equipment
- Wireless base station controllers
- Data communication systems
Automotive Electronics
Automotive-grade performance for:
- Body electronics and lighting control
- Advanced driver assistance systems (ADAS)
- In-vehicle networking
- Engine control units (ECUs)
- Dashboard and infotainment systems
Consumer Electronics and Gaming
Perfect for consumer applications:
- Gaming consoles and peripherals
- High-definition video processing
- Digital audio equipment
- Smart home automation
- Embedded controller systems
Why Choose XC2S200E-7FG456C Over ASICs?
Cost-Effective Development
The XC2S200E-7FG456C eliminates traditional ASIC challenges:
- Zero NRE Costs: No mask charges or minimum order quantities
- Rapid Prototyping: Immediate implementation without fabrication delays
- Lower Risk: Programmable logic reduces development risk
- Field Upgradeable: Update designs post-deployment without hardware changes
Flexibility and Time-to-Market
Accelerate your product development:
- Iterative design refinement
- In-system programmability
- Quick design modifications
- Reduced development cycles
- Lower overall project costs
Performance Characteristics
Speed Grade -7 Advantages
The -7 speed grade offers balanced performance:
- Commercial temperature range (0°C to +85°C)
- Optimized for cost-sensitive applications
- Reliable operation in standard environments
- Industry-standard timing specifications
- Excellent performance-per-dollar ratio
Power Efficiency
Advanced power management features:
- Low standby power consumption
- Dynamic power scaling capabilities
- Efficient 0.15µm CMOS process
- 1.8V core voltage for reduced power
- Multiple power domains support
Design Resources and Support
Development Tools Compatibility
Fully compatible with industry-standard tools:
- AMD Vivado Design Suite
- ISE Design Suite (legacy support)
- Third-party synthesis tools
- Simulation and verification platforms
- Programming and configuration utilities
Reference Designs Available
Accelerate development with proven designs:
- Application-specific reference implementations
- IP core libraries
- Configuration examples
- Best practice design guides
- Technical documentation library
Quality and Reliability Standards
Manufacturing Excellence
The XC2S200E-7FG456C meets stringent quality requirements:
- ISO 9001 certified manufacturing
- Automotive-grade quality processes
- Comprehensive testing protocols
- Long-term availability commitment
- Full traceability and documentation
Environmental Compliance
RoHS-compliant lead-free packaging:
- European Union RoHS directive compliant
- REACH regulation compliance
- Conflict minerals reporting
- Environmental sustainability focus
- Green manufacturing practices
Comparison with Similar FPGA Devices
| Feature |
XC2S200E-7FG456C |
XC2S300E |
XC2S400E |
| Logic Cells |
5,292 |
6,912 |
10,800 |
| System Gates |
200,000 |
300,000 |
400,000 |
| User I/O |
289 |
329 |
410 |
| Block RAM |
56K |
64K |
160K |
| CLB Array |
28 x 42 |
32 x 48 |
40 x 60 |
Ordering and Availability Information
Part Number Breakdown
Understanding the XC2S200E-7FG456C nomenclature:
- XC2S: Spartan-IIE FPGA family designation
- 200E: 200,000 system gate density
- -7: Speed grade indicator
- FG456: 456-pin Fine-pitch BGA package
- C: Commercial temperature range
Package Options
The Spartan-IIE family offers multiple package choices:
- FG456: 456-pin FBGA (featured product)
- FT256: 256-pin FBGA option
- PQ208: 208-pin plastic quad flat pack
Storage and Handling Guidelines
Recommended Storage Conditions
Ensure long-term reliability:
- Temperature: 15°C to 30°C
- Relative humidity: 30% to 60%
- Moisture sensitivity level: MSL 3
- ESD precautions required
- Original packaging preferred
Assembly Recommendations
Optimize manufacturing yield:
- Standard lead-free reflow profiles
- Proper PCB pad design critical
- Thermal management considerations
- X-ray inspection recommended
- Follow IPC-7095 guidelines
Frequently Asked Questions About XC2S200E-7FG456C
Is the XC2S200E-7FG456C RoHS compliant?
Yes, this device features lead-free packaging and meets all RoHS requirements for environmental compliance.
What is the difference between speed grades -6 and -7?
The -7 speed grade indicates the device meets commercial temperature specifications (0°C to +85°C), while -6 offers enhanced performance specifications. Both operate reliably within their rated parameters.
Can I use this FPGA for automotive applications?
While the XC2S200E-7FG456C is suitable for automotive body electronics and lighting control, verify specific automotive qualification requirements for safety-critical systems.
What programming tools are required?
The device is compatible with AMD’s ISE Design Suite and can be programmed using standard JTAG-based configuration tools.
What is the typical lead time for this component?
Lead times vary by distributor and market conditions. Contact authorized distributors for current availability and delivery schedules.
Conclusion: Maximize Design Flexibility with XC2S200E-7FG456C
The XC2S200E-7FG456C represents an exceptional balance of performance, flexibility, and cost-effectiveness for embedded system designers. With 200,000 system gates, 289 I/O pins, and proven Spartan-IIE architecture, this FPGA delivers the programmable logic resources needed for diverse applications from industrial automation to consumer electronics.
By choosing the XC2S200E-7FG456C, engineers gain access to AMD’s extensive ecosystem of development tools, IP cores, and technical support while avoiding the high costs and long development cycles associated with traditional ASIC approaches. The device’s RoHS-compliant 456-FBGA package ensures compatibility with modern manufacturing processes and environmental regulations.
Whether you’re developing telecommunications equipment, automotive electronics, or industrial control systems, the XC2S200E-7FG456C provides the performance, reliability, and design flexibility to bring your innovations to market quickly and cost-effectively. Explore the full capabilities of Xilinx FPGA solutions today.
