Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200E-6PQG208C: High-Performance Spartan-IIE FPGA for Embedded Applications

Product Details

Overview of XC2S200E-6PQG208C FPGA

The XC2S200E-6PQG208C is a powerful field-programmable gate array (FPGA) from AMD’s renowned Spartan-IIE family. This versatile programmable logic device delivers exceptional performance for cost-sensitive applications requiring configurable logic, making it an ideal choice for industrial control systems, telecommunications equipment, and digital signal processing implementations.

Key Features and Specifications

Core Architecture Specifications

The XC2S200E-6PQG208C incorporates advanced FPGA architecture optimized for flexibility and performance:

Specification Value
Logic Elements 4,704
System Gates 200,000
CLB Count 1,176
Total Block RAM 57,344 bits
Maximum User I/O 146
Operating Voltage 1.8V (Core)

Package and Performance Details

Parameter Description
Package Type 208-BQFP (Quad Flat Pack)
Speed Grade -6 (High Performance)
Operating Temperature 0°C to 85°C (Commercial)
Mounting Type Surface Mount
Package Dimensions 28mm x 28mm

Technical Architecture

Configurable Logic Blocks (CLBs)

The XC2S200E features 1,176 configurable logic blocks that form the foundation of its programmable architecture. Each CLB contains multiple logic cells with look-up tables (LUTs), flip-flops, and dedicated arithmetic logic for implementing complex digital functions efficiently.

Memory Resources

With 57,344 bits of distributed block RAM, this Xilinx FPGA provides ample on-chip memory for data buffering, FIFO implementations, and small memory arrays without consuming additional logic resources.

I/O Capabilities

The 146 user I/O pins support multiple voltage standards and offer programmable drive strength, enabling seamless interfacing with various external components and peripherals in mixed-voltage system designs.

Application Areas

Industrial Automation

The XC2S200E-6PQG208C excels in industrial control applications where reliable, reconfigurable logic is essential:

  • Motor control systems
  • Programmable logic controllers (PLCs)
  • Factory automation interfaces
  • Real-time monitoring systems

Communications Infrastructure

Telecommunications equipment benefits from the FPGA’s high-speed processing and flexible architecture:

  • Protocol converters
  • Data packet processing
  • Network interface cards
  • Signal multiplexing systems

Digital Signal Processing

DSP implementations leverage the FPGA’s parallel processing capabilities:

  • Digital filters
  • Image processing pipelines
  • Audio/video codecs
  • Software-defined radio

Performance Characteristics

Speed Grade Analysis

Performance Metric -6 Speed Grade
Maximum Toggle Rate 200+ MHz
Logic Delay 6ns (typical)
Clock-to-Out 5.5ns (typical)
Setup Time 2.5ns (typical)

The -6 speed grade represents the fastest performance option in the Spartan-IIE family, delivering optimal timing for high-speed applications requiring minimal propagation delays.

Power Consumption Profile

Operating Power Requirements

Power Parameter Typical Value
Core Voltage (VCCINT) 1.8V ±5%
I/O Voltage (VCCO) 1.8V to 3.3V
Standby Current <10mA
Dynamic Power Design-dependent

Design Implementation

Development Tools Compatibility

The XC2S200E-6PQG208C integrates seamlessly with industry-standard FPGA development tools:

  • Xilinx ISE Design Suite: Complete design entry and implementation
  • Vivado Design Suite: Advanced synthesis and optimization
  • Third-party synthesis tools: Synopsys, Mentor Graphics support
  • Hardware description languages: VHDL, Verilog, SystemVerilog

Programming and Configuration

Multiple configuration modes provide design flexibility:

  • Master Serial mode
  • Slave Serial mode
  • JTAG boundary scan
  • SelectMAP parallel configuration

Reliability and Quality

Temperature and Environmental Ratings

Environmental Factor Rating
Operating Temperature Range 0°C to +85°C
Storage Temperature -65°C to +150°C
Moisture Sensitivity Level MSL 3
RoHS Compliance Yes

Quality Assurance

AMD manufactures the XC2S200E-6PQG208C under strict quality control protocols, ensuring consistent performance and reliability for commercial and industrial applications.

Package Information

208-BQFP Package Details

Package Characteristic Specification
Body Size 28mm x 28mm
Pin Pitch 0.5mm
Package Height 3.4mm (max)
Lead Style Gull wing
Footprint Area 784 mm²

The quad flat pack design offers excellent thermal characteristics and simplified PCB layout routing with pins on all four sides.

Competitive Advantages

Why Choose XC2S200E-6PQG208C

  1. Cost-Effective Solution: Optimal price-to-performance ratio for mid-range applications
  2. Proven Architecture: Based on mature, field-tested Spartan-IIE technology
  3. Wide Industry Acceptance: Extensive design examples and community support
  4. Long-Term Availability: Established product with stable supply chain
  5. Comprehensive Ecosystem: Broad third-party IP core compatibility

Ordering Information

Part Number Breakdown

XC2S200E-6PQG208C decodes as:

  • XC2S: Spartan-IIE family designator
  • 200E: 200,000 system gates, enhanced features
  • 6: Speed grade (fastest option)
  • PQG208: 208-pin plastic quad flat pack
  • C: Commercial temperature range (0°C to 85°C)

Technical Support and Resources

Documentation and Design Files

Comprehensive technical resources available:

  • Complete datasheet with AC/DC specifications
  • Package mechanical drawings
  • PCB footprint recommendations
  • Reference design schematics
  • Power estimation spreadsheets
  • Application notes and design guides

Migration Path

The XC2S200E-6PQG208C offers clear upgrade and migration options within the Xilinx/AMD FPGA portfolio for evolving design requirements.

Conclusion

The XC2S200E-6PQG208C represents an excellent choice for engineers seeking a reliable, high-performance FPGA solution. With its balanced combination of logic capacity, memory resources, I/O flexibility, and competitive pricing, this device addresses a wide spectrum of embedded system requirements. Whether developing industrial control systems, communications equipment, or digital signal processing applications, the XC2S200E-6PQG208C delivers the programmable logic capabilities needed for successful product implementation.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.