Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200E-6FT256Q: High-Performance Spartan-IIE FPGA for Advanced Digital Design

Product Details

Overview of XC2S200E-6FT256Q FPGA

The XC2S200E-6FT256Q is a powerful field-programmable gate array (FPGA) from Xilinx’s renowned Spartan-IIE family, designed to deliver exceptional performance at a cost-effective price point. This versatile FPGA offers 200,000 system gates, making it an ideal solution for complex digital designs, embedded systems, and industrial automation applications. With its 256-pin FTBGA package and speed grade of -6, this device combines compact footprint with robust functionality.

Key Technical Specifications

Core Performance Features

Specification Value
Logic Cells 5,292 cells
System Gates 200,000 gates
Configurable Logic Blocks (CLBs) 1,176 CLBs
Maximum Clock Frequency 357 MHz
Operating Voltage 1.8V
Process Technology 0.15 micron
Package Type 256-Pin FTBGA (Fine-Pitch BGA)
Speed Grade -6 (Commercial)
Temperature Range 0°C to +85°C

Memory Architecture

Memory Type Capacity
Block RAM Up to 56 Kbits
Distributed RAM Up to 75,264 bits
SelectRAM™ Hierarchical Memory Yes

Input/Output Capabilities

I/O Feature Specification
Maximum User I/O Pins 289
Available I/O Standards 16 selectable standards
Delay-Locked Loops (DLLs) 4 DLLs
Global Clock Inputs 4 dedicated inputs

Advanced FPGA Architecture and Technology

Spartan-IIE Family Innovation

The XC2S200E-6FT256Q belongs to Xilinx’s second-generation ASIC replacement technology, featuring streamlined capabilities based on the proven Virtex-E FPGA architecture. This Xilinx FPGA delivers unlimited in-system reprogrammability, allowing designers to update and optimize their designs without hardware replacement.

Performance and Design Flexibility

The device supports system performance up to 357 MHz with fast, predictable interconnect that ensures successive design iterations consistently meet timing requirements. The 0.15-micron CMOS technology provides an optimal balance between performance, power consumption, and cost-effectiveness.

Memory and Resource Configuration

Hierarchical SelectRAM Memory

The XC2S200E-6FT256Q features Xilinx’s innovative SelectRAM hierarchical memory architecture, offering designers flexible memory options. Block RAM provides dedicated high-speed memory blocks, while distributed RAM utilizes CLB resources for additional memory requirements.

Configurable Logic Resources

With 1,176 configurable logic blocks and 5,292 logic cells, this FPGA provides substantial resources for implementing complex digital logic, signal processing algorithms, and custom computing architectures.

Package Information: 256-Pin FTBGA

Physical Characteristics

Package Detail Specification
Package Code FTBGA (Fine-Pitch Ball Grid Array)
Pin Count 256 pins
Body Material Plastic/Epoxy
Dimensions 17mm x 17mm
Ball Pitch Fine pitch (submillimeter)
Package Configuration 16 x 16 grid array
JEDEC Code S-PBGA-B256

Moisture Sensitivity

The XC2S200E-6FT256Q has a Moisture Sensitivity Level (MSL) of 3, requiring proper handling and storage to prevent moisture-related issues during the reflow soldering process.

Application Areas and Use Cases

Industrial Automation and Control

The XC2S200E-6FT256Q excels in building automation systems, process control, and industrial networking applications where reliable, reprogrammable logic is essential.

Communications Equipment

With support for multiple I/O standards and high-speed operation, this FPGA is ideal for communications infrastructure, protocol conversion, and data processing applications.

Consumer Electronics

The cost-effective nature of the Spartan-IIE family makes it perfect for consumer products including personal electronics, PC peripherals, and multimedia devices.

Broadband Access Systems

Fixed-line broadband equipment benefits from the FPGA’s ability to implement custom signal processing and protocol handling capabilities.

Configuration and Programming

Multiple Configuration Modes

The XC2S200E-6FT256Q supports various configuration methods:

  • Master Serial Mode (from external PROM)
  • Slave Serial Mode
  • Slave Parallel Mode
  • Boundary Scan (JTAG) Mode

In-System Programmability

Unlimited reprogrammability allows field upgrades and design modifications without replacing hardware, dramatically reducing development time and deployment costs compared to traditional ASIC solutions.

Configuration Memory Solutions

Xilinx Platform Flash in-system programmable configuration PROMs provide low-cost, reliable configuration storage with the ability to update firmware in deployed systems.

Design Tools and Development Support

Software Compatibility

The XC2S200E-6FT256Q is supported by Xilinx ISE Design Suite, providing comprehensive tools for:

  • HDL synthesis and implementation
  • Timing analysis and optimization
  • Power estimation
  • Configuration generation
  • Device programming

Design Entry Options

Designers can use multiple entry methods including VHDL, Verilog HDL, schematic capture, and system-level design tools, allowing teams to use their preferred design methodologies.

Advantages Over Traditional ASICs

Cost-Effective Solution

The XC2S200E-6FT256Q eliminates the high initial costs associated with mask-programmed ASICs, including NRE (Non-Recurring Engineering) charges and minimum order quantities.

Rapid Development Cycles

FPGA-based designs can be prototyped, tested, and deployed in weeks rather than the months required for ASIC development, accelerating time-to-market significantly.

Design Flexibility

Unlike fixed ASICs, the reprogrammable nature of this FPGA allows continuous improvement and feature additions even after product deployment.

Risk Mitigation

Field programmability eliminates the inherent risks of ASIC development, including design errors that require expensive mask revisions.

Power Management and Thermal Considerations

Low-Voltage Operation

Operating at 1.8V core voltage, the XC2S200E-6FT256Q offers reduced power consumption compared to older FPGA generations while maintaining high performance.

Power Optimization

Multiple power-saving features allow designers to optimize power consumption based on application requirements, including clock gating and selective block activation.

Compatibility and Migration Path

Pin Compatibility

The FT256 package provides a standardized footprint that may allow migration between different Spartan-IIE family members, subject to specific design requirements and pin assignments.

Family Scalability

The Spartan-IIE family offers devices ranging from 50,000 to 600,000 system gates, providing scalability options as design requirements evolve.

Quality and Reliability Standards

RoHS Compliance

The XC2S200E-6FT256Q is available in RoHS-compliant versions, meeting environmental regulations for lead-free manufacturing.

Qualification Testing

Xilinx FPGAs undergo rigorous qualification testing including temperature cycling, humidity testing, and long-term reliability assessment.

Ordering Information and Availability

Part Number Breakdown

XC2S200E-6FT256Q decodes as:

  • XC2S = Spartan-II family prefix
  • 200E = 200K gates, Spartan-IIE variant
  • 6 = Speed grade (commercial temperature)
  • FT256 = 256-pin Fine-Pitch BGA package
  • Q = Quality/qualification level

Package Variants

The XC2S200E is available in multiple package options including PQ208 (Plastic Quad Flat Pack) and FG456 (Fine-Pitch BGA) for different board space and I/O requirements.

Technical Support and Resources

Documentation

Comprehensive technical documentation includes detailed datasheets, application notes, user guides, and reference designs available through Xilinx support channels.

Development Boards

Various evaluation and development boards support Spartan-IIE FPGAs, enabling rapid prototyping and design validation.

Comparison with Similar FPGAs

Within Spartan-IIE Family

Device System Gates Logic Cells Max I/O
XC2S100E 100,000 2,400 202
XC2S200E 200,000 5,292 289
XC2S300E 300,000 6,912 329
XC2S400E 400,000 10,800 410

The XC2S200E-6FT256Q offers an excellent balance of resources and I/O capability for mid-range applications.

Implementation Best Practices

Timing Closure

The fast, predictable interconnect architecture ensures that timing constraints can be met consistently across design iterations, reducing the time required for timing closure.

Resource Utilization

Efficient use of CLBs, block RAM, and distributed RAM allows designers to maximize functionality within the available device resources.

I/O Planning

With 289 available user I/O pins in the FT256 package, careful I/O planning ensures optimal signal integrity and compatibility with external components.

Frequently Asked Questions

What makes the XC2S200E-6FT256Q suitable for commercial applications?

The -6 speed grade and 0°C to +85°C temperature range make this device ideal for commercial and industrial applications where extended temperature operation is not required, providing cost savings compared to military-grade parts.

Can I upgrade my design after deployment?

Yes, the unlimited reprogrammability of the XC2S200E-6FT256Q allows field upgrades through in-system programming, enabling bug fixes, feature additions, and performance optimizations without hardware changes.

What development tools are required?

Xilinx ISE Design Suite provides all necessary tools for design entry, synthesis, implementation, and device programming. Third-party tools are also supported through standard interfaces.

Conclusion

The XC2S200E-6FT256Q represents an excellent choice for designers requiring a high-performance, cost-effective FPGA solution. With 200,000 system gates, 357 MHz operation, and comprehensive I/O capabilities in a compact 256-pin FTBGA package, this device delivers the flexibility and performance needed for modern digital designs. Whether developing industrial control systems, communications equipment, or consumer electronics, the XC2S200E-6FT256Q provides the resources, reliability, and reprogrammability essential for successful product deployment.

For designers seeking a proven FPGA platform with strong vendor support, extensive development tools, and a clear migration path within the Spartan family, the XC2S200E-6FT256Q stands as a compelling solution that balances capability with cost-effectiveness.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.