Product Overview: XC2S200E-6FT256I FPGA Specifications
The XC2S200E-6FT256I represents a powerful solution in the Xilinx FPGA Spartan-IIE family, delivering exceptional performance for complex programmable logic applications. This field-programmable gate array combines high-density logic resources with cost-effective design flexibility, making it an ideal choice for embedded systems, digital signal processing, and communication applications.
Key Features of XC2S200E-6FT256I
The XC2S200E-6FT256I FPGA offers robust capabilities for engineers and designers seeking reliable programmable logic solutions:
- 200,000 system gates for complex digital designs
- 5,292 logic cells providing extensive design flexibility
- 357 MHz maximum operating frequency for high-speed applications
- 0.15-micron CMOS technology ensuring efficient power consumption
- 1.8V core voltage for low-power operation
- 256-pin FTBGA package (Fine-Pitch Ball Grid Array) for compact board designs
Technical Specifications Table
| Specification |
Details |
| Part Number |
XC2S200E-6FT256I |
| Manufacturer |
Xilinx (now AMD) |
| Product Family |
Spartan-IIE |
| System Gates |
200K (200,000) |
| Logic Cells |
5,292 |
| Configurable Logic Blocks (CLBs) |
864 |
| Maximum Frequency |
357 MHz |
| Process Technology |
0.15μm CMOS |
| Core Voltage (VCCINT) |
1.8V |
| I/O Voltage (VCCIO) |
1.8V/2.5V/3.3V |
| Package Type |
256-Pin FTBGA |
| Operating Temperature |
Industrial (-40°C to +100°C) |
| Speed Grade |
-6 (Standard Performance) |
Package and Pin Configuration
| Package Details |
Specifications |
| Package Style |
FTBGA (Fine-Pitch Ball Grid Array) |
| Total Pins |
256 |
| User I/O Pins |
172 |
| Package Dimensions |
17mm × 17mm × 1.27mm |
| Ball Pitch |
1.0mm |
| RoHS Compliant |
Yes |
Architecture and Performance Capabilities
Configurable Logic Block Architecture
The XC2S200E-6FT256I features a sophisticated CLB architecture that enables designers to implement complex digital functions efficiently. Each CLB contains multiple look-up tables (LUTs), flip-flops, and multiplexers that can be configured to perform various logic operations, arithmetic functions, and data storage tasks.
Memory Resources
This FPGA includes distributed RAM and dedicated block RAM resources, providing flexible memory solutions for data buffering, lookup tables, and temporary storage within your digital designs. The distributed SelectRAM resources can be configured as single or dual-port RAM, supporting versatile memory architectures.
Digital Clock Manager (DCM)
The integrated Digital Clock Manager provides advanced clock manipulation capabilities including frequency synthesis, phase shifting, and clock distribution. This feature enables precise timing control crucial for high-performance digital systems and multi-clock domain designs.
Application Use Cases
Digital Signal Processing Applications
The XC2S200E-6FT256I excels in implementing DSP algorithms with its high-speed logic resources and dedicated multiplier support. Engineers leverage this FPGA for:
- Real-time digital filtering and signal conditioning
- Audio and video processing systems
- Wireless communication baseband processing
- Image enhancement and transformation algorithms
Embedded System Development
This Spartan-IIE FPGA serves as an excellent platform for embedded control applications requiring:
- Custom peripheral interfaces and controllers
- Protocol bridging and data format conversion
- Motor control and industrial automation
- Real-time data acquisition systems
Communication Systems Implementation
The high-speed I/O capabilities and flexible logic resources make the XC2S200E-6FT256I suitable for:
- Network packet processing and routing
- Data encoding and decoding circuits
- Communication protocol implementation
- High-speed serial data interfaces
Prototyping and Development Boards
Design engineers frequently select this FPGA for rapid prototyping because it offers an optimal balance between logic capacity, performance, and cost-effectiveness for proof-of-concept implementations.
Design Tools and Software Support
Xilinx ISE Design Suite Compatibility
The XC2S200E-6FT256I is fully supported by Xilinx ISE (Integrated Software Environment) Design Suite, providing comprehensive tools for:
- HDL synthesis and implementation (VHDL and Verilog)
- Timing analysis and constraint management
- Device programming and configuration
- Simulation and verification workflows
Programming and Configuration Options
This FPGA supports multiple configuration modes including:
- JTAG boundary-scan programming
- Master Serial configuration mode
- Slave Serial configuration mode
- SelectMAP parallel configuration
Power Consumption and Thermal Considerations
Power Requirements
| Power Parameter |
Typical Value |
Maximum Value |
| Core Supply (VCCINT) |
1.8V ± 5% |
1.89V |
| I/O Supply (VCCIO) |
1.8V/2.5V/3.3V |
– |
| Quiescent Current |
10-20 mA |
50 mA |
| Dynamic Power |
Design-dependent |
Varies by utilization |
Thermal Management
The 256-pin FTBGA package provides excellent thermal dissipation characteristics. Designers should consider:
- Adequate PCB copper planes for heat spreading
- Proper airflow in enclosed systems
- Thermal simulation for high-utilization designs
- Junction temperature monitoring for reliability
Quality and Reliability Standards
The XC2S200E-6FT256I meets stringent industrial quality standards:
- RoHS compliant for environmental safety
- Industrial temperature range operation (-40°C to +100°C)
- High reliability suitable for mission-critical applications
- Extended lifecycle support from AMD Xilinx
Comparison with Similar FPGAs
XC2S200E vs Other Spartan-IIE Devices
| Feature |
XC2S100E |
XC2S200E |
XC2S300E |
| System Gates |
100K |
200K |
300K |
| Logic Cells |
2,700 |
5,292 |
6,912 |
| CLBs |
432 |
864 |
1,104 |
| Max Frequency |
357 MHz |
357 MHz |
357 MHz |
The XC2S200E-6FT256I offers an optimal middle-ground solution, providing sufficient logic resources for moderately complex designs while maintaining cost efficiency.
Purchasing and Availability
Authorized Distributors
The XC2S200E-6FT256I is available through major electronic component distributors including Digi-Key, Mouser Electronics, Newark, and Arrow Electronics. When purchasing, verify:
- Authentic manufacturer markings
- Date codes for inventory freshness
- Anti-static packaging integrity
- Distributor warranty coverage
Packaging Options
Available in standard quantities:
- Tape and reel for automated assembly
- Trays for manual placement
- Individual units for prototyping
Design Resources and Documentation
Essential Documentation
Engineers should reference these key documents when working with the XC2S200E-6FT256I:
- Spartan-IIE Family Data Sheet
- Spartan-IIE FPGA User Guide
- Package mechanical drawings
- PCB design guidelines for FTBGA packages
- Xilinx ISE software user manuals
Development Support
AMD Xilinx provides comprehensive support resources:
- Technical forum communities
- Application notes and reference designs
- Training videos and webinars
- FAE (Field Application Engineer) assistance
PCB Design Considerations
Layout Guidelines
When designing printed circuit boards for the XC2S200E-6FT256I:
- Use controlled impedance traces for high-speed signals
- Implement proper power plane decoupling
- Follow recommended via structures for BGA packages
- Maintain adequate clearances for thermal relief
- Consider signal integrity for critical paths
Recommended Decoupling Capacitors
| Capacitor Type |
Quantity |
Placement |
| 0.1μF ceramic |
8-12 |
Near power pins |
| 0.01μF ceramic |
4-6 |
High-frequency bypass |
| 10μF tantalum |
2-4 |
Bulk capacitance |
Environmental Compliance and Regulations
The XC2S200E-6FT256I adheres to international environmental and safety standards:
- RoHS Directive 2011/65/EU compliant
- REACH regulation compatible
- Halogen-free options available
- Conflict minerals policy adherence
Frequently Asked Questions
Q: Can the XC2S200E-6FT256I be reprogrammed multiple times?
A: Yes, this FPGA is SRAM-based and can be reconfigured unlimited times, making it ideal for iterative development and field updates.
Q: What development tools are required for programming?
A: You’ll need Xilinx ISE Design Suite (available as free WebPACK edition), a JTAG programmer cable, and optionally, simulation tools like ModelSim.
Q: Is this FPGA suitable for battery-powered applications?
A: While possible, the 1.8V core and relatively high gate count mean power consumption should be carefully analyzed. Consider the XC2S50E or XC2S100E for ultra-low-power applications.
Q: What is the difference between -6 and -7 speed grades?
A: The -6 speed grade offers standard performance at 357 MHz maximum, while -7 grade provides enhanced timing margins with slightly higher maximum frequencies. Choose based on your timing requirements and budget.
Q: Does this device support partial reconfiguration?
A: Spartan-IIE devices do not support partial reconfiguration. For that capability, consider newer Xilinx families like Virtex or later Spartan generations.
Conclusion: Why Choose XC2S200E-6FT256I
The XC2S200E-6FT256I stands as a proven, reliable FPGA solution for engineers requiring a balance of logic capacity, performance, and cost-effectiveness. Its 200K system gates, industrial temperature operation, and comprehensive tool support make it suitable for diverse applications from industrial control systems to communication infrastructure.
Whether you’re developing embedded systems, implementing DSP algorithms, or creating custom digital logic, the XC2S200E-6FT256I provides the resources and flexibility needed for successful project completion. Its mature platform ensures long-term availability and extensive documentation, reducing development risk and accelerating time-to-market.
For designers seeking a dependable FPGA with proven reliability in demanding environments, the XC2S200E-6FT256I remains an excellent choice in the Xilinx FPGA portfolio.
