Complete Technical Guide and Product Specifications

The XC2S200E-6FG456C represents a powerful and cost-effective solution in AMD’s (formerly Xilinx) Spartan-IIE FPGA family. This field-programmable gate array delivers exceptional performance with 200,000 system gates and 5,292 logic cells, making it an ideal choice for digital signal processing, industrial control systems, and embedded applications.

Product Overview: XC2S200E-6FG456C FPGA

The XC2S200E-6FG456C is a high-density FPGA that combines advanced 0.15-micron technology with proven Virtex-E architecture. Designed for engineers who need reliable, reprogrammable logic solutions, this FPGA offers unlimited in-system reprogrammability without the high costs and lengthy development cycles associated with traditional ASICs.

Key Product Highlights

• Logic Capacity: 200,000 system gates with 5,292 configurable logic cells
• Advanced Package: 456-pin Fine-Pitch Ball Grid Array (FBGA)
• Speed Grade: -6 performance grade offering 357 MHz operation
• Manufacturing Process: 0.15-micron CMOS technology
• Operating Voltage: 1.8V core supply (1.71V ~ 1.89V range)

Technical Specifications Table

Architecture and Features

Core Architecture

The XC2S200E-6FG456C features a streamlined architecture based on the proven Virtex-E platform, delivering professional-grade performance at an affordable price point.

Configurable Logic Blocks (CLBs)

• 28 × 42 CLB array matrix
• 1,176 total CLBs for flexible logic implementation
• Each CLB contains two slices with multiple look-up tables (LUTs)

Memory Architecture

• Block RAM: 56 Kbits of true dual-port synchronous RAM
• Distributed RAM: 75,264 bits using LUT-based memory
• Configurable as single-port or dual-port memory

Advanced I/O Capabilities

The XC2S200E-6FG456C provides exceptional I/O flexibility with 289 user-configurable I/O pins:

• 19 Selectable I/O Standards including LVTTL, LVCMOS, PCI, GTL, and more
• Programmable drive strength and slew rate control
• Input delay compensation using Digital Delay-Locked Loops (DLLs)
• Individual tri-state control for each I/O

Clock Management System

Digital Delay-Locked Loops (DLLs)

The XC2S200E-6FG456C incorporates four DLL circuits that provide:

• Clock de-skewing and phase shifting
• Clock frequency synthesis and division
• Precise timing control for high-speed interfaces
• System clock rates exceeding 200 MHz

Performance Characteristics Table

Application Areas and Use Cases

Industrial Applications

The XC2S200E-6FG456C excels in industrial environments:

• Industrial Automation: PLC interfaces, motor control systems
• Test and Measurement: High-speed data acquisition systems
• Machine Vision: Real-time image processing pipelines
• Process Control: Sensor interfaces and control loops

Communication Systems

Ideal for various communication protocols:

• Network packet processing
• Protocol conversion bridges
• Telecommunications infrastructure
• Data encryption/decryption engines

Consumer Electronics

Popular in consumer product development:

• Gaming console logic
• Display controllers (LCD/LED drivers)
• Audio/video processing
• Smart home automation systems

Automotive Electronics

Suitable for automotive applications:

• Body electronics and lighting control
• Dashboard instrument clusters
• Advanced driver assistance systems (ADAS) prototyping
• Vehicle diagnostics interfaces

Package Information: 456-FBGA

Package Specifications

Advantages of FBGA Package

1. High I/O Density: Maximum pins in minimal footprint
2. Signal Integrity: Short bond wire lengths reduce inductance
3. Thermal Performance: Direct heat path to PCB
4. Reliability: Superior mechanical strength
5. Cost-Effective: Standard PCB manufacturing process

Design Tools and Programming

Development Environment

The XC2S200E-6FG456C is supported by comprehensive Xilinx FPGA development tools:

ISE Design Suite

• Synthesis and implementation tools
• Timing analysis and optimization
• Simulation capabilities
• Constraint management

Programming Options

• JTAG boundary-scan configuration
• Serial and parallel configuration modes
• Platform Flash configuration PROM support
• In-system programming capability

Memory Configuration Details

Block RAM Features

The 56 Kbits of block RAM provides:

• True dual-port operation
• Configurable width and depth ratios
• Synchronous read and write operations
• Optional output registers for pipelining
• Ideal for FIFO buffers, packet buffers, and data caches

Distributed RAM Utilization

75,264 bits of distributed RAM offers:

• Fast single-cycle access
• Flexible distributed throughout the FPGA fabric
• Configurable as single or dual-port
• Perfect for small lookup tables and state machines

Comparison with Similar Devices

Power Supply Requirements

Voltage Specifications

Power Management Best Practices

1. Use proper decoupling capacitors (0.1μF and 10μF)
2. Implement separate power planes for different voltage rails
3. Monitor current consumption during design verification
4. Consider clock gating for unused logic blocks
5. Utilize low-power I/O standards when applicable

Reliability and Quality Standards

Manufacturing Standards

• RoHS Compliance: Lead-free manufacturing process
• Quality Grade: Commercial temperature range (0°C to 85°C)
• Product Status: Legacy product (obsolete but still available)
• Reliability Testing: Comprehensive qualification testing

Environmental Specifications Table

Design Considerations and Best Practices

PCB Layout Guidelines

Critical Design Elements:

• Maintain controlled impedance for high-speed signals
• Implement proper ground planes for signal integrity
• Use adequate via stitching around BGA footprint
• Follow AMD/Xilinx reference designs for power distribution
• Ensure thermal relief for improved heat dissipation

Clock Distribution Strategy

1. Use dedicated clock inputs for global clocks
2. Implement DLLs to eliminate clock distribution delays
3. Minimize clock skew across device regions
4. Consider clock domains for multi-clock designs
5. Follow synchronous design practices to avoid metastability

Configuration and Programming Methods

Configuration Modes Supported

Configuration Memory Options

• Platform Flash PROMs: Non-volatile configuration storage
• External Flash: SPI or parallel flash memory
• Processor-based: Configuration from microcontroller
• MultiBoot: Support for configuration fallback

Thermal Management Solutions

Cooling Requirements

The XC2S200E-6FG456C thermal characteristics:

• Junction to Ambient (θJA): Package dependent
• Junction to Case (θJC): Efficient heat transfer
• Recommended cooling: Natural convection to forced air
• Thermal monitoring: Optional internal temperature sensor

Heat Sink Recommendations

For demanding applications:

1. Calculate total power dissipation
2. Select appropriate heat sink based on airflow
3. Use thermal interface material (TIM)
4. Ensure adequate board-level heat spreading
5. Monitor junction temperature during operation

Ordering Information and Availability

Part Number Breakdown

XC2S200E-6FG456C nomenclature:

• XC2S: Spartan-IIE family identifier
• 200E: 200,000 gate count, “E” designates Enhanced version
• 6: Speed grade (-6 performance level)
• FG456: Fine-pitch BGA, 456 balls
• C: Commercial temperature grade

Package Availability

Support and Resources

Documentation and Downloads

Essential resources for XC2S200E-6FG456C development:

• Data Sheet: Complete electrical and timing specifications
• User Guide: Architecture and design guidelines
• Application Notes: Design examples and solutions
• PCB Footprints: Standard CAD library files
• Evaluation Boards: Development platforms

Technical Support Channels

• AMD/Xilinx technical support portal
• Community forums and user groups
• Local field application engineers (FAEs)
• Authorized distribution partners
• Online training and tutorials

Advantages Over ASIC Solutions

Why Choose FPGA Technology?

The XC2S200E-6FG456C offers significant advantages:

Flexibility Benefits:

• No NRE Costs: Eliminate expensive mask sets
• Rapid Prototyping: Implement designs in days, not months
• Field Updates: Reprogram without hardware changes
• Design Iterations: Test multiple architectures quickly

Risk Mitigation:

• No Minimum Orders: Start with single units
• Proven Silicon: Eliminate manufacturing risks
• Shorter Time-to-Market: Accelerate product launches
• Future-Proof: Adapt to changing specifications

Frequently Asked Questions

What makes the XC2S200E-6FG456C suitable for my application?

This FPGA combines 200,000 gates of logic capacity with flexible I/O options and cost-effective pricing, making it ideal for medium-complexity digital designs requiring reprogrammability and fast development cycles.

What development tools are required?

The XC2S200E-6FG456C requires Xilinx ISE Design Suite for synthesis, implementation, and programming. Free WebPACK versions are available for evaluation and smaller designs.

Is this device still in production?

While classified as obsolete by AMD/Xilinx, the XC2S200E-6FG456C remains available through authorized distributors and electronic component suppliers for legacy system support and maintenance.

What is the difference between -6 and -7 speed grades?

The -6 speed grade (this device) offers 357 MHz maximum frequency, while -7 speed grade provides slightly lower performance specifications. Higher speed grades (-6, -7) indicate faster performance characteristics.

Can I migrate designs from other FPGA families?

Yes, designs can be migrated from other Spartan family members or adapted from Virtex-E architecture. Pin compatibility varies by package, so review migration guides carefully.

Conclusion: Choosing the XC2S200E-6FG456C

The XC2S200E-6FG456C stands as a proven, reliable FPGA solution for engineers developing digital systems requiring moderate logic density, flexible I/O capabilities, and cost-effective implementation. With its Spartan-IIE architecture, 200,000-gate capacity, and comprehensive feature set, this FPGA delivers exceptional value for industrial automation, communications infrastructure, and embedded control applications.

Whether you’re replacing legacy ASICs, prototyping new designs, or implementing small to medium-scale digital systems, the XC2S200E-6FG456C offers the perfect balance of performance, features, and affordability. Its support for multiple I/O standards, integrated memory resources, and robust development tools makes it an excellent choice for experienced FPGA designers and those new to programmable logic design.

For more information about Xilinx FPGA solutions and technical support, explore comprehensive resources available through authorized AMD/Xilinx channels and electronic component distributors worldwide.