The XC2S200-6FGG999C is a powerful field-programmable gate array (FPGA) from Xilinx’s renowned Spartan-II family, designed to deliver exceptional performance for complex digital logic applications. This commercial-grade FPGA combines 200,000 system gates with advanced architectural features, making it an ideal solution for embedded systems, communications infrastructure, industrial automation, and digital signal processing applications.
Overview of XC2S200-6FGG999C Spartan-II FPGA
The XC2S200-6FGG999C represents a cost-effective alternative to traditional ASICs while providing the flexibility and programmability that modern electronic designs demand. Built on 0.18-micron process technology, this Xilinx FPGA delivers reliable performance up to 200 MHz with low power consumption and extensive I/O capabilities.
Key Features of XC2S200-6FGG999C
- 5,292 Logic Cells for complex digital implementations
- 200,000 System Gates (logic and RAM combined)
- 284 Maximum User I/O Pins for extensive connectivity
- 56K Block RAM for embedded memory applications
- 75,264 Distributed RAM Bits for distributed storage
- 999-Pin Fine-Pitch BGA Package (FGG999) with lead-free construction
- Speed Grade -6 optimized for high-performance applications
- Commercial Temperature Range (0°C to +85°C)
- 2.5V Core Voltage for energy-efficient operation
Technical Specifications Table
| Parameter |
Specification |
| Part Number |
XC2S200-6FGG999C |
| Family |
Spartan-II |
| Logic Cells |
5,292 |
| System Gates |
200,000 |
| CLB Array |
28 x 42 (1,176 total CLBs) |
| Maximum User I/O |
284 |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits |
| Package Type |
999-Ball Fine-Pitch BGA (FGG999) |
| Speed Grade |
-6 (Fastest) |
| Operating Voltage |
2.5V (Core) |
| Temperature Range |
Commercial (0°C to +85°C) |
| Technology Node |
0.18μm |
| Maximum Frequency |
200 MHz |
XC2S200-6FGG999C Architecture and Design Capabilities
Configurable Logic Blocks (CLBs)
The XC2S200-6FGG999C features a robust 28 x 42 array of Configurable Logic Blocks, totaling 1,176 CLBs. Each CLB contains four slices, with each slice incorporating two logic cells (LCs). This architecture provides designers with maximum flexibility for implementing complex combinational and sequential logic functions.
Memory Resources in XC2S200-6FGG999C
Block RAM Configuration
| Resource Type |
Capacity |
Configuration |
| Block RAM |
56 Kbits |
Dual-port synchronous RAM |
| Distributed RAM |
75,264 bits |
Single/dual-port asynchronous |
| RAM Blocks |
Multiple |
4Kbit blocks |
The XC2S200-6FGG999C’s dual-column block RAM architecture enables efficient implementation of FIFOs, buffers, and embedded memory arrays. The distributed RAM utilizes look-up tables (LUTs) within CLBs for flexible, low-latency memory access.
Input/Output Architecture
With 284 maximum user I/O pins, the XC2S200-6FGG999C provides extensive connectivity options for interfacing with external devices and systems. Each I/O block (IOB) supports multiple I/O standards including:
- LVTTL (Low-Voltage TTL)
- LVCMOS (2.5V, 3.3V)
- PCI (33MHz, 66MHz)
- GTL+ (Gunning Transceiver Logic Plus)
- HSTL (High-Speed Transceiver Logic)
Performance Characteristics
Speed Grade -6 Advantages
The XC2S200-6FGG999C’s speed grade -6 designation indicates the fastest available performance tier in the Spartan-II family. This speed grade is exclusively available in the commercial temperature range and delivers:
- Minimized propagation delays
- Maximum operating frequencies up to 200 MHz
- Optimized routing for time-critical paths
- Superior performance for high-speed digital applications
Clock Management Features
| Feature |
Description |
| Delay-Locked Loops (DLLs) |
4 DLLs (one per corner) |
| Clock Distribution |
Low-skew global clock networks |
| Clock Frequency |
Up to 200 MHz system performance |
| Clock Multiplication/Division |
Supported via DLL circuitry |
Package Information: FGG999 Ball Grid Array
XC2S200-6FGG999C Package Specifications
| Package Parameter |
Value |
| Package Type |
Fine-Pitch Ball Grid Array |
| Ball Count |
999 balls |
| Lead-Free |
Yes (indicated by “G” in part number) |
| RoHS Compliant |
Yes |
| Pitch |
1.0mm (Fine Pitch) |
| Thermal Performance |
Enhanced heat dissipation |
| Mounting |
Surface mount (SMT) |
The FGG999 package offers superior thermal characteristics and high I/O density, making the XC2S200-6FGG999C suitable for space-constrained applications requiring extensive connectivity.
Applications for XC2S200-6FGG999C
Industrial and Embedded Systems
The XC2S200-6FGG999C excels in industrial control applications where programmability, reliability, and performance are critical:
- Motor control systems
- Industrial automation controllers
- Programmable logic controllers (PLCs)
- Machine vision systems
- Robotics control interfaces
Communications Infrastructure
With its high-speed performance and extensive I/O capabilities, the XC2S200-6FGG999C is ideal for:
- Network switching and routing
- Protocol conversion
- Data encryption/decryption
- Telecommunications equipment
- Wireless base station controllers
Digital Signal Processing (DSP)
The combination of block RAM, distributed memory, and high-speed logic makes this FPGA suitable for:
- Digital filtering applications
- Image processing algorithms
- Audio signal processing
- Video processing pipelines
- Spectral analysis systems
Consumer Electronics
- Set-top boxes
- Gaming consoles
- Digital cameras
- Portable media players
- Smart home devices
Design Tools and Development Support
Compatible Development Software
| Tool |
Purpose |
| ISE Design Suite |
Complete FPGA design environment |
| XST |
Xilinx Synthesis Technology |
| Timing Analyzer |
Static timing analysis |
| CORE Generator |
Pre-verified IP cores |
| ChipScope Pro |
On-chip debugging |
Programming and Configuration
The XC2S200-6FGG999C supports multiple configuration modes:
- Master Serial Mode – FPGA controls configuration PROM
- Slave Serial Mode – External controller manages configuration
- JTAG Boundary Scan – IEEE 1149.1 compliant for programming and testing
- SelectMAP Mode – Parallel configuration for faster programming
Comparing XC2S200-6FGG999C with Other Spartan-II Devices
Spartan-II Family Comparison
| Device |
Logic Cells |
System Gates |
Max I/O |
Block RAM |
Package Options |
| XC2S50 |
1,728 |
50,000 |
176 |
32K |
PQ208, FG256 |
| XC2S100 |
2,700 |
100,000 |
176 |
40K |
PQ208, FG256, FG456 |
| XC2S150 |
3,888 |
150,000 |
260 |
48K |
FG256, FG456 |
| XC2S200 |
5,292 |
200,000 |
284 |
56K |
FG256, FG456, FG999 |
The XC2S200-6FGG999C represents the largest device in the standard Spartan-II family, offering maximum logic resources and the highest I/O count.
Power Consumption and Thermal Management
Power Supply Requirements
| Power Rail |
Voltage |
Purpose |
| VCCINT |
2.5V ±5% |
Core logic power |
| VCCO |
1.8V – 3.3V |
I/O power (bank-specific) |
| VCCAUX |
2.5V or 3.3V |
Auxiliary circuits (DLLs) |
Thermal Considerations for XC2S200-6FGG999C
The fine-pitch BGA package provides excellent thermal dissipation characteristics. Typical power consumption varies based on:
- Logic utilization percentage
- Operating frequency
- I/O switching activity
- RAM usage patterns
Quality and Reliability
Manufacturing Standards
- RoHS Compliant – Lead-free construction (indicated by “G”)
- Commercial Grade – Tested for 0°C to +85°C operation
- Quality Assurance – Comprehensive testing protocols
- Moisture Sensitivity Level – MSL 3 per JEDEC standards
Longevity and Lifecycle
The Spartan-II family has proven reliability in field deployments across diverse applications. While newer FPGA families have been introduced, the XC2S200-6FGG999C continues to serve in legacy systems and cost-sensitive applications.
Getting Started with XC2S200-6FGG999C
Development Kit Recommendations
For prototyping and evaluation, consider development boards featuring:
- JTAG programming interface
- Onboard power regulation
- Clock oscillators
- LED and switch interfaces
- Expansion headers for custom circuits
Design Considerations
- Power Supply Design – Ensure adequate current capacity for VCCINT rail
- Decoupling – Place 0.1μF and 10μF capacitors near power pins
- Clock Distribution – Utilize global clock networks for optimal performance
- Thermal Management – Implement appropriate heatsinking for high-utilization designs
- Signal Integrity – Follow PCB layout guidelines for high-speed signals
Procurement and Availability
Ordering Information
The complete part number XC2S200-6FGG999C breaks down as:
- XC2S200 – Device family and gate count
- -6 – Speed grade (fastest)
- FG – Fine-pitch BGA package
- G – Lead-free (RoHS compliant)
- 999 – Ball count
- C – Commercial temperature range
Supply Chain Considerations
When sourcing the XC2S200-6FGG999C, verify:
- Authentic Xilinx/AMD manufacturing
- Proper moisture barrier packaging
- Date code for inventory management
- Anti-counterfeit measures
- Authorized distributor channels
Conclusion: Why Choose XC2S200-6FGG999C
The XC2S200-6FGG999C delivers an exceptional balance of performance, features, and value for demanding FPGA applications. With its 200,000 system gates, 284 I/O pins, and speed grade -6 performance, this Spartan-II device provides designers with a proven platform for implementing complex digital logic.
Whether you’re developing industrial control systems, communications infrastructure, or embedded processing applications, the XC2S200-6FGG999C offers the resources, reliability, and flexibility needed for successful product deployment. Its fine-pitch BGA package maximizes board space efficiency while delivering superior thermal performance for demanding operating environments.
For engineers seeking a cost-effective FPGA solution without compromising on capability, the XC2S200-6FGG999C Spartan-II FPGA remains a compelling choice backed by extensive development tool support and a proven track record in the field.
