Overview of XC2S200-6FGG997C Field Programmable Gate Array
The XC2S200-6FGG997C is a powerful field-programmable gate array (FPGA) from Xilinx’s renowned Spartan-II family, engineered to deliver exceptional performance for demanding digital design applications. This industrial-grade FPGA combines 200,000 system gates with advanced programmable logic capabilities, making it the ideal choice for engineers seeking cost-effective, high-performance solutions in communications, industrial control, and embedded systems.
Key Technical Specifications
Core FPGA Performance Characteristics
| Specification |
Value |
Details |
| System Gates |
200,000 |
Logic and RAM capacity |
| Logic Cells |
5,292 |
Configurable logic cells |
| CLB Array |
28 x 42 (1,176 total) |
Configurable Logic Blocks |
| Speed Grade |
-6 |
Commercial temperature range |
| Maximum User I/O |
284 pins |
Excluding global clock pins |
| Core Voltage |
2.5V |
VCCINT supply |
| Technology Node |
0.18µm |
Advanced CMOS process |
| Maximum Frequency |
200+ MHz |
System performance |
Memory Architecture
| Memory Type |
Capacity |
Configuration |
| Distributed RAM |
75,264 bits |
Flexible memory implementation |
| Block RAM |
56K bits |
Dual-port synchronous RAM |
| Block RAM Blocks |
14 blocks |
4K bits per block |
| RAM Organization |
Dual-ported |
Independent control signals |
XC2S200-6FGG997C Advanced Features
Programmable Logic Capabilities
The Xilinx FPGA architecture in the XC2S200 series delivers unmatched flexibility for digital circuit implementation. This device features:
Configurable Logic Blocks (CLBs)
- 28 x 42 array configuration providing 1,176 total CLBs
- Dual 4-input function generators per logic cell
- Fast carry logic for arithmetic operations
- Distributed RAM capability within each CLB
- Built-in multiplexers for efficient routing
Input/Output Architecture
- 284 maximum user I/O pins (package dependent)
- Multiple I/O standards support including LVTTL, LVCMOS, SSTL, HSTL
- Programmable drive strength for signal integrity
- Individual I/O registers for high-speed interfaces
- Hot-swappable capability for system reliability
Clock Management System
- 4 Delay-Locked Loops (DLLs) positioned at chip corners
- Clock deskewing for precise timing control
- Clock multiplication/division for frequency synthesis
- Low-skew clock distribution network
- 4 global clock buffers for primary clocking
Package Information and Pin Configuration
FGG Package Specifications
| Package Feature |
Specification |
| Package Type |
Fine-pitch Ball Grid Array (FBGA) |
| Ball Pitch |
Fine-pitch spacing for high density |
| Temperature Range |
Commercial (0°C to +85°C) |
| RoHS Compliance |
Lead-free available (FGG package) |
| Mounting Style |
Surface mount technology |
Applications and Use Cases
Industrial Control Systems
The XC2S200-6FGG997C excels in industrial automation applications:
- Motor control and drive systems
- PLC (Programmable Logic Controller) implementations
- Factory automation interfaces
- Real-time process monitoring
- Sensor data acquisition and processing
Communication Systems
Ideal for telecommunications infrastructure:
- Protocol bridging and conversion
- Data packet processing
- Signal encoding/decoding
- Baseband processing
- Interface controllers
Embedded System Design
Perfect for embedded computing applications:
- Custom peripheral controllers
- System-on-Chip (SoC) prototypes
- Hardware acceleration engines
- Real-time data processing
- ASIC replacement solutions
Consumer Electronics
Versatile implementation for consumer products:
- Digital signal processing (DSP)
- Video/audio processing
- Display controllers
- Gaming console logic
- Set-top box functionality
Design Tools and Development Support
ISE Design Suite Compatibility
| Tool Category |
Features |
| Synthesis |
XST (Xilinx Synthesis Technology) |
| Implementation |
MAP, PAR, TRACE timing analysis |
| Simulation |
ISim integrated simulator |
| Programming |
iMPACT configuration tool |
| Debugging |
ChipScope Pro analyzer |
Configuration Options
- JTAG boundary-scan for testing and programming
- Master Serial mode for standalone operation
- Slave Serial for processor-based configuration
- SelectMAP parallel configuration interface
- Configuration memory support via SPI flash
Performance Optimization
Speed Grade Analysis
| Performance Metric |
-6 Speed Grade |
| Maximum Toggle Rate |
200+ MHz |
| Logic Delay |
Optimized for commercial applications |
| Routing Delay |
Minimized through advanced architecture |
| Setup/Hold Times |
Industry-leading specifications |
| Clock-to-Out |
Fast I/O response times |
Comparison with Alternative Devices
XC2S200 Family Positioning
| Device |
System Gates |
Logic Cells |
CLBs |
Max I/O |
Best For |
| XC2S100 |
100,000 |
2,700 |
600 |
176 |
Entry-level designs |
| XC2S150 |
150,000 |
3,888 |
864 |
260 |
Mid-range applications |
| XC2S200 |
200,000 |
5,292 |
1,176 |
284 |
High-density projects |
Power Management and Thermal Considerations
Power Supply Requirements
| Supply Rail |
Voltage |
Function |
| VCCINT |
2.5V ±5% |
Core logic power |
| VCCO |
1.5V to 3.3V |
I/O bank power (by bank) |
| VCCAUX |
2.5V or 3.3V |
Auxiliary circuits (DLLs, configuration) |
Thermal Management
- Junction temperature monitoring recommended
- Proper PCB layout for heat dissipation
- Decoupling capacitors strategically placed
- Thermal vias for improved cooling
- Power consumption calculation tools available
PCB Design Guidelines
Layout Recommendations
- Power distribution network with low-impedance paths
- Controlled impedance for high-speed signals
- Layer stackup optimized for signal integrity
- Ground planes for EMI reduction
- Bypass capacitors at every power pin
Signal Integrity Considerations
- Trace length matching for differential pairs
- Termination schemes for transmission lines
- Crosstalk minimization through spacing
- Via optimization for high-speed signals
Ordering Information and Availability
Part Number Decoding
XC2S200-6FGG997C breaks down as:
- XC2S = Spartan-II family
- 200 = 200K system gates
- 6 = Speed grade (-6 commercial)
- FGG = Fine-pitch BGA package (lead-free)
- 997 = Pin count designation
- C = Commercial temperature range
Procurement Channels
- Authorized Xilinx distributors worldwide
- Electronic component suppliers (Digi-Key, Mouser, Arrow)
- Direct from AMD-Xilinx for volume orders
- Certified resellers for industrial applications
Technical Support and Resources
Documentation Suite
- Complete datasheet with electrical specifications
- User guide for architectural details
- Application notes for design examples
- IBIS models for signal integrity simulation
- Package drawings for mechanical design
Development Resources
- Reference designs for common applications
- IP cores for accelerated development
- Training modules and webinars
- Community forums for peer support
- Technical application engineers available
Quality and Reliability
Manufacturing Standards
- Automotive-grade options available
- Extended temperature variants for harsh environments
- Military-grade screening available
- Long-term availability commitment
- Quality management ISO certified
Testing and Validation
- 100% functional testing at manufacturing
- Burn-in for critical applications
- HTOL (High-Temperature Operating Life) testing
- ESD protection built-in
- Latch-up immunity guaranteed
Migration and Upgrade Path
Device Family Compatibility
Seamless migration within Spartan family:
- Pin compatibility with some package variants
- Software compatibility across Spartan-II devices
- Upgrade path to Spartan-3/6/7 generations
- Design reuse for faster time-to-market
Frequently Asked Questions
Q: What is the difference between FG and FGG packages?
A: The FGG designation indicates a lead-free (RoHS-compliant) version with a “Green” package, while FG is the standard leaded version.
Q: Can the XC2S200 replace ASIC designs?
A: Yes, the XC2S200 offers a cost-effective alternative to ASICs, eliminating NRE costs and providing field-upgrade capability.
Q: What configuration memory is recommended?
A: Xilinx XCF Platform Flash PROMs or standard SPI flash devices are commonly used for configuration storage.
Q: Is the -6 speed grade suitable for all applications?
A: The -6 speed grade is optimized for commercial applications. For maximum performance, consider -5 grade options.
Conclusion
The XC2S200-6FGG997C represents a proven, reliable FPGA solution for engineers requiring robust programmable logic capabilities. With its combination of 200,000 system gates, comprehensive I/O options, advanced clock management, and industrial-grade reliability, this device continues to serve as a foundation for innovative digital designs across multiple industries.
Whether you’re developing industrial control systems, communication infrastructure, or embedded computing solutions, the XC2S200 offers the flexibility, performance, and cost-effectiveness needed for successful product deployment. Backed by extensive design tools, comprehensive documentation, and global technical support, this Spartan-II FPGA delivers exceptional value for both prototype development and volume production.
