Overview of XC2S200-6FGG994C FPGA
The XC2S200-6FGG994C is a powerful field-programmable gate array (FPGA) from AMD Xilinx’s renowned Spartan-II family, engineered to deliver exceptional performance for complex digital applications. This high-density programmable logic device features 200,000 system gates and 5,292 logic cells, making it an ideal solution for telecommunications, industrial automation, consumer electronics, and embedded system designs.
As part of the Spartan-II series, the XC2S200-6FGG994C represents a cost-effective alternative to application-specific integrated circuits (ASICs), offering designers the flexibility to modify and upgrade their designs without hardware replacement. The -6 speed grade ensures optimal performance for high-speed digital applications requiring rapid signal processing.
Technical Specifications of XC2S200-6FGG994C
Core Performance Features
| Specification |
Details |
| Device Family |
Spartan-II FPGA |
| Part Number |
XC2S200-6FGG994C |
| System Gates |
200,000 gates |
| Logic Cells |
5,292 cells |
| CLB Array |
28 x 42 (1,176 total CLBs) |
| Maximum User I/O |
284 pins |
| Speed Grade |
-6 (Commercial temperature range) |
| Core Voltage |
2.5V |
| Process Technology |
0.18μm CMOS |
| Operating Frequency |
Up to 263 MHz |
Memory Architecture
| Memory Type |
Capacity |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits (56,320 bits) |
| Total On-Chip Memory |
131,584 bits |
Package Information
| Package Details |
Specification |
| Package Type |
Fine-Pitch Ball Grid Array (FBGA) |
| Total Pins |
994-pin configuration |
| Lead-Free Option |
Available (denoted by “G” in part number) |
| Temperature Range |
Commercial (0°C to +85°C) |
| Mounting Type |
Surface Mount Technology (SMT) |
Key Features of XC2S200-6FGG994C
Advanced Programmable Logic Architecture
The XC2S200-6FGG994C FPGA features a sophisticated architecture built around configurable logic blocks (CLBs) that provide maximum design flexibility. Each CLB contains look-up tables (LUTs), flip-flops, and multiplexers, enabling implementation of complex combinatorial and sequential logic functions.
High-Speed Signal Processing Capabilities
With an operating frequency reaching 263 MHz and -6 speed grade performance, this FPGA excels in applications requiring rapid data processing. The architecture supports multiple clock domains and includes four delay-locked loops (DLLs) positioned at each corner of the die for precise clock management and distribution.
Flexible I/O Configuration
The XC2S200-6FGG994C offers up to 284 user I/O pins, supporting various industry-standard interfaces including LVTTL, LVCMOS, PCI, and other single-ended and differential signaling standards. This versatility enables seamless integration with diverse system components and peripherals.
Embedded Memory Resources
Designers benefit from dual memory architectures: distributed RAM integrated within CLBs for small, fast storage requirements, and dedicated block RAM modules for larger data buffering needs. This dual-memory approach optimizes resource utilization and system performance.
Applications of XC2S200-6FGG994C FPGA
Telecommunications and Networking
The XC2S200-6FGG994C serves as an excellent platform for implementing communication protocols, network routers, data packet processing, and signal modulation/demodulation systems. Its high gate count and processing speed make it suitable for demanding telecom applications.
Industrial Automation and Control
Manufacturing facilities leverage this FPGA for motor control systems, process automation, programmable logic controllers (PLCs), and real-time monitoring applications. The device’s reliability and reconfigurability support flexible industrial solutions.
Consumer Electronics Development
Product designers utilize the XC2S200-6FGG994C in digital cameras, set-top boxes, gaming consoles, and multimedia processing devices where complex digital signal processing and interface management are essential.
Embedded Systems and IoT
The FPGA’s moderate power consumption and high integration make it ideal for embedded applications, including medical devices, automotive electronics, security systems, and Internet of Things (IoT) gateway devices.
Design Advantages and Benefits
Cost-Effective ASIC Alternative
The XC2S200-6FGG994C eliminates the substantial non-recurring engineering (NRE) costs associated with ASIC development. Designers can implement, test, and modify their designs rapidly without expensive mask sets or lengthy fabrication cycles.
Field Reconfigurability
Unlike fixed-function ASICs, this FPGA supports in-system programming and reconfiguration, allowing firmware updates, feature additions, and bug fixes after deployment. This capability significantly extends product lifecycles and reduces maintenance costs.
Rapid Prototyping and Time-to-Market
Development teams can iterate designs quickly using modern FPGA design tools like Xilinx ISE or Vivado. The ability to test and validate designs in actual hardware accelerates development cycles and reduces time-to-market.
Scalable Design Platform
Projects can start with the XC2S200 and scale to larger devices within the Spartan-II family (XC2S50, XC2S100, XC2S150) or migrate to newer Spartan generations as requirements evolve, protecting design investments.
Programming and Development Tools
Xilinx Design Software
The XC2S200-6FGG994C is fully supported by Xilinx’s comprehensive development suite, including ISE Design Suite for legacy projects and Vivado Design Suite for modern workflows. These tools provide synthesis, implementation, simulation, and debugging capabilities.
HDL Support
Designers can implement logic using industry-standard hardware description languages (HDLs) including VHDL, Verilog, and SystemVerilog. The tools also support schematic capture and high-level synthesis from C/C++ code.
Configuration Methods
Multiple configuration options include:
- JTAG boundary scan for development and debugging
- Serial peripheral interface (SPI) flash programming
- Parallel flash configuration
- Microprocessor-based configuration for dynamic reconfiguration
Comparison with Alternative Spartan-II Devices
| Device Model |
System Gates |
Logic Cells |
Block RAM |
Max I/O |
Best For |
| XC2S50 |
50,000 |
1,728 |
32 Kbits |
176 |
Low-complexity designs |
| XC2S100 |
100,000 |
2,700 |
40 Kbits |
176 |
Medium-scale applications |
| XC2S200 |
200,000 |
5,292 |
56 Kbits |
284 |
High-density projects |
| XC2S150 |
150,000 |
3,888 |
48 Kbits |
260 |
Balanced performance |
Power Consumption and Thermal Management
Operating Power Requirements
The XC2S200-6FGG994C operates at a core voltage of 2.5V with I/O voltages configurable from 1.8V to 3.3V depending on the selected I/O standard. Power consumption varies based on design complexity, operating frequency, and resource utilization.
Thermal Considerations
Proper thermal management ensures reliable operation within the commercial temperature range. Consider heat sink solutions and adequate airflow for designs operating at maximum frequency or utilizing significant portions of the available logic resources.
Quality and Reliability Standards
Manufacturing Excellence
AMD Xilinx manufactures the XC2S200-6FGG994C using advanced 0.18-micron CMOS process technology in certified production facilities. The devices undergo rigorous testing including functional testing, burn-in procedures, and quality assurance protocols.
Industry Certifications
The Spartan-II family meets international standards for electronic components and is suitable for applications requiring compliance with RoHS (Restriction of Hazardous Substances) directives when selecting lead-free package options.
Procurement and Supply Chain Information
Availability and Lead Times
The XC2S200-6FGG994C is available through authorized distributors and electronic component suppliers worldwide. Stock availability may vary, and customers should verify current inventory levels for time-sensitive projects.
Volume Pricing
Quantity discounts are typically available for production volumes. Contact authorized distributors for current pricing information and minimum order quantities.
Package Handling Precautions
As a moisture-sensitive device (typically MSL 3), proper storage in moisture-barrier bags with desiccant and baking procedures before assembly are essential to prevent solder joint defects during reflow processes.
Getting Started with XC2S200-6FGG994C
Development Board Options
Several third-party manufacturers offer development boards featuring Spartan-II FPGAs, providing convenient platforms for prototyping and learning. These boards typically include programming interfaces, I/O connectors, and example designs.
Technical Resources
Comprehensive documentation is available including:
- Complete datasheet with electrical specifications
- User guides covering architecture and features
- Application notes for specific use cases
- Reference designs and example projects
For more information about Xilinx FPGA solutions and related products, visit comprehensive resources that cover the entire AMD Xilinx FPGA portfolio.
Conclusion: Why Choose XC2S200-6FGG994C
The XC2S200-6FGG994C FPGA delivers an exceptional balance of performance, flexibility, and cost-effectiveness for digital design projects requiring substantial logic resources and high-speed processing capabilities. Its proven Spartan-II architecture, combined with modern development tools and comprehensive support, makes it an excellent choice for telecommunications, industrial, consumer, and embedded applications.
Whether you’re developing communication systems, implementing complex control algorithms, or creating innovative consumer electronics, the XC2S200-6FGG994C provides the programmable logic resources and performance characteristics needed for successful product development.
