The XC2S200-6FGG993C is a powerful field-programmable gate array (FPGA) from Xilinx’s renowned Spartan-II family, offering exceptional performance and versatility for demanding industrial applications. This commercial-grade FPGA combines 200,000 system gates with advanced programmable logic capabilities in a compact 993-ball fine-pitch BGA package.
Product Overview: XC2S200-6FGG993C Specifications
The XC2S200-6FGG993C represents a cost-effective solution for engineers seeking high-density programmable logic without compromising on performance or reliability. As part of the Spartan-II family, this FPGA delivers superior functionality at a competitive price point.
Key Features of XC2S200-6FGG993C
| Feature |
Specification |
| Part Number |
XC2S200-6FGG993C |
| Family |
Spartan-II FPGA |
| Logic Cells |
5,292 |
| System Gates |
200,000 (Logic and RAM) |
| Speed Grade |
-6 (Commercial Range Exclusive) |
| Package Type |
FGG993 (993-ball Fine-Pitch BGA) |
| Operating Voltage |
2.5V |
| Temperature Range |
Commercial (0°C to +85°C) |
| Technology |
0.18μm Process |
Technical Specifications and Architecture
Core Logic Resources
The XC2S200-6FGG993C features a robust CLB (Configurable Logic Block) array configuration that enables complex digital designs:
| Resource Type |
XC2S200-6FGG993C Capacity |
| CLB Array Configuration |
28 × 42 |
| Total CLBs |
1,176 |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits |
| Maximum User I/O |
284 pins (varies by package) |
| DLL (Delay-Locked Loops) |
4 (one per corner) |
Performance Characteristics
The -6 speed grade designation indicates this FPGA operates at commercial temperature ranges with optimized performance characteristics:
- Maximum System Performance: Up to 200 MHz
- Internal Clock Speed: 263 MHz (maximum)
- Advanced Routing Architecture: Hierarchical interconnect structure
- Low Power Consumption: 2.5V core voltage operation
Package Details: FGG993 Ball Grid Array
FGG993 Package Specifications
| Package Parameter |
Specification |
| Package Type |
Fine-Pitch Ball Grid Array (FBGA) |
| Total Balls |
993 |
| Ball Pitch |
Fine-pitch configuration |
| RoHS Compliance |
“G” designation indicates lead-free package |
| MSL Rating |
Moisture Sensitivity Level 3 |
| Mounting Type |
Surface Mount Technology (SMT) |
The FGG993 package provides maximum I/O density while maintaining thermal performance, making the XC2S200-6FGG993C ideal for space-constrained applications requiring extensive connectivity.
Applications and Use Cases
Industrial Applications
The XC2S200-6FGG993C excels in various industrial and commercial applications:
- Digital Signal Processing (DSP) implementations
- Industrial automation and control systems
- High-speed data acquisition systems
- Communication protocol conversion
- Motor control applications
- Embedded system development
- Custom computing accelerators
- Test and measurement equipment
Advantages Over ASIC Solutions
This Xilinx FPGA provides significant advantages compared to mask-programmed ASICs:
- Zero NRE Costs: Eliminate expensive initial tooling and mask costs
- Rapid Prototyping: Immediate design iteration without fabrication delays
- Field Upgradability: Update functionality without hardware replacement
- Reduced Development Risk: Test and validate before committing to production
- Shorter Time-to-Market: Deploy products faster than ASIC development cycles
Memory Architecture and Resources
Dual Memory System
| Memory Type |
Capacity |
Configuration |
| Distributed RAM |
75,264 bits |
Integrated within CLBs for high-speed access |
| Block RAM |
56K bits |
Dual-port synchronous RAM blocks |
| Total Memory |
131,264 bits |
Flexible allocation for various applications |
The XC2S200-6FGG993C’s dual memory architecture provides designers with flexibility to optimize between distributed memory for small, fast storage and block RAM for larger data buffers.
Design Tools and Development Support
Compatible Development Environments
Engineers working with the XC2S200-6FGG993C can utilize:
- Xilinx ISE Design Suite: Complete FPGA design flow
- Vivado Design Suite: Advanced design implementation (legacy support)
- VHDL and Verilog: Industry-standard HDL support
- IP Core Integration: Extensive library of pre-verified IP blocks
- JTAG Programming: Standard boundary-scan configuration interface
I/O Capabilities and Interface Standards
Flexible I/O Configuration
The XC2S200-6FGG993C supports multiple I/O standards:
| I/O Standard |
Voltage Level |
Application |
| LVTTL |
3.3V |
General-purpose logic |
| LVCMOS |
2.5V/3.3V |
Low-voltage CMOS |
| PCI |
3.3V |
PCI bus interface |
| GTL/GTL+ |
Variable |
High-speed backplane |
Special I/O Features
- 4 Global Clock Input Pins: Dedicated low-skew clock distribution
- Programmable Slew Rate: Control signal edge rates
- Input/Output Blocks (IOBs): Configurable registered or combinatorial
- Tri-state Capability: Bidirectional bus support
- Pull-up/Pull-down Resistors: Configurable I/O termination
Speed Grade Comparison
Understanding the -6 Speed Grade
| Speed Grade |
Performance Level |
Temperature Range |
Availability |
| -4 |
Standard |
Commercial/Industrial |
Wide availability |
| -5 |
Enhanced |
Commercial/Industrial |
Standard offering |
| -6 |
Highest |
Commercial only |
Premium performance |
The -6 speed grade in the XC2S200-6FGG993C designation indicates the highest performance tier available exclusively for commercial temperature applications (0°C to +85°C).
Quality and Reliability
Manufacturing Standards
| Quality Parameter |
Specification |
| Manufacturing Process |
0.18μm CMOS technology |
| Package Material |
Lead-free (RoHS compliant) |
| Quality Grade |
Commercial |
| MTBF Rating |
High-reliability design |
| ESD Protection |
Built-in protection circuitry |
Configuration and Programming
Programming Options
The XC2S200-6FGG993C supports multiple configuration methods:
- Master Serial Mode: FPGA controls external PROM
- Slave Serial Mode: External controller provides bitstream
- JTAG Mode: Boundary-scan configuration
- SelectMAP Mode: Parallel configuration for fast programming
Configuration Memory
| Configuration Aspect |
Detail |
| Bitstream Size |
Varies by design utilization |
| Configuration Time |
Milliseconds (mode dependent) |
| Reconfiguration |
Unlimited reprogramming cycles |
| Partial Reconfiguration |
Not supported (full device only) |
Power Consumption Characteristics
Power Specifications
| Power Parameter |
Typical Value |
Notes |
| Core Voltage (VCCINT) |
2.5V |
Internal logic supply |
| I/O Voltage (VCCIO) |
2.5V – 3.3V |
Bank-dependent configuration |
| Standby Current |
Low |
Design-dependent |
| Dynamic Power |
Variable |
Clock frequency and utilization dependent |
Ordering Information Breakdown
Part Number Decoding: XC2S200-6FGG993C
Breaking down the part number:
- XC2S = Spartan-II family identifier
- 200 = 200K system gates (device size)
- -6 = Speed grade (highest commercial performance)
- FG = Fine-pitch Ball Grid Array package
- G = Lead-free (RoHS compliant) designation
- 993 = 993-ball package variant
- C = Commercial temperature range (0°C to +85°C)
Comparison with Spartan-II Family Members
Device Selection Guide
| Device |
Logic Cells |
System Gates |
CLBs |
Max I/O |
Block RAM |
Best For |
| XC2S15 |
432 |
15,000 |
96 |
86 |
16K |
Entry-level projects |
| XC2S50 |
1,728 |
50,000 |
384 |
176 |
32K |
Small to medium designs |
| XC2S100 |
2,700 |
100,000 |
600 |
176 |
40K |
Medium complexity |
| XC2S150 |
3,888 |
150,000 |
864 |
260 |
48K |
Complex applications |
| XC2S200 |
5,292 |
200,000 |
1,176 |
284 |
56K |
High-density requirements |
Design Considerations
Thermal Management
Proper thermal design is crucial for the XC2S200-6FGG993C:
- Junction Temperature: Monitor under full load conditions
- Package Theta-JA: Consider for heatsink selection
- Airflow Requirements: Ensure adequate cooling in confined spaces
- Thermal Simulation: Recommended for high-utilization designs
PCB Layout Guidelines
| Design Aspect |
Recommendation |
| Decoupling Capacitors |
Multiple 0.1μF ceramics per power bank |
| Power Plane Design |
Separate analog and digital grounds |
| Signal Integrity |
Controlled impedance for high-speed signals |
| Via Placement |
Minimize via count in BGA fanout |
Legacy Product Status and Availability
Product Lifecycle
While the Spartan-II family is considered a mature product line, the XC2S200-6FGG993C remains available through authorized distributors and component suppliers for:
- Legacy system support and maintenance
- Proven design continuity
- Cost-sensitive applications
- Replacement and repair services
Engineers are encouraged to verify current availability for new designs and consider migration paths to newer FPGA families for long-term projects.
Documentation and Support Resources
Available Documentation
Technical resources for the XC2S200-6FGG993C include:
- Datasheet (DS001): Complete electrical and timing specifications
- User Guide: Architecture overview and design guidelines
- Application Notes: Design implementation best practices
- Package Drawings: Mechanical specifications and PCB footprints
- Pinout Files: For CAD and design tools
Conclusion: Why Choose XC2S200-6FGG993C
The XC2S200-6FGG993C delivers exceptional value for engineers requiring a proven, high-performance FPGA solution. With 200,000 system gates, 5,292 logic cells, and the premium -6 speed grade, this device offers the performance headroom needed for demanding applications while maintaining cost-effectiveness.
Key selection advantages include:
- Proven reliability in commercial applications
- Maximum I/O density with 993-ball package
- Highest speed grade for time-critical designs
- Comprehensive development tool support
- Cost-effective alternative to ASIC development
Whether implementing complex digital logic, signal processing algorithms, or custom control systems, the XC2S200-6FGG993C provides the resources and performance necessary for successful project outcomes.
