The XC2S200-6FGG992C is a premium field-programmable gate array (FPGA) from Xilinx’s renowned Spartan-II family, delivering exceptional performance and flexibility for complex digital design applications. This powerful FPGA combines 200,000 system gates with 5,292 logic cells in a compact 992-ball fine-pitch BGA package, making it an ideal solution for high-volume production environments.
Overview of XC2S200-6FGG992C FPGA Specifications
The XC2S200-6FGG992C represents the pinnacle of the Spartan-II series, offering designers a cost-effective alternative to custom ASICs without sacrificing performance. As part of the Xilinx FPGA product portfolio, this device delivers superior programmability and design flexibility for demanding applications.
Key Technical Specifications
| Specification |
Value |
| Device Family |
Spartan-II |
| Part Number |
XC2S200-6FGG992C |
| Logic Cells |
5,292 |
| System Gates |
200,000 |
| CLB Array |
28 x 42 (1,176 total CLBs) |
| Maximum User I/O |
284 pins |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits |
| Speed Grade |
-6 (fastest) |
| Operating Voltage |
2.5V |
| Package Type |
FGG992 (992-ball Fine-Pitch BGA) |
| Temperature Range |
Commercial (0°C to +85°C) |
Core Features and Capabilities
Advanced Logic Architecture
The XC2S200-6FGG992C FPGA features a robust architecture designed for maximum performance:
- 28 x 42 CLB Array: Provides 1,176 configurable logic blocks for complex digital implementations
- Maximum Operating Frequency: Up to 200 MHz system performance
- Process Technology: Advanced 0.18μm CMOS technology
- Four Delay-Locked Loops (DLLs): Positioned at each corner for precise clock management
- Dual Block RAM Columns: Strategic placement for optimized data access
Memory Resources
| Memory Type |
Capacity |
Application |
| Distributed RAM |
75,264 bits |
Fast, distributed storage within CLBs |
| Block RAM |
56K bits |
Dedicated memory blocks for data buffering |
| Total RAM |
131,264 bits |
Combined memory resources |
Package Information: FGG992 Fine-Pitch BGA
FGG992 Package Advantages
The 992-ball fine-pitch ball grid array (FPGA) package offers several distinct benefits:
- High I/O Density: Maximizes pin count in minimal footprint
- Superior Electrical Performance: Reduced inductance and improved signal integrity
- Enhanced Thermal Management: Better heat dissipation for reliable operation
- PCB Space Efficiency: Compact design for space-constrained applications
Pin Configuration Details
| Feature |
Specification |
| Total Balls |
992 |
| User I/O Pins |
284 maximum |
| Ground Pins |
Multiple for optimal grounding |
| Power Pins |
Distributed for stable power delivery |
| Special Function Pins |
4 global clock inputs |
Speed Grade -6: Performance Analysis
What Does Speed Grade -6 Mean?
The -6 speed grade designation indicates this is the fastest commercial-grade variant of the XC2S200 FPGA. This speed grade delivers:
- Minimum Propagation Delays: Fastest signal routing through the device
- Maximum Clock Frequencies: Optimal for high-speed digital designs
- Commercial Temperature Only: Exclusively available in 0°C to +85°C range
- Performance-Critical Applications: Ideal for timing-sensitive designs
Performance Comparison
| Speed Grade |
Relative Performance |
Availability |
| -6 (This Device) |
Fastest |
Commercial temp only |
| -5 |
Standard |
Commercial & Industrial |
| -4 |
Economy |
Commercial & Industrial |
Applications and Use Cases
Ideal Applications for XC2S200-6FGG992C
This high-performance FPGA excels in numerous applications:
Communications Systems
- High-speed data routing and switching
- Protocol conversion and bridging
- Network processing equipment
- Telecommunications infrastructure
Industrial Control
- Motor control systems
- Process automation
- Programmable logic controllers (PLCs)
- Real-time monitoring systems
Consumer Electronics
- Video processing and display controllers
- Audio/video equipment
- Gaming systems
- Set-top boxes
Medical Devices
- Medical imaging equipment
- Patient monitoring systems
- Diagnostic instruments
- Laboratory automation
Technical Advantages Over Mask-Programmed ASICs
Why Choose FPGA Technology?
| FPGA Advantage |
ASIC Limitation |
| Zero NRE Costs |
High initial development costs |
| Rapid Time-to-Market |
Lengthy development cycles (months) |
| Design Flexibility |
Fixed functionality after fabrication |
| Field Upgradeable |
Hardware replacement required for changes |
| Lower Risk |
High risk if design flaws discovered |
| Prototyping Friendly |
Expensive prototype iterations |
Design Tools and Development Support
Compatible Design Software
The XC2S200-6FGG992C is supported by industry-standard Xilinx development tools:
- ISE Design Suite: Legacy tool for Spartan-II development
- Webpack (Free Version): Cost-effective entry point for designers
- Impact Programming Tool: Device configuration and programming
- ChipScope Pro: Real-time in-system debugging
Programming and Configuration
| Configuration Method |
Description |
| JTAG Boundary Scan |
IEEE 1149.1 compliant programming |
| Master Serial Mode |
Boot from external PROM |
| Slave Serial Mode |
Configuration via external controller |
| SelectMAP Mode |
Parallel configuration interface |
Ordering Information Decoded
Understanding Part Number: XC2S200-6FGG992C
Breaking down the complete part number:
- XC2S200: Device family and gate count (200K gates)
- -6: Speed grade (fastest commercial)
- FGG: Package type (Fine-pitch Ball Grid Array, Green/Pb-free)
- 992: Ball count (992 balls)
- C: Temperature range (Commercial: 0°C to +85°C)
Package Variants Available
| Package Code |
Ball/Pin Count |
Package Type |
| FGG992 |
992 |
Fine-Pitch BGA (This model) |
| FGG456 |
456 |
Fine-Pitch BGA |
| FGG256 |
256 |
Fine-Pitch BGA |
| PQG208 |
208 |
Plastic Quad Flat Pack |
Quality and Reliability Standards
Manufacturing Excellence
The XC2S200-6FGG992C meets rigorous quality standards:
- RoHS Compliant: Lead-free (indicated by “G” in package code)
- Industrial-Grade Manufacturing: Xilinx quality assurance processes
- Tested and Validated: 100% factory tested before shipment
- Traceability: Lot code and date code marking for tracking
Reliability Specifications
| Parameter |
Specification |
| MTBF |
>1,000,000 hours |
| Junction Temperature |
Up to 125°C maximum |
| Storage Temperature |
-65°C to +150°C |
| Moisture Sensitivity Level |
MSL 3 |
Power Consumption and Thermal Management
Power Supply Requirements
| Power Rail |
Voltage |
Tolerance |
Purpose |
| VCCINT |
2.5V |
±5% |
Core logic |
| VCCO |
1.5V to 3.3V |
±5% |
I/O banks |
Thermal Considerations
- Junction Temperature (TJ): Monitor and maintain within specifications
- Theta-JA: Package thermal resistance affects cooling requirements
- Heat Sink Recommendations: May be required for high-utilization designs
- Airflow Requirements: Consider forced-air cooling for maximum performance
Getting Started with XC2S200-6FGG992C
Development Workflow
- Design Entry: Create HDL code (Verilog/VHDL) or schematic
- Synthesis: Convert design to gate-level netlist
- Implementation: Place and route design within FPGA
- Simulation: Verify functionality and timing
- Programming: Download bitstream to device
- Testing: Validate in-system operation
Design Resources
- Comprehensive datasheets and technical documentation
- Reference designs and application notes
- Online community support forums
- Technical support from Xilinx/AMD
Frequently Asked Questions
Is the XC2S200-6FGG992C suitable for new designs?
While the Spartan-II family is a mature product line, it remains viable for cost-sensitive applications. For new high-performance designs, consider newer Xilinx families like Artix-7 or Spartan-7.
What is the difference between FGG and FG packages?
FGG packages are the lead-free (RoHS compliant) version, indicated by the extra “G” in the package code. FG packages may contain lead.
Can I upgrade from a smaller Spartan-II device?
Yes, the Spartan-II family offers pin-compatible migration paths between devices in the same package, allowing easy scalability.
Conclusion: Why Choose XC2S200-6FGG992C?
The XC2S200-6FGG992C FPGA delivers an exceptional combination of performance, flexibility, and value for digital design applications. With 200,000 system gates, the fastest -6 speed grade, and 284 user I/O pins in a compact 992-ball BGA package, this Spartan-II device provides everything needed for demanding embedded systems, communications equipment, and industrial control applications.
Whether you’re replacing costly ASICs, accelerating time-to-market, or requiring field-upgradeable logic, the XC2S200-6FGG992C offers proven reliability backed by Xilinx’s industry-leading FPGA technology.
