Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG991C: High-Performance Spartan-II FPGA for Advanced Digital Design

Product Details

Overview of XC2S200-6FGG991C FPGA

The XC2S200-6FGG991C is a powerful Field Programmable Gate Array (FPGA) from AMD Xilinx’s renowned Spartan-II family. This high-performance programmable logic device delivers exceptional flexibility and processing capabilities for complex digital applications. Featuring 200,000 system gates and 5,292 logic cells, the XC2S200-6FGG991C represents a cost-effective solution for engineers seeking reliable FPGA performance in commercial and industrial applications.

As part of the Spartan-II series, this Xilinx FPGA combines advanced architecture with proven reliability, making it an ideal choice for telecommunications, industrial automation, embedded systems, and signal processing applications.

Key Technical Specifications

Core Features and Performance

Specification Details
Logic Cells 5,292
System Gates 200,000 (Logic and RAM)
CLB Array 28 x 42 (1,176 Total CLBs)
Maximum User I/O 284 pins
Speed Grade -6 (High Performance)
Operating Voltage 2.5V
Technology Node 0.18 µm

Memory Architecture

Memory Type Capacity
Total Distributed RAM 75,264 bits
Total Block RAM 56 Kbits (56,000 bits)
Block RAM Configuration Dual-port, synchronous

Package and Operating Conditions

Parameter Specification
Package Type FGG (Fine-Pitch Ball Grid Array)
Temperature Range Commercial (0°C to +85°C)
Lead-Free Option Available (G designation)
Configuration SRAM-based, reprogrammable

Architecture and Design Features

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG991C features a robust array of 1,176 Configurable Logic Blocks arranged in a 28 x 42 matrix. Each CLB contains:

  • Look-Up Tables (LUTs): 4-input function generators for implementing combinational logic
  • Flip-Flops: Dual flip-flops per CLB for sequential logic implementation
  • Dedicated Carry Logic: Fast arithmetic operations support
  • Multiplexers: Flexible routing and data selection

Input/Output Block (IOB) Capabilities

With up to 284 user-configurable I/O pins, the XC2S200-6FGG991C offers:

  • Multiple I/O standards support (LVTTL, LVCMOS, PCI, GTL+)
  • Programmable slew rate control
  • Individual tri-state capability
  • Integrated pull-up/pull-down resistors
  • 5V tolerance with series resistor configuration

Memory Resources

The dual-column Block RAM architecture provides high-speed embedded memory for buffering, FIFO implementation, and data storage applications. The distributed RAM capability allows designers to implement small memory arrays directly within CLBs.

Performance Characteristics

Speed Grade -6 Advantages

The -6 speed grade designation indicates this is the highest performance variant in the XC2S200 family, offering:

  • Maximum operating frequency: Up to 263 MHz
  • Faster propagation delays
  • Reduced setup and hold times
  • Enhanced timing closure for demanding applications
  • Commercial temperature range optimization

Clock Management

The XC2S200-6FGG991C includes four Delay-Locked Loops (DLLs), one positioned at each corner of the die:

  • Clock de-skewing and distribution
  • Frequency synthesis capabilities
  • Phase shifting functionality
  • Duty-cycle correction

Application Areas

Telecommunications Systems

The XC2S200-6FGG991C excels in telecommunications applications requiring:

  • Protocol implementation (Ethernet, USB, serial)
  • Data encoding/decoding
  • Channel coding and error correction
  • Baseband signal processing

Industrial Automation and Control

Ideal for industrial environments where the FPGA provides:

  • Motor control algorithms
  • PLC functionality
  • Sensor interface and data acquisition
  • Real-time process control

Digital Signal Processing (DSP)

The extensive logic resources support DSP applications including:

  • Digital filter implementation
  • FFT/IFFT processing
  • Audio/video signal processing
  • Image processing algorithms

Embedded Systems Design

Perfect for embedded applications requiring:

  • Custom peripheral implementation
  • SoC prototyping
  • Hardware acceleration
  • Interface bridging

Design Tools and Support

Development Environment

The XC2S200-6FGG991C is supported by AMD Xilinx’s comprehensive design tools:

  • ISE Design Suite: Complete FPGA design flow
  • CORE Generator: IP core library access
  • ChipScope Pro: On-chip debugging
  • IMPACT: Configuration and programming utility

Configuration Options

Multiple configuration methods are supported:

  • JTAG boundary-scan programming
  • Master Serial mode
  • Slave Serial mode
  • Master SelectMAP mode
  • Slave SelectMAP mode

Competitive Advantages

Cost-Effective FPGA Solution

The Spartan-II family represents exceptional value:

  • Lower cost than mask-programmed ASICs
  • No NRE (Non-Recurring Engineering) costs
  • Instant design iteration capability
  • Field-upgradeable designs

Proven Reliability

With mature 0.18 µm technology:

  • Established manufacturing process
  • Extensive characterization data
  • Long-term availability
  • Wide temperature range support

Design Flexibility

Programmable architecture enables:

  • Rapid prototyping
  • Design modifications without hardware changes
  • Multiple product variants from single design
  • Future-proof solutions

Ordering Information and Part Number Breakdown

XC2S200-6FGG991C breakdown:

  • XC2S200: Device family and gate count (200K gates)
  • -6: Speed grade (highest performance)
  • FGG: Package type (Fine-pitch BGA, lead-free)
  • 991: Pin count
  • C: Commercial temperature range (0°C to +85°C)

Technical Comparison Table

XC2S200 vs. Other Spartan-II Devices

Device Logic Cells System Gates CLBs Max I/O Block RAM
XC2S50 1,728 50,000 384 176 32 Kbits
XC2S100 2,700 100,000 600 176 40 Kbits
XC2S150 3,888 150,000 864 260 48 Kbits
XC2S200 5,292 200,000 1,176 284 56 Kbits

Power Consumption Considerations

The XC2S200-6FGG991C operates at 2.5V core voltage, offering:

  • Lower power consumption than 3.3V alternatives
  • Efficient power distribution design
  • Multiple power management modes
  • Thermal management optimization

Quality and Standards Compliance

The XC2S200-6FGG991C meets rigorous industry standards:

  • RoHS compliant (lead-free option available)
  • JEDEC standards compliance
  • ISO 9001 manufacturing quality
  • Automotive-grade variants available

Getting Started with XC2S200-6FGG991C

Recommended Development Boards

Several evaluation platforms support the XC2S200:

  • Xilinx Spartan-II development kits
  • Third-party evaluation boards
  • Custom PCB designs

Design Resources

Engineers can access:

  • Complete datasheets and user guides
  • Reference designs and application notes
  • Technical support forums
  • Training materials and webinars

Conclusion

The XC2S200-6FGG991C represents a mature, reliable, and cost-effective FPGA solution for a wide range of digital design applications. With its substantial logic capacity of 200,000 system gates, high-performance -6 speed grade, and comprehensive I/O capabilities, this Spartan-II device delivers exceptional value for commercial applications in telecommunications, industrial control, signal processing, and embedded systems.

Whether you’re prototyping a new product, implementing custom logic functions, or seeking an alternative to ASIC development, the XC2S200-6FGG991C provides the flexibility, performance, and reliability your project demands.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.